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    Robot for simultaneous substrate transfer
    1.
    发明授权
    Robot for simultaneous substrate transfer 有权

    公开(公告)号：US11948817B2

    公开(公告)日：2024-04-02

    申请号：US17965491

    申请日：2022-10-13

    Applicant: Applied Materials, Inc.

    Inventor： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

    IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68 ,  H01L21/687

    CPC classification number: H01L21/67196 ,  B65G47/907 ,  H01L21/68 ,  H01L21/68707 ,  H01L21/67167

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

    ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER
    2.
    发明申请
    ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER 有权

    公开(公告)号：US20210013068A1

    公开(公告)日：2021-01-14

    申请号：US16922536

    申请日：2020-07-07

    Applicant: Applied Materials, Inc.

    Inventor： Jason M. Schaller ,  Charles T. Carlson ,  Luke Bonecutter ,  David Blahnik ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

    IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68 ,  H01L21/687

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.

    High pressure steam anneal processing apparatus
    3.
    发明授权
    High pressure steam anneal processing apparatus 有权

    公开(公告)号：US10854483B2

    公开(公告)日：2020-12-01

    申请号：US16157808

    申请日：2018-10-11

    Applicant: Applied Materials, Inc.

    Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Charles T. Carlson ,  Jeffrey Charles Blahnik ,  Timothy J. Franklin ,  David Blahnik ,  Aaron Webb

    IPC: F27D1/18 ,  H01L21/67 ,  H01L21/673 ,  H01L21/687

    Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.

    In-Vacuum Rotatable RF Component
    6.
    发明申请
    In-Vacuum Rotatable RF Component 有权

    公开(公告)号：US20250079116A1

    公开(公告)日：2025-03-06

    申请号：US18239988

    申请日：2023-08-30

    Applicant: Applied Materials, Inc.

    Inventor： Michael Mason Carrell ,  Aaron P. Webb ,  Jason M. Schaller ,  William H. Park, JR. ,  David Blahnik ,  Wai-Ming Tam

    IPC: H01J37/20 ,  C23C14/48 ,  H01J37/317

    Abstract: An apparatus that may be used to allow the rotation of a component that passes through a wall of a vacuum chamber is disclosed. The apparatus includes a rotatable shaft through which the component passes. The rotatable shaft is held in place using a holder, which retains a portion of the rotatable shaft. In some embodiments, the holder is affixed to a plate, which is then affixed to the chamber wall. The plate has an opening which is aligned to the opening in the chamber wall. A portion of the rotatable shaft passes through the opening in the plate and vacuum seals are disposed between the rotatable shaft and the plate. This apparatus may be used to allow use of rotatable components in an ion implanter.

    Stiffened RF LINAC coil inductor with internal support structure
    8.
    发明授权
    Stiffened RF LINAC coil inductor with internal support structure 有权

    公开(公告)号：US11856685B2

    公开(公告)日：2023-12-26

    申请号：US17479313

    申请日：2021-09-20

    Applicant: Applied Materials, Inc.

    Inventor： Charles T. Carlson ,  Aaron P. Webb ,  Paul J. Murphy ,  Frank Sinclair ,  David Blahnik

    IPC: H05H7/22

    CPC classification number: H05H7/22

    Abstract: A coil inductor for use with a LINAC is disclosed. The coil inductor comprises one or more tubes, wherein each tube comprises an interior support structure to strengthen the tubes. By supporting the tube, the amount of vibration is reduced, allowing the coil to resonate at its natural frequency. In some embodiments, the interior structure comprises one or more interior walls. These interior walls may be used to create a plurality of fluid channels that allow the flow of coolant through the tubes. An end cap may be disposed on the second end of the tubes to allow fluid communication between the supply fluid channels and the return fluid channels. The first ends of the one or more tubes may be connected to a manifold that includes a supply port and a return port for the passage of coolant.

    Stiffened RF LINAC Coil Inductor With Internal Support Structure
    9.
    发明申请
    Stiffened RF LINAC Coil Inductor With Internal Support Structure 有权

    公开(公告)号：US20230089170A1

    公开(公告)日：2023-03-23

    申请号：US17479313

    申请日：2021-09-20

    Applicant: Applied Materials, Inc.

    Inventor： Charles T. Carlson ,  Aaron P. Webb ,  Paul J. Murphy ,  Frank Sinclair ,  David Blahnik

    IPC: H05H7/22

    Abstract: A coil inductor for use with a LINAC is disclosed. The coil inductor comprises one or more tubes, wherein each tube comprises an interior support structure to strengthen the tubes. By supporting the tube, the amount of vibration is reduced, allowing the coil to resonate at its natural frequency. In some embodiments, the interior structure comprises one or more interior walls. These interior walls may be used to create a plurality of fluid channels that allow the flow of coolant through the tubes. An end cap may be disposed on the second end of the tubes to allow fluid communication between the supply fluid channels and the return fluid channels. The first ends of the one or more tubes may be connected to a manifold that includes a supply port and a return port for the passage of coolant.

    Robot for simultaneous substrate transfer
    10.
    发明授权
    Robot for simultaneous substrate transfer 有权

    公开(公告)号：US11355367B2

    公开(公告)日：2022-06-07

    申请号：US16922536

    申请日：2020-07-07

    Applicant: Applied Materials, Inc.

    Inventor： Jason M. Schaller ,  Charles T. Carlson ,  Luke Bonecutter ,  David Blahnik ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

    IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687 ,  H01L21/68

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.

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