公开(公告)号：US10005025B2

公开(公告)日：2018-06-26

申请号：US14877753

申请日：2015-10-07

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Monika Agarwal ,  Hamid Mohiuddin ,  Kadthala R. Narendrnath

IPC: B01D53/32 ,  B01D53/68 ,  H01J37/32

CPC classification number: B01D53/32 ,  B01D53/68 ,  B01D2257/2025 ,  B01D2257/2027 ,  B01D2257/2045 ,  B01D2257/2047 ,  B01D2258/0216 ,  B01D2259/818 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32844 ,  Y02C20/30

Abstract: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.

公开(公告)号：US09613846B2

公开(公告)日：2017-04-04

申请号：US14550106

申请日：2014-11-21

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Cheng-Hsiung Tsai ,  Robert T. Hirahara ,  Kadthala R. Narendrnath ,  Manjunatha Koppa ,  Ross Marshall

IPC: H02H7/30 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01L21/6875 ,  H01L21/6831 ,  Y10T428/24298 ,  Y10T428/24314

Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

公开(公告)号：US11915913B2

公开(公告)日：2024-02-27

申请号：US18302854

申请日：2023-04-19

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn Boyd, Jr. ,  Govinda Raj ,  Matthew James Busche

IPC: G01D5/26 ,  H01J37/32 ,  H01L21/683 ,  C23C16/458 ,  G01L11/02 ,  G01D11/24

CPC classification number: H01J37/3244 ,  C23C16/4586 ,  H01J37/32009 ,  H01J37/3299 ,  H01J37/32697 ,  H01J37/32715 ,  H01L21/6831 ,  H01L21/6833 ,  G01D5/26 ,  G01D5/266 ,  G01D5/268 ,  G01D11/245 ,  G01L11/025 ,  H01J2237/334

Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support assembly has a puck having a workpiece support surface, a gas hole formed through the workpiece support surface, and a sensor assembly disposed in the gas hole. The substrate support assembly further has a transition conduit fluidly coupled to the gas hole, and a connection coupled to the transition conduit. The connection has a first opening fluidly coupled to the transition conduit and a second opening coupled to a control system, where the control system is coupled to the sensor assembly.

公开(公告)号：US11569069B2

公开(公告)日：2023-01-31

申请号：US16945510

申请日：2020-07-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Kadthala R. Narendrnath ,  Govinda Raj ,  Goichi Yoshidome ,  Bopanna Ichettira Vasantha ,  Umesh M. Kelkar

IPC: H01J37/32 ,  B22F10/20 ,  B33Y80/00

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

公开(公告)号：US11560913B2

公开(公告)日：2023-01-24

申请号：US16249731

申请日：2019-01-16

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Tom K. Cho ,  Hamid Mohiuddin ,  Ian Widlow

IPC: B23K1/00 ,  F16B5/08 ,  B23K1/20 ,  C04B37/02 ,  B23K101/40 ,  B23K103/00 ,  B23K103/16

Abstract: Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

公开(公告)号：US10777391B2

公开(公告)日：2020-09-15

申请号：US15015849

申请日：2016-02-04

Applicant: Applied Materials, Inc.

Inventor： Kadthala R. Narendrnath ,  Govinda Raj ,  Goichi Yoshidome ,  Bopanna Ichettira Vasantha ,  Umesh M. Kelkar

IPC: C23C14/34 ,  H01J37/32 ,  B22F3/105 ,  B22F3/00 ,  B33Y80/00

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

公开(公告)号：US10141153B2

公开(公告)日：2018-11-27

申请号：US15271451

申请日：2016-09-21

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Simon Yavelberg ,  Ramprakash Sankarakrishnan

IPC: H01J23/00 ,  H01J25/50 ,  B22F3/105 ,  B33Y80/00 ,  B22F5/10

Abstract: Embodiments of the present disclosure generally provide magnetron configurations that provide more efficient and/or more uniform cooling characteristics and methods for forming the magnetrons. The magnetron includes one or more flow directing structures disposed between parallel cooling fins. The flow directing structures direct air flow across various surfaces of the cooling fins that otherwise would be obstructed by magnetron components, reducing the incidence and/or magnitude of hot spots on the cooling fins and/or on other magnetron components. The flow directing structures also adjust flow rates to improve cooling efficiency.

公开(公告)号：US10049908B2

公开(公告)日：2018-08-14

申请号：US15163498

申请日：2016-05-24

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Robert T. Hirahara

IPC: H01T23/00 ,  H01L21/683 ,  H02N13/00 ,  H01L21/687

Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.

公开(公告)号：US11761901B2

公开(公告)日：2023-09-19

申请号：US17947791

申请日：2022-09-19

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Vilen K. Nestorov

IPC: G01N21/88 ,  G01N21/66 ,  F21V29/10 ,  G01B11/02

CPC classification number: G01N21/8851 ,  G01N21/66 ,  F21V29/10 ,  G01B11/02

Abstract: Examples disclosed herein relate to a method and apparatus for inspecting lamp dimensions. The method includes determining an actual measurement of a lamp. The lamp is configured to heat a substrate in a substrate processing apparatus. A window is generated, the window having a width and a height. The window is based upon a target measurement of the lamp. The method further includes generating a deviation based upon a difference between an image of the actual measurement and the window. The deviation is compared to a first threshold. The lamp is rejected if the deviation is outside the first threshold.

公开(公告)号：US11694879B2

公开(公告)日：2023-07-04

申请号：US16664620

申请日：2019-10-25

Applicant: Applied Materials, Inc.

Inventor： Ian Widlow ,  Govinda Raj ,  Gary U. Keppers ,  Aravind Dugganna Naik ,  Francisco Rodarte ,  Sudhir R. Gondhalekar ,  Ravikumara Kodinaganhalli

IPC: H01J37/32 ,  C23C16/44

CPC classification number: H01J37/32642 ,  C23C16/4404 ,  C23C16/4405 ,  C23C16/4407 ,  C23C16/4409 ,  H01J37/32449 ,  H01J37/32477 ,  H01J37/32862

Abstract: A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidly couples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system.