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公开(公告)号：US10650974B2
公开(公告)日：2020-05-12
申请号：US15916386
申请日：2018-03-09
发明人： Kohei Shimada , Akio Masunari , Yuta Saito , Shunsuke Abe , Tomoo Yuguchi
摘要： A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 μm from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 μm or more and about 10.000 μm or less.
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公开(公告)号：US09236187B2
公开(公告)日：2016-01-12
申请号：US14621450
申请日：2015-02-13
发明人： Hiroyuki Wada , Kohei Shimada , Kenji Takagi , Tomomi Koga , Tomotaka Hirata , Hitoshi Nishimura , Hiroki Awata , Sui Uno
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/1209 , H01G4/1227 , H01G4/1245 , H01G4/224 , H01G4/248
摘要： A multilayer ceramic capacitor includes a ceramic main body including an inner layer portion including third ceramic layers and a plurality of inner electrodes arranged at interfaces between the third ceramic layers, and first and second outer layer portions respectively including first and second ceramic layers, the first and second ceramic layers being arranged vertically so as to sandwich the inner layer portion. The third ceramic layers and the first and second outer layer portions contain a perovskite-type compound represented by ABO3 where A contains one or more of Ba, Sr, and Ca, B contains one or more of Ti, Zr, and Hf, and O represents oxygen) as a main component. Where a rare-earth element concentration (CR) in the third ceramic layers is compared to a rare-earth element concentration (Cr) in outermost layer portions including at least outermost surfaces of the first and second outer layer portions, CR>Cr (inclusive of Cr=0).
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公开(公告)号：US10062509B2
公开(公告)日：2018-08-28
申请号：US15372905
申请日：2016-12-08
发明人： Kohei Shimada
IPC分类号： C04B35/468 , H01G4/12 , C04B35/64 , H01G4/008 , H01G4/248 , H01G4/30 , H01G4/005 , H01G4/232
CPC分类号： H01G4/1227 , C04B35/4682 , C04B35/64 , C04B2235/3206 , C04B2235/3208 , C04B2235/3215 , C04B2235/3224 , C04B2235/3236 , C04B2235/3244 , C04B2235/3262 , C04B2235/3293 , C04B2235/3418 , C04B2235/3436 , C04B2235/6584 , C04B2235/768 , C04B2235/79 , C04B2235/81 , H01G4/005 , H01G4/008 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/308
摘要： A multilayer ceramic capacitor that includes a laminated body having a plurality of ceramic layers including crystal grains that have a perovskite structure, and a plurality of internal electrode layers; and external electrodes on first and second end surfaces of the laminated body and electrically connected to respective sets of the plurality of internal electrodes. In the ceramic layers, when the content of Ti is 100 parts by mol, the ceramic layers contain Ca at 0.10 to 15.00 parts by mol; Mg at 0.0010 to 0.0097 parts by mol; R at 0.50 to 4.00 parts by mol; M at 0.10 to 2.00 parts by mol; and Si at 0.50 to 2.00 parts by mol, and core parts of the crystal grains contain Ca.
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公开(公告)号：US10026552B2
公开(公告)日：2018-07-17
申请号：US15372905
申请日：2016-12-08
发明人： Kohei Shimada
IPC分类号： C04B35/468 , H01G4/12 , C04B35/64 , H01G4/008 , H01G4/248 , H01G4/30 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic capacitor that includes a laminated body having a plurality of ceramic layers including crystal grains that have a perovskite structure, and a plurality of internal electrode layers; and external electrodes on first and second end surfaces of the laminated body and electrically connected to respective sets of the plurality of internal electrodes. In the ceramic layers, when the content of Ti is 100 parts by mol, the ceramic layers contain Ca at 0.10 to 15.00 parts by mol; Mg at 0.0010 to 0.0097 parts by mol; R at 0.50 to 4.00 parts by mol; M at 0.10 to 2.00 parts by mol; and Si at 0.50 to 2.00 parts by mol, and core parts of the crystal grains contain Ca.
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公开(公告)号：US10060852B2
公开(公告)日：2018-08-28
申请号：US14851323
申请日：2015-09-11
发明人： Kohei Shimada
IPC分类号： H01G4/30 , G01N21/64 , H01C1/04 , H01G2/24 , H01G4/224 , H01G4/012 , G01N21/84 , H01G4/236 , H01G4/12
CPC分类号： G01N21/64 , G01N21/8422 , G01N2021/8438 , G01N2201/061 , H01C1/04 , H01G2/24 , H01G4/012 , H01G4/12 , H01G4/1209 , H01G4/224 , H01G4/236 , H01G4/30
摘要： A multilayer ceramic capacitor includes a laminated body including laminated ceramic layers, and first and second internal electrodes extending along interfaces between the ceramic layers. External electrodes are located on outer surfaces of the laminated body. Phosphor is disposed on portions of outer surfaces of the laminated body containing no external electrodes.
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公开(公告)号：US10037851B2
公开(公告)日：2018-07-31
申请号：US15410928
申请日：2017-01-20
发明人： Hiroyuki Wada , Kohei Shimada , Kenji Takagi , Tomomi Koga , Tomotaka Hirata , Hitoshi Nishimura , Hiroki Awata , Sui Uno
IPC分类号： H01G4/30 , H01G2/24 , H01G4/12 , H01G4/224 , H01G4/012 , H01G4/242 , H05K1/18 , H05K3/30 , H01G4/232 , H01G4/248
CPC分类号： H01G4/30 , H01G2/24 , H01G4/012 , H01G4/12 , H01G4/1209 , H01G4/1227 , H01G4/1236 , H01G4/1245 , H01G4/224 , H01G4/232 , H01G4/242 , H01G4/248 , H05K1/181 , H05K3/30 , H05K2201/10015
摘要： A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO3. The outer layer portions include first outer layers and second outer layers respectively containing oxides that differ from each other in main constituents, and boundary reaction layers are provided between the first outer layers and the second outer layers. First ceramic dielectric layers outside the boundary reaction layers differ in color from second ceramic dielectric layers inside the boundary reaction layers.
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7.发明授权公开(公告)号：US09536668B2
公开(公告)日：2017-01-03
申请号：US14948419
申请日：2015-11-23
发明人： Kohei Shimada , Katsuya Ishida
IPC分类号： H01G4/12 , C04B35/468 , H01G4/30 , H01G4/008 , H01G4/012
CPC分类号： H01G4/1227 , B32B18/00 , C04B35/4682 , C04B35/62685 , C04B35/634 , C04B35/638 , C04B2235/3206 , C04B2235/3208 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3244 , C04B2235/3418 , C04B2235/5445 , C04B2235/6021 , C04B2235/6582 , C04B2235/6584 , C04B2235/6588 , C04B2237/346 , C04B2237/68 , C04B2237/704 , H01G4/008 , H01G4/012 , H01G4/1245 , H01G4/30
摘要： A multilayer ceramic capacitor includes a multilayer body including dielectric ceramic layers and inner electrode layers containing Ni and electrically connected to outer electrodes. The dielectric ceramic layers contain a Ba- and Ti-containing perovskite compound, Ca, Mg, R (at least one rare earth metal selected from La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y), M (at least one selected from Zr, Mn, Co, Fe, Cr, Cu, Al, V, Mo, and W), and Si. The number of parts by mole of each element relative to Ti as 100 parts is as follows: Ca, approximately 0.10 to 5.00 parts; Mg, approximately 0.0010 to 0.0098 parts; R in total, approximately 0.50 to 4.00 parts; M in total, approximately 0.10 to 2.00 parts; and Si, approximately 0.5 to 2.0 parts.
摘要翻译： 多层陶瓷电容器包括：包含电介质陶瓷层和含有Ni并与外部电极电连接的内部电极层的多层体。 电介质陶瓷层含有含Ba和Ti的钙钛矿化合物Ca，Mg，R（至少一种选自La，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er的稀土金属 ，Tm，Yb，Lu和Y），M（选自Zr，Mn，Co，Fe，Cr，Cu，Al，V，Mo和W中的至少一种）和Si。 每个元素相对于Ti的摩尔数为100份如下：Ca约0.10-5.00份; Mg约0.0010〜0.0098份; R总计约0.50〜4.00份; 共计约0.10〜2.00份; 和Si，约0.5〜2.0份。
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公开(公告)号：US10405435B2
公开(公告)日：2019-09-03
申请号：US15669042
申请日：2017-08-04
发明人： Masahiro Wakashima , Yuta Saito , Kohei Shimada , Naobumi Ikegami
摘要： An electronic component is able to be mounted on a mounting substrate on which a first electronic component and a second electronic component are able to be mounted. When dimensions of the first electronic component and the second electronic component in a width direction is designated as W1 and W2, respectively, and dimensions of the first electronic component and the second electronic component in a length direction are designated as L1 and L2, respectively, dimensions of the electronic component in the width direction and the length direction are any one of combinations of W1 and L2, and of W2 and L1. The electronic component includes a third laminate and a pair of third external electrodes. Each of the pair of third external electrodes includes a fired layer, and a resin layer provided on an external surface of the fired layer.
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公开(公告)号：US10340083B2
公开(公告)日：2019-07-02
申请号：US15669044
申请日：2017-08-04
发明人： Masahiro Wakashima , Yuta Saito , Kohei Shimada , Naobumi Ikegami
摘要： An electronic component is able to be mounted on a mounting substrate including a pair of first edge portions that faces each other, and a pair of second edge portions that is perpendicular or substantially perpendicular to the pair of first edge portions and faces each other. The mounting substrate has a structure that allows at least any one of the electronic component, a first electronic component, and a second electronic component, to be mounted thereon. When a dimension of the first electronic component in a length direction is designated as L1, a dimension of the first electronic component in a width direction is designated as W1, a dimension of the second electronic component in the length direction is designated as L2, and a dimension of the second electronic component in the width direction is designated as W2, a dimension of the electronic component in the width direction is any one of W1 and W2. A dimension of the electronic component in the length direction is L2 when the dimension of the electronic component in the width direction is W1, and is L1 when the dimension of the electronic component in the width direction is W2.
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公开(公告)号：US10014114B2
公开(公告)日：2018-07-03
申请号：US15669038
申请日：2017-08-04
发明人： Masahiro Wakashima , Yuta Saito , Kohei Shimada , Naobumi Ikegami
CPC分类号： H01G4/38 , H01G2/06 , H01G4/012 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/308 , H05K1/0295 , H05K1/181 , H05K2201/10015 , H05K2201/10522 , Y02P70/611
摘要： A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as L1, a dimension of the first electronic component in its width direction is designated as W1, a dimension of the second electronic component in its length direction is designated as L2, and a dimension of the second electronic component in its width direction is designated as W2, a dimension of the third electronic component in its width direction is any one of W1 and W2, and a dimension of the third electronic component in its length direction is L2 when the dimension of the third electronic component in its width direction is W1, and is L1 when the dimension of the third electronic component in its width direction is W2. At least one or more of the third electronic components are mounted on the mounting substrate.
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