公开(公告)号：US08956486B2

公开(公告)日：2015-02-17

申请号：US14013093

申请日：2013-08-29

申请人： Murata Manufacturing Co., Ltd.

发明人： Togo Matsui ,  Minoru Dooka ,  Hiroyoshi Takashima ,  Kenichi Okajima

IPC分类号： C03B29/00 ,  H01L21/64 ,  H01L41/00 ,  H01C1/012 ,  H01F27/28 ,  H01G4/12 ,  H01G4/30 ,  H01G13/00

CPC分类号： H01L21/64 ,  B26D1/04 ,  B32B37/00 ,  B32B37/02 ,  B32B37/10 ,  B32B37/12 ,  B32B37/16 ,  B32B38/0004 ,  B32B38/04 ,  B32B2038/042 ,  C04B35/00 ,  C04B35/468 ,  C04B37/00 ,  C04B37/006 ,  C04B2237/12 ,  C04B2237/32 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/308 ,  H01G13/00 ,  H05K3/0058 ,  Y10T156/1052 ,  Y10T156/1348

摘要： In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

摘要翻译： 在单块陶瓷电子部件的制造方法中，在切割母块之后获得的排列成行和列方向的多个绿色芯片彼此间隔开，然后翻滚，从而均匀地使每个 绿色芯片是开放的表面。 此后，将粘合剂施加到侧表面。 然后，通过将侧面陶瓷生片放置在固定弹性体上，将绿色芯片的侧面压靠在侧面陶瓷生片上，将侧面陶瓷生片冲压并粘贴在侧面。

公开(公告)号：US09240333B2

公开(公告)日：2016-01-19

申请号：US14454869

申请日：2014-08-08

申请人： Murata Manufacturing Co., Ltd.

发明人： Togo Matsui ,  Minoru Dooka ,  Hiroyoshi Takashima ,  Kenichi Okajima

IPC分类号： C03B29/00 ,  B44C1/165 ,  B44C1/17 ,  H01L21/64 ,  C04B37/00 ,  H01G4/06 ,  B32B38/04 ,  B32B37/02 ,  B32B37/12 ,  B32B37/16 ,  B26D1/04 ,  H01G4/12 ,  H01G13/00 ,  H05K3/00 ,  B32B37/10 ,  B32B37/00 ,  C04B35/00 ,  C04B35/468 ,  H01G4/30 ,  B32B38/00

CPC分类号： H01L21/64 ,  B26D1/04 ,  B32B37/00 ,  B32B37/02 ,  B32B37/10 ,  B32B37/12 ,  B32B37/16 ,  B32B38/0004 ,  B32B38/04 ,  B32B2038/042 ,  C04B35/00 ,  C04B35/468 ,  C04B37/00 ,  C04B37/006 ,  C04B2237/12 ,  C04B2237/32 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/308 ,  H01G13/00 ,  H05K3/0058 ,  Y10T156/1052 ,  Y10T156/1348

摘要： In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

公开(公告)号：US08914956B2

公开(公告)日：2014-12-23

申请号：US13915640

申请日：2013-06-12

申请人： Murata Manufacturing Co., Ltd.

发明人： Togo Matsui ,  Minoru Dooka ,  Hiroyoshi Takashima ,  Kenichi Okajima

IPC分类号： H01G7/00 ,  H01G4/30 ,  H01G13/00 ,  H01G4/002 ,  H01G4/12

CPC分类号： H01G4/30 ,  H01G4/002 ,  H01G4/12 ,  H01G13/00 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/5157

摘要： In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

摘要翻译： 在单块陶瓷电子部件的制造方法中，通过使用涂布板将陶瓷膏施加到在切割母体块之后获得的沿行和列方向排列的多个绿色芯片中的每一个的侧面。 在涂布工序中，通过使绿色芯片和涂布板沿着侧面延伸的方向相对移动，同时将绿色芯片与涂布板分离，将陶瓷浆料转移到侧面， 陶瓷浆料连接绿色芯片和应用板。