Abstract:
An OLED array substrate and a method for manufacturing the same, an OLED packaging structure and a display device are provided by the present disclosure. The OLED array substrate includes thin film transistors, anodes, cathodes and organic light-emitting layers arranged between the anodes and the cathodes. The OLED array substrate further includes spacers configured to support the OLED array substrate and a packaging substrate so as to form a cell gap therebetween. Each cathode includes a first region which covers the corresponding first spacer and a second region beyond the first regions, and a thickness of the cathode at the first region is larger than a thickness of the cathode at the second region.
Abstract:
A display panel which includes a display area and a peripheral area around the display area is provided. The peripheral area includes an electroluminescent layer test region, a TFT test region and a plurality of lead-out lines. The electroluminescent layer test region includes a plurality of thin film transistors having electroluminescent layers, a first test line connecting sources of the plurality of thin film transistors having electroluminescent layers, and a switch lead and a second test line connecting gates of the plurality of thin film transistors having electroluminescent layers. The TFT test region includes a plurality of thin film transistors. Each of the plurality of lead-out lines is used for connecting a source-drain metal layer of one thin film transistor in the electroluminescent layer test region and a source-drain metal layer of one thin film transistor in the TFT test region.
Abstract:
Embodiments of the present invention disclose a manufacturing method of a thin film transistor, a thin film transistor, an array substrate and a display device. The manufacturing method of a thin film transistor includes a step of forming an active layer, and the step of forming an active layer includes: forming a first poly-silicon layer and a second poly-silicon layer on the first poly-silicon layer separately, and adding dopant ions into the second poly-silicon layer and an upper surface layer of the first poly-silicon layer. By using the manufacturing method of a thin film transistor, defect states and unstable factors of interface in the thin film transistor can be reduced, thereby improving stability of the LTPS thin film transistor and obtaining an array substrate and a display device having more stable performance.
Abstract:
An organic light-emitting diode (OLED) display and a manufacturing method thereof are provided. The OLED display includes a plurality of sub-pixel units each including a first region and a second region. The first region includes a first electrode, a first organic material functional layer and a second electrode disposed in order on a base substrate. The second region includes a third electrode, a second organic material functional layer and a fourth electrode disposed in order on the base substrate. The first electrode and the third electrode each include an opaque metal layer, and the second electrode and the fourth electrode are translucent metal electrodes. The first electrode, the first organic material functional layer and the second electrode constitute a first micro-cavity, the third electrode, the second organic material functional layer and the fourth electrode constitute a second micro-cavity, and the first micro-cavity and the second micro-cavity have different micro-cavity effects.
Abstract:
The present invention provides a pixel circuit, a driving method thereof and a display device which are related to the field of display technology. The pixel circuit comprises a reset module, a compensation module, an energy storage module, a drive module, a drive control module, a power supply module and a light emitting module, the input voltage of the third power supply signal terminal is larger than the difference between the input voltage of the data signal terminal and the threshold voltage of the drive module, and is less than the input voltage of the second power supply signal terminal. The present invention is capable of discharging the driving transistor to a potential Vth within a short period, ensuring the driving transistor to be discharged completely in a short time.
Abstract:
The present invention provides an OLED panel and a method for fabricating the same, a screen printing plate, and a display device. The method comprises: forming an OLED mother board, wherein supporting adhesive is formed between an upper base plate and a lower base plate of the OLED mother board, and said supporting adhesive is located below a cutting line; and cutting said OLED mother board along said cutting line to obtain OLED panels. In the fabricating method of the present invention, when the OLED mother board is cut by a cutter wheel, the upper and lower base plate of the OLED mother board is subject to small deformation due to support of the supporting adhesive. As a result, travelling accuracy of the cutter wheel is improved, the distance between the cutting line and packaging adhesive is greatly reduced, and the frame width of the fabricated OLED panel is far less than that of an OLED panel fabricated by a conventional method.
Abstract:
The present invention relates to an array substrate for an LCD display and manufacturing method. The array substrate comprise a transparent substrate, gate lines and data lines disposed on the transparent substrate, a transparent conducting bar and a gate short-circuit bar. The transparent conducting bar is disposed below the gate short-circuit bar with the gate short-circuit bar and data lines arranged in the same layer. The present invention avoids the problem of burning the gate short-circuit bar due to the occurrence of static discharge and electrical defects in the array substrate are detectable and repairable in the array test process, improving the product rate of the LCD array substrate.
Abstract:
According to embodiments of present invention, a baseplate supporting pin is provided, which comprises: a pin body; a heating device embedded into the pin body; and a first control unit electrically connected to the heating device for controlling the heating device. Furthermore, according to embodiments of present invention, a baseplate supporting device is provided, which comprises: a baseplate support member; and a baseplate supporting pin, provided to ascend or descend through an opening formed in the baseplate supporting plate so as to support the baseplate thereon or place the baseplate on the baseplate support member, wherein the baseplate supporting pin comprises: a pin body; a heating device built in the pin body; and a first control unit electrically connected to the heating device for controlling the heating device. The baseplate supporting pin and the baseplate supporting device facilitate eliminating adverse effect caused by uneven heating of the baseplate.
Abstract:
A backlight module comprises a driving backplate, which comprises multiple pads; multiple light-emitting diodes, which are electrically connected to the pads; and multiple transparent protection structures, which are located on the sides of the multiple light-emitting diodes that are away from the driving backplate, wherein the transparent protection structures cover the light-emitting diodes, there is a first distance between the center of the orthographic projection of each transparent protection structure on the driving backplate and the center of the orthographic projection of each light-emitting diode on the driving backplate; and the length of the orthographic projection of each light-emitting diode on the driving backplate is a second distance, the width of the orthographic projection of each light-emitting diode on the driving backplate is a third distance, the ratio of the first distance to the second distance is less than or equal to 1:2-1:10.
Abstract:
The present disclosure relates to a method of electrically aging a PMOS thin film transistor. The method includes applying a first voltage Vg with an amplitude of A volts to a gate of the PMOS thin film transistor; applying a second voltage Vs with an amplitude of (A−40) to (A−8) volts to a source of the PMOS thin film transistor; and applying a third voltage Vd with an amplitude of (A−80) to (A−16) volts to a drain of the PMOS thin film transistor. Application of the first voltage Vg, the second voltage Vs and the third voltage Vd is maintained for a predetermined time period, and Vd−Vs