Invention Grant
- Patent Title: Electronic component
-
Application No.: US15401169Application Date: 2017-01-09
-
Publication No.: US10263590B2Publication Date: 2019-04-16
- Inventor: Ryo Okura , Hayami Kudo , Kenji Nishiyama
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP2016-021119 20160205
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01F27/28 ; H01F27/40 ; H01G4/012 ; H01G4/08 ; H01G4/40 ; H01G4/33 ; H01F17/00 ; H01G4/12 ; H03H1/00
![Electronic component](/abs-image/US/2019/04/16/US10263590B2/abs.jpg.150x150.jpg)
Abstract:
An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.
Public/Granted literature
- US20170230026A1 ELECTRONIC COMPONENT Public/Granted day:2017-08-10
Information query