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公开(公告)号：US10825610B2
公开(公告)日：2020-11-03
申请号：US15916727
申请日：2018-03-09
发明人： Hidehiko Tanaka , Toshikazu Makino , Shinji Otani
摘要： A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.
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公开(公告)号：US20180294099A1
公开(公告)日：2018-10-11
申请号：US15945774
申请日：2018-04-05
发明人： Toshikazu Makino , Hidehiko Tanaka
摘要： A multilayer ceramic capacitor that includes a multilayer body with dielectric layers and inner electrode layers and having a first main surface, a second main surface, a first side surface, a second side surface, a first end surface, and a second end surface; and an outer electrode on at least one of the end surfaces. The outer electrode includes a resistor layer on the at least one end surface of the multilayer body, a conductive layer on the resistor layer, and a plating layer on the conductive layer. The resistor layer contains a metallic phase, glass, and an oxide, and the resistor layer has a metallic phase content of 7.5 vol % to 15.6 vol % relative to an area of a section of the resistor layer, and the metallic phase has an average particle size of 1.6 μm or less.
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公开(公告)号：US10515762B2
公开(公告)日：2019-12-24
申请号：US15455268
申请日：2017-03-10
发明人： Toshikazu Makino , Hidehiko Tanaka , Makoto Matsuda , Togo Matsui
摘要： An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 μm or less.
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公开(公告)号：US20180269000A1
公开(公告)日：2018-09-20
申请号：US15916727
申请日：2018-03-09
发明人： HIDEHIKO TANAKA , Toshikazu Makino , Shinji Otani
摘要： A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.
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