公开(公告)号：US20160307782A1

公开(公告)日：2016-10-20

申请号：US15099760

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67754 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68764 ,  H01L21/68771

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

Abstract translation: 描述了包括机器人，转盘和至少一个用于批处理室的加热模块的缓冲室。 描述了用于快速和可重复地移动晶片进出缓冲室的机器人配置和结合缓冲室和机器人的集群工具。

公开(公告)号：US12183553B2

公开(公告)日：2024-12-31

申请号：US16891626

申请日：2020-06-03

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Kartik Shah ,  Amit Kumar Bansal ,  Tuan Anh Nguyen ,  Juan Carlos Rocha ,  David Blahnik

IPC: H01J37/32

Abstract: The present disclosure generally relates to an apparatus for improving azimuthal uniformity of a pressure profile of a processing gas. In one example, a processing chamber includes a lid, sidewalls, and a substrate support defining a processing volume. A bottom bowl, a chamber base, and a wall define a purge volume. The purge volume is disposed beneath the processing volume. The bottom bowl includes a first surface having a first equalizer hole. A passage couples the processing volume to the purge volume via the first equalizer hole and an inlet. The passage is positioned above the first equalizer hole. The chamber base has a purge port coupleable to a purge gas line for supplying a purge gas to the purge volume. A baffle is disposed in the purge volume at a height above the purge port, and is configured to deflect a trajectory of the purge gas.

公开(公告)号：US11710617B2

公开(公告)日：2023-07-25

申请号：US17378327

申请日：2021-07-16

Applicant: APPLIED Materials, Inc.

Inventor： Costel Biloiu ,  Michael Honan ,  Robert B. Vopat ,  David Blahnik ,  Charles T. Carlson ,  Frank Sinclair ,  Paul Murphy

IPC: H01J23/18 ,  H01J37/30 ,  H01J37/317

CPC classification number: H01J37/3007 ,  H01J23/18 ,  H01J37/3171 ,  H01J2237/0473

Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.

公开(公告)号：US11264258B2

公开(公告)日：2022-03-01

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US11078568B2

公开(公告)日：2021-08-03

申请号：US16685340

申请日：2019-11-15

Applicant: Applied Materials, Inc.

Inventor： Kalyanjit Ghosh ,  David Blahnik ,  Amit Kumar Bansal ,  Tuan Anh Nguyen

IPC: C23C16/44

Abstract: The present disclosure relates to pumping devices, components thereof, and methods associated therewith for substrate processing chambers. In one example, a pumping ring for substrate processing chambers includes a body. The body includes an upper wall, a lower wall, an inner radial wall, and an outer radial wall. The pumping ring also includes an annulus defined by the upper wall, the lower wall, the inner radial wall, and the outer radial wall. The pumping ring also includes a first exhaust port in the body that is fluidly coupled to the annulus, and a second exhaust port in the body that is fluidly coupled to the annulus. The pumping ring also includes a first baffle disposed in the annulus adjacent to the first exhaust port, and a second baffle disposed in the annulus adjacent to the second exhaust port.

公开(公告)号：US20210210307A1

公开(公告)日：2021-07-08

申请号：US16734746

申请日：2020-01-06

Applicant: APPLIED Materials, Inc.

Inventor： Costel Biloiu ,  Michael Honan ,  Robert B. Vopat ,  David Blahnik ,  Charles T. Carlson ,  Frank Sinclair ,  Paul Murphy

IPC: H01J37/30 ,  H01J37/317

Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.

公开(公告)号：US20200279763A1

公开(公告)日：2020-09-03

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US10699930B2

公开(公告)日：2020-06-30

申请号：US16127702

申请日：2018-09-11

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US20190259638A1

公开(公告)日：2019-08-22

申请号：US16400516

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David Blahnik ,  William T. Weaver

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673

Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

公开(公告)号：US11791176B2

公开(公告)日：2023-10-17

申请号：US16665343

申请日：2019-10-28

Applicant: Applied Materials, Inc.

Inventor： Michael Honan ,  David Blahnik ,  Robert Brent Vopat ,  Jeffrey Blahnik ,  Charles Carlson

IPC: H01L21/67 ,  H01L21/673 ,  F27D7/02 ,  H01L21/324 ,  C30B33/02 ,  C30B35/00

CPC classification number: H01L21/67109 ,  C30B33/02 ,  C30B35/00 ,  F27D7/02 ,  H01L21/324 ,  H01L21/67248 ,  H01L21/67323

Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.