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公开(公告)号：US10650973B2
公开(公告)日：2020-05-12
申请号：US15158691
申请日：2016-05-19
发明人： Yuya Takagi , Togo Matsui , Hikaru Okuda
IPC分类号： H01G7/00 , H01G4/30 , H01G4/12 , H01L41/273
摘要： A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.
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公开(公告)号：US09111692B2
公开(公告)日：2015-08-18
申请号：US14105387
申请日：2013-12-13
发明人： Kenichi Hamanaka , Eiji Ito , Yasuharu Yamashita , Kenichi Okajima , Togo Matsui
CPC分类号： H01G4/30 , B32B37/00 , B32B38/0004 , C04B37/00 , C04B2237/00 , C04B2237/12 , H01G4/12 , H01G7/00 , H01G13/00
摘要： A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.
摘要翻译： 一种叠层陶瓷电子部件的制造方法，其特征在于，包括以下步骤：在所述层叠芯片的相对的侧面露出内部电极的相对的端部边缘的层叠片; 在层叠芯片的相对侧面分别形成第一绝缘体部分和第二绝缘体部分，该金属板被填充有糊状物的槽的金属板压制，并且当拉动层叠芯片时在任何方向上摆动金属板 远离金属板; 并且在其上形成有第一绝缘体部分和第二绝缘体部分来烧结层压片材。 糊料的粘度为500Pa·s〜2500Pa·s，无机固体的含量C（体积％）满足规定条件。
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公开(公告)号：US10515762B2
公开(公告)日：2019-12-24
申请号：US15455268
申请日：2017-03-10
发明人： Toshikazu Makino , Hidehiko Tanaka , Makoto Matsuda , Togo Matsui
摘要： An electronic component includes a laminate including dielectric layers and internal electrode layers stacked in a lamination direction. A first external electrode is on a first end surface of the laminate, and connected with a first of the internal electrode layers. A second external electrode is on a second end surface of the laminate, and connected with a second of the internal electrode layers. The first external electrode includes a first metallic layer connected to the first internal electrode layer, and a second metallic layer disposed on the first metallic layer. The first metallic layer has a higher specific resistance than the second metallic layer, and a difference between a thickness of an outermost portion of the first metallic layer in the lamination direction and a thickness of a center portion of the first metallic layer in a center in the lamination direction is about 5 μm or less.
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公开(公告)号：US08914956B2
公开(公告)日：2014-12-23
申请号：US13915640
申请日：2013-06-12
CPC分类号： H01G4/30 , H01G4/002 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/435 , Y10T29/5157
摘要： In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
摘要翻译： 在单块陶瓷电子部件的制造方法中，通过使用涂布板将陶瓷膏施加到在切割母体块之后获得的沿行和列方向排列的多个绿色芯片中的每一个的侧面。 在涂布工序中，通过使绿色芯片和涂布板沿着侧面延伸的方向相对移动，同时将绿色芯片与涂布板分离，将陶瓷浆料转移到侧面， 陶瓷浆料连接绿色芯片和应用板。
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公开(公告)号：US11961672B2
公开(公告)日：2024-04-16
申请号：US18134074
申请日：2023-04-13
发明人： Togo Matsui
摘要： An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.
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公开(公告)号：US11600445B2
公开(公告)日：2023-03-07
申请号：US17016687
申请日：2020-09-10
发明人： Yusuke Yokota , Togo Matsui
摘要： A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.
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公开(公告)号：US08956486B2
公开(公告)日：2015-02-17
申请号：US14013093
申请日：2013-08-29
CPC分类号： H01L21/64 , B26D1/04 , B32B37/00 , B32B37/02 , B32B37/10 , B32B37/12 , B32B37/16 , B32B38/0004 , B32B38/04 , B32B2038/042 , C04B35/00 , C04B35/468 , C04B37/00 , C04B37/006 , C04B2237/12 , C04B2237/32 , H01G4/06 , H01G4/12 , H01G4/30 , H01G4/308 , H01G13/00 , H05K3/0058 , Y10T156/1052 , Y10T156/1348
摘要： In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
摘要翻译： 在单块陶瓷电子部件的制造方法中，在切割母块之后获得的排列成行和列方向的多个绿色芯片彼此间隔开，然后翻滚，从而均匀地使每个 绿色芯片是开放的表面。 此后，将粘合剂施加到侧表面。 然后，通过将侧面陶瓷生片放置在固定弹性体上，将绿色芯片的侧面压靠在侧面陶瓷生片上，将侧面陶瓷生片冲压并粘贴在侧面。
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公开(公告)号：US20140096890A1
公开(公告)日：2014-04-10
申请号：US14105387
申请日：2013-12-13
发明人： Kenichi Hamanaka , Eiji Ito , Yasuharu Yamashita , Kenichi Okajima , Togo Matsui
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , B32B37/00 , B32B38/0004 , C04B37/00 , C04B2237/00 , C04B2237/12 , H01G4/12 , H01G7/00 , H01G13/00
摘要： A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.
摘要翻译： 一种叠层陶瓷电子部件的制造方法，其特征在于，包括以下步骤：在所述层叠芯片的相对的侧面露出内部电极的相对的端部边缘的层叠片; 在层叠芯片的相对侧面分别形成第一绝缘体部分和第二绝缘体部分，该金属板被填充有糊状物的槽的金属板压制，并且当拉动层叠芯片时在任何方向上摆动金属板 远离金属板; 并且在其上形成有第一绝缘体部分和第二绝缘体部分来烧结层压片材。 糊料的粘度为500Pa·s〜2500Pa·s，无机固体的含量C（体积％）满足规定条件。
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公开(公告)号：US11657967B2
公开(公告)日：2023-05-23
申请号：US17380062
申请日：2021-07-20
发明人： Togo Matsui
摘要： An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.
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公开(公告)号：US11101069B2
公开(公告)日：2021-08-24
申请号：US16594167
申请日：2019-10-07
发明人： Togo Matsui
摘要： An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.
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