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公开(公告)号：US10748698B2
公开(公告)日：2020-08-18
申请号：US15673988
申请日：2017-08-10
发明人： Ryo Okura , Mizuho Katsuta , Kosuke Ishida
摘要： An electronic component having a main body includes a plurality of insulator layers laminated in a lamination direction. A primary coil is disposed in the main body and includes one or more primary coil conductor layers. A secondary coil is disposed in the main body and includes one or more secondary coil conductor layers. A tertiary coil is disposed in the main body and includes one or more tertiary coil conductor layers. The plurality of insulator layers includes a first insulator layer including a portion interposed between the primary coil conductor layer and the secondary coil conductor layer, a second insulator layer including a portion interposed between the secondary coil conductor layer and the tertiary coil conductor layer, and a third insulator layer including a portion interposed between the tertiary coil conductor layer and the primary coil conductor layer.
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公开(公告)号：US10116278B2
公开(公告)日：2018-10-30
申请号：US15401149
申请日：2017-01-09
发明人： Hayami Kudo , Kenji Nishiyama , Ryo Okura
摘要： An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.
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公开(公告)号：US11282623B2
公开(公告)日：2022-03-22
申请号：US16035150
申请日：2018-07-13
发明人： Ryo Okura , Yoichi Nakatsuji , Kosuke Ishida
摘要： A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.
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公开(公告)号：US10263590B2
公开(公告)日：2019-04-16
申请号：US15401169
申请日：2017-01-09
发明人： Ryo Okura , Hayami Kudo , Kenji Nishiyama
IPC分类号： H03H7/01 , H01F27/28 , H01F27/40 , H01G4/012 , H01G4/08 , H01G4/40 , H01G4/33 , H01F17/00 , H01G4/12 , H03H1/00
摘要： An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.
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公开(公告)号：US11227715B2
公开(公告)日：2022-01-18
申请号：US15293700
申请日：2016-10-14
发明人： Akinori Hamada , Hayami Kudo , Ryo Okura , Shinji Otani
摘要： An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.
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公开(公告)号：US11189416B2
公开(公告)日：2021-11-30
申请号：US15982991
申请日：2018-05-17
发明人： Yoichi Nakatsuji , Kosuke Ishida , Ryo Okura
IPC分类号： H01F27/29 , H01F27/28 , H01F27/24 , H01F27/32 , H01F17/00 , H01F17/04 , H01F41/04 , H01F19/04
摘要： A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.
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公开(公告)号：US10832855B2
公开(公告)日：2020-11-10
申请号：US15950601
申请日：2018-04-11
发明人： Ryo Okura , Hayami Kudo , Akinori Hamada
摘要： An electronic component comprising an element body including opposite first and second end surfaces, and an upper surface connecting the first and second end surfaces; a circuit element embedded in the element body; a first lead-out electrode embedded on the first end surface side and electrically connected to the circuit element; a columnar electrode arranged separately from the first lead-out electrode in a first direction viewed in a direction orthogonal to the first end surface, and embedded in the element body with a portion exposed from the first end surface to the upper surface; and a first via conductor connecting the first lead-out and columnar electrodes. An exposure width of the first via conductor, on the first end surface along a second direction orthogonal to the first direction viewed in the direction orthogonal to the first end surface, is smaller than the exposure width of the columnar electrode.
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