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    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES
    14.
    发明申请
    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES 审中-公开

    公开(公告)号：US20180372943A1

    公开(公告)日：2018-12-27

    申请号：US15992273

    申请日：2018-05-30

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Simon Gubser ,  Frank Sobel ,  Alexander Bietsch ,  Jens Geiger

    IPC: F21V8/00 ,  B29D11/00

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    WAFER-LEVEL MANUFACTURE OF DEVICES, IN PARTICULAR OF OPTICAL DEVICES
    16.
    发明申请
    WAFER-LEVEL MANUFACTURE OF DEVICES, IN PARTICULAR OF OPTICAL DEVICES 审中-公开

    公开(公告)号：US20170087784A1

    公开(公告)日：2017-03-30

    申请号：US15310838

    申请日：2015-05-14

    Applicant: HEPTAGON MICRO OPTICS PTE LTD.

    Inventor： Alexander Bietsch ,  Michel Barge

    IPC: B29D11/00 ,  B29C59/16 ,  G02B13/00 ,  B29C65/48 ,  G03F7/20 ,  B29C59/02 ,  B05D3/12

    Abstract: The wafer-level method for applying N≧2 first elements to a first side of a substrate, wherein the substrate has at the first side a first surface including the steps of providing the substrate, wherein at least N barrier members are present at the first side, and wherein each barrier member is associated with one of the first elements. For each of the first elements, the method includes bringing a first amount of a hardenable material in a flowable state in contact with the first surface, the first amount of hardenable material being associated with the first element; controlling a flow of the first amount of hardenable material on the first surface with the associated barrier member; and hardening the first amount of hardenable material to interconnect the first surface and the respective element.

    Optical devices and opto-electronic modules and methods for manufacturing the same
    17.
    发明授权
    Optical devices and opto-electronic modules and methods for manufacturing the same 有权
    光器件和光电模块及其制造方法

    公开(公告)号：US09490287B2

    公开(公告)日：2016-11-08

    申请号：US14366770

    申请日：2012-12-18

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  HEPTAGON OY

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

    IPC: G02B27/10 ,  H01L27/146 ,  H01L27/148

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

    Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

    OPTO-ELECTRONIC MODULE INCLUDING A NON-TRANSPARENT SEPARATION MEMBER BETWEEN A LIGHT EMITTING ELEMENT AND A LIGHT DETECTING ELEMENT
    18.
    发明申请
    OPTO-ELECTRONIC MODULE INCLUDING A NON-TRANSPARENT SEPARATION MEMBER BETWEEN A LIGHT EMITTING ELEMENT AND A LIGHT DETECTING ELEMENT 有权
    光电模块，包括发光元件和光检测元件之间的非透明分离元件

    公开(公告)号：US20160216138A1

    公开(公告)日：2016-07-28

    申请号：US14915567

    申请日：2013-09-02

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser ,  Samuele Laffranchini

    IPC: G01D5/40 ,  G02B5/22 ,  G02B5/20

    CPC classification number: G01D5/40 ,  G02B5/208 ,  G02B5/223 ,  G02B6/4204 ,  G02B6/4246 ,  G02B6/4249 ,  G03B7/099 ,  H01L27/14625 ,  H01L27/14678 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An opto-electronic sensor module (e.g., an optical proximity sensor module) includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, a thermosetting polymer material, a UV-curing polymer material or a visible light-curing polymer material, wherein the separation member further includes one or more inorganic fillers and/or dyes that make the separation member substantially non-transparent to light detectable by the light detector and/or emitted by the light emitter.

    Abstract translation: 光电传感器模块（例如，光学接近传感器模块）包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，其安装在 基板的第一表面，光检测器可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如热固性聚合物材料，UV固化聚合物材料或可见光固化聚合物材料构成，其中分离构件还包括一种或多种无机填料和/或染料，其使分离构件 对光检测器可检测的光和/或由光发射器发射的光基本上不透明。

    REFLOWABLE OPTO-ELECTRONIC MODULE
    19.
    发明申请
    REFLOWABLE OPTO-ELECTRONIC MODULE 有权
    可反光光电模块

    公开(公告)号：US20150249734A1

    公开(公告)日：2015-09-03

    申请号：US14715201

    申请日：2015-05-18

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch

    IPC: H04M1/725 ,  H01L25/00 ,  H01L27/146

    CPC classification number: H04M1/72527 ,  B32B38/0004 ,  G01J1/0271 ,  G01J1/0407 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14643 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/12 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94108 ,  Y10T156/1052 ,  H01L2924/00

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member, wherein the separation member is disposed between the substrate and the optics member. Multiple modules can be fabricated in a wafer-level process and can be composed of reflowable materials so that the modules can be incorporated more easily into devices whose manufacture occurs, at least in part, at elevated temperatures when the module is integrated into the device or during subsequent manufacturing processes.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件和分离部件，其中分离部件设置在基板和光学部件之间。 可以在晶片级工艺中制造多个模块，并且可以由可回流材料组成，使得模块可以更容易地结合到其制造发生的装置中，至少部分地在升高的温度下将模块集成到装置中或者 在后续制造过程中。

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