摘要:
A capacitor disposed inside a multilayer substrate that includes a conductive pattern on a surface thereof and an anode portion having a first conductive metal member and a porous portion disposed on a surface of the first conductive metal member, a cathode portion, and a dielectric layer disposed between the anode portion and the cathode portion. Moreover, the anode portion is led out to a surface side of the multilayer substrate by a connection electrode including an alloy layer containing a metal forming the first conductive metal member and a conductive layer disposed on the alloy layer, and in which the connection electrode is connected to the conductive pattern formed on the surface of the multilayer substrate.
摘要:
An ultraviolet sensor that includes a p-type semiconductor layer principally composed of (Ni, Zn)O, an n-type semiconductor layer composed of ZnO which is joined to the p-type semiconductor layer, an internal electrode embedded in the p-type semiconductor layer, and first and second terminal electrodes formed at both ends of the p-type semiconductor layer. The surface roughness of the p-type semiconductor layer is 1.5 μm or less, and preferably 0.3 μm or more and 1.0 μm or less. In a manufacturing process, the formed product prior to firing and/or the p-type semiconductor layer after firing is polished by barrel polishing so that the surface roughness Ra thereof is 1.0 μm or less. Thereby, light absorption efficiency can be improved to directly detect a desired large photocurrent and secure high reliability, and a spectral property can be controlled to strongly respond to various wavelength bands of ultraviolet light.
摘要:
An ultraviolet sensor that includes a p-type semiconductor layer principally composed of (Ni, Zn)O, an n-type semiconductor layer composed of ZnO which is joined to the p-type semiconductor layer, an internal electrode embedded in the p-type semiconductor layer, and first and second terminal electrodes formed at both ends of the p-type semiconductor layer. The surface roughness of the p-type semiconductor layer is 1.5 μm or less, and preferably 0.3 μm or more and 1.0 μm or less. In a manufacturing process, the formed product prior to firing and/or the p-type semiconductor layer after firing is polished by barrel polishing so that the surface roughness Ra thereof is 1.0 μm or less. Thereby, light absorption efficiency can be improved to directly detect a desired large photocurrent and secure high reliability, and a spectral property can be controlled to strongly respond to various wavelength bands of ultraviolet light.
摘要:
An ultraviolet sensor has a p-type semiconductor layer composed of a solid solution of NiO and ZnO, and an n-type semiconductor layer composed of ZnO and joined to the p-type semiconductor layer such that a part of the surface of the p-type semiconductor layer is exposed. In the p-type semiconductor layer, trivalent Ni is contained in a crystal grain in a state of being solid-solved with the solid solution of NiO and ZnO. The trivalent Ni can be contained in the crystal grain of the p-type semiconductor layer by adding NiOOH to NiO and ZnO, and firing the resulting mixture. Thereby, an inexpensive ultraviolet sensor capable of being downsized, which can easily detect the intensity of ultraviolet light by a photovoltaic power without utilizing a peripheral circuit can be realized.
摘要:
An ultraviolet sensor has a p-type semiconductor layer composed of a solid solution of NiO and ZnO, and an n-type semiconductor layer composed of ZnO and joined to the p-type semiconductor layer such that a part of the surface of the p-type semiconductor layer is exposed. In the p-type semiconductor layer, trivalent Ni is contained in a crystal grain in a state of being solid-solved with the solid solution of NiO and ZnO. The trivalent Ni can be contained in the crystal grain of the p-type semiconductor layer by adding NiOOH to NiO and ZnO, and firing the resulting mixture. Thereby, an inexpensive ultraviolet sensor capable of being downsized, which can easily detect the intensity of ultraviolet light by a photovoltaic power without utilizing a peripheral circuit can be realized.
摘要:
A wing unit is used in a wing flapping apparatus to perform a swinging motion to thereby generate levitation force. The wing unit includes a nonwoven fabric that forms a wing surface; a frame body overlaid on the nonwoven fabric and extending along the wing surface; and a resin material disposed in a cavity included in the nonwoven fabric to integrate the nonwoven fabric and the frame body with each other. According to this configuration, a light-weight and high-strength wing unit that produces a suppressed wing flapping noise, a wing flapping apparatus including the wing unit, and a method of manufacturing the wing unit are provided.
摘要:
A wing flapping apparatus includes a motive power source; a power transmission mechanism; and a wing unit driven by the power transmission mechanism. The power transmission mechanism includes a rotation transmission member configured to rotate upon reception of motive power transmitted from the motive power source; a slider configured to linearly reciprocate in an X-axis direction upon reception of the motive power transmitted from the rotation transmission member and a rotating body configured to reciprocate in a rotation direction upon reception of the motive power transmitted from the slider. The wing unit is configured to swing such that its distal end moves approximately in the X-axis direction as the rotating body reciprocates in the rotation direction. The power transmission mechanism further includes a pair of crank arms each configured to connect the rotation transmission member and the slider. The pair of crank arms each has: one end rotatably connected to the rotation transmission member and the other end rotatably and slidably connected to the slider.
摘要:
An ultraviolet sensor having a p-type semiconductor layer containing, as its main constituent, a solid solution of NiO and ZnO, and an n-type semiconductor layer containing ZnO as its main constituent, which is joined to the p-type semiconductor layer such that a portion of the p-type semiconductor layer is exposed. An internal electrode is buried in the p-type semiconductor layer and opposed to the n-type semiconductor layer. Both ends of the internal electrode are exposed at both end surfaces of the p-type semiconductor layer, and first and second high-resistance layers composed of insulating materials cover one end of the internal electrode. The second high-resistance layer is obtained by diffusion of the insulating material from the first high-resistance layer into the p-type semiconductor layer. A first external electrode is connected to the other end of the internal electrode, and a second external electrode is connected to the n-type semiconductor layer.
摘要:
An ultraviolet sensor having a p-type semiconductor layer containing, as its main constituent, a solid solution of NiO and ZnO, and an n-type semiconductor layer containing ZnO as its main constituent, which is joined to the p-type semiconductor layer such that a portion of the p-type semiconductor layer is exposed. An internal electrode is buried in the p-type semiconductor layer and opposed to the n-type semiconductor layer. Both ends of the internal electrode are exposed at both end surfaces of the p-type semiconductor layer, and first and second high-resistance layers composed of insulating materials cover one end of the internal electrode. The second high-resistance layer is obtained by diffusion of the insulating material from the first high-resistance layer into the p-type semiconductor layer. A first external electrode is connected to the other end of the internal electrode, and a second external electrode is connected to the n-type semiconductor layer.
摘要:
A wing unit is used in a wing flapping apparatus to perform a swinging motion to thereby generate levitation force. The wing unit includes a nonwoven fabric that forms a wing surface; a frame body overlaid on the nonwoven fabric and extending along the wing surface; and a resin material disposed in a cavity included in the nonwoven fabric to integrate the nonwoven fabric and the frame body with each other. According to this configuration, a light-weight and high-strength wing unit that produces a suppressed wing flapping noise, a wing flapping apparatus including the wing unit, and a method of manufacturing the wing unit are provided.