- 专利标题: Electronic component
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申请号: US15293700申请日: 2016-10-14
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公开(公告)号: US11227715B2公开(公告)日: 2022-01-18
- 发明人: Akinori Hamada , Hayami Kudo , Ryo Okura , Shinji Otani
- 申请人: MURATA MANUFACTURING CO., LTD.
- 申请人地址: JP Kyoto-fu
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto-fu
- 代理机构: Studebaker & Brackett PC
- 优先权: JPJP2014-115854 20140604
- 主分类号: H01F27/29
- IPC分类号: H01F27/29 ; H01F41/04 ; H01F17/00 ; H01F27/255 ; H01F41/02 ; H01F41/10 ; H05K3/32
摘要:
An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.
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