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公开(公告)号：US10515762B2
公开(公告)日：2019-12-24
申请号：US15455268
申请日：2017-03-10
发明人： Toshikazu Makino , Hidehiko Tanaka , Makoto Matsuda , Togo Matsui
摘要： An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 μm or less.
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公开(公告)号：US10825610B2
公开(公告)日：2020-11-03
申请号：US15916727
申请日：2018-03-09
发明人： Hidehiko Tanaka , Toshikazu Makino , Shinji Otani
摘要： A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.
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公开(公告)号：US20180294099A1
公开(公告)日：2018-10-11
申请号：US15945774
申请日：2018-04-05
发明人： Toshikazu Makino , Hidehiko Tanaka
摘要： A multilayer ceramic capacitor that includes a multilayer body with dielectric layers and inner electrode layers and having a first main surface, a second main surface, a first side surface, a second side surface, a first end surface, and a second end surface; and an outer electrode on at least one of the end surfaces. The outer electrode includes a resistor layer on the at least one end surface of the multilayer body, a conductive layer on the resistor layer, and a plating layer on the conductive layer. The resistor layer contains a metallic phase, glass, and an oxide, and the resistor layer has a metallic phase content of 7.5 vol % to 15.6 vol % relative to an area of a section of the resistor layer, and the metallic phase has an average particle size of 1.6 μm or less.
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公开(公告)号：US11626250B2
公开(公告)日：2023-04-11
申请号：US17031971
申请日：2020-09-25
发明人： Shinji Otani , Hidehiko Tanaka
摘要： A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.
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