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公开(公告)号：US20140233170A1
公开(公告)日：2014-08-21
申请号：US14266570
申请日：2014-04-30
Applicant: Apple Inc.
Inventor： Phillip Michael Hobson , Erik L. Wang , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub , Richard H. Dinh , Tang Yew Tan , Adam D. Mittleman , Bartley K. Andre , Daniel J. Coster , Daniele De Iuliis , Richard P. Howarth , Jonathan P. Ive , Steven P. Jobs , Duncan Robert Kerr , Shin Nishibori , Matthew Dean Rohrbach , Douglas B. Satzger , Calvin Q. Seid , Christopher J. Stringer , Eugene Antony Whang , Rico Zorkendorfer
CPC classification number: H04M1/0202 , H01Q1/243 , H01Q9/0421 , H04M1/0266 , H05K5/0247
Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.
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公开(公告)号：US20140218606A1
公开(公告)日：2014-08-07
申请号：US14248150
申请日：2014-04-08
Applicant: Apple Inc.
Inventor： Shayan Malek , Benjamin J. Pope , Daniel W. Jarvis , Tang Yew Tan , Richard H. Dinh , Robert J. Steinfeld , Ramachandran Chundru
CPC classification number: H05K9/0064 , H04M1/0274 , H04M1/0277 , H04N5/2254 , H05K1/0215 , H05K1/0216 , H05K2201/0707
Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。
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公开(公告)号：US20140011399A1
公开(公告)日：2014-01-09
申请号：US13632126
申请日：2012-09-30
Applicant: APPLE INC.
Inventor： Shayan MALEK , Jared M. KOLE , Richard H. Dinh
IPC: H01R24/50
CPC classification number: H01R9/0524 , H01R4/023 , H01R9/0515
Abstract: A clamping apparatus includes a base, a vertical support member coupled to the base, and a head member coupled to the vertical support member. The head member is configured to receive and engage a portion of a coaxial cable. Additionally, the base is configured to engage through a through hole or slot arranged through a substrate and provide electrical communication between a portion of the coaxial cable and the substrate.
Abstract translation: 夹紧装置包括底座，联接到基座的垂直支撑构件和联接到垂直支撑构件的头构件。 头部构件被配置为接收和接合同轴电缆的一部分。 另外，基座被构造成通过穿过基板布置的通孔或狭缝接合，并且在同轴电缆的一部分和基板之间提供电连通。
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公开(公告)号：US20130162485A1
公开(公告)日：2013-06-27
申请号：US13773010
申请日：2013-02-21
Applicant: Apple Inc.
Inventor： Phillip M. Hobson , Stephen P. Zadesky , Erik L. Wang , Tang Yew Tan , Richard H. Dinh , Adam D. Mittleman , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub
IPC: H01Q1/24
CPC classification number: H01Q1/243 , H01Q1/24 , H01Q1/273 , H01Q1/38 , H01Q1/46 , H01Q1/48 , H01Q1/50 , H01Q5/371 , H01Q5/40 , H01Q7/00 , H01Q9/0421 , H01Q9/42 , H01Q13/10 , H01Q21/28
Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.
Abstract translation: 可以提供包含导电外壳和其它导电元件的手持电子设备。 导电元件可形成天线接地平面。 用于手持电子设备的一个或多个天线可以由接地平面和一个或多个相关联的天线谐振元件形成。 收发器电路可以通过诸如同轴电缆的传输线连接到谐振元件。 套圈可以压接到同轴电缆。 具有延伸构件的托架可以压接在套圈上以将同轴电缆接地到壳体和接地平面中的其它导电元件。 接地平面可能包含一个天线槽。 坞站连接器和柔性电路可以以不影响槽的谐振频率的方式与槽重叠。 电气部件可以使用隔离元件例如电感器和电阻器与天线隔离。
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公开(公告)号：US11353652B1
公开(公告)日：2022-06-07
申请号：US16505553
申请日：2019-07-08
Applicant: Apple Inc.
Inventor： Michael B. Wittenberg , Jean-Pierre S. Guillou , Tyler R. Kakuda , Christopher D. Prest , Marwan Rammah , Rasamy Phouthavong , Richard H. Dinh , Steven P. Hotelling , Yi Qiao , Michael J. Brown , Hao Dong , David A. Pakula
Abstract: An electronic device may have a display overlapped by a cover layer. Portions of the surface of the display and cover layer may have curved profiles. The display may include a flexible substrate and may have bent edge portions protruding from a central region. Gaps may be formed between regions of pixels on a common substrate or between separate display panels. An image transport layer formed from a coherent fiber bundle or a layer of Anderson localization material configured to exhibit two-dimensional transverse Anderson localization of light may have an input surface that receives an image from adjacent display pixels and an output surface on which the image is displayed. The output surface may have a curved profile and may exhibit compound curvature. The input surface may have a profile with curved portions or other shapes. Image transport layers can be used to cover gaps between sets of pixels.
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Patent Agency Ranking
公开(公告)号：US20220061166A1
公开(公告)日：2022-02-24
申请号：US16997753
申请日：2020-08-19
Applicant: Apple Inc.
Inventor： Kodiak D. Burke , John J. Baker , Tyler B. Cater , Christopher J. Durning , Benjamin J. Pope , Richard H. Dinh
Abstract: An electronic device including a housing defining an aperture, a display component positioned in the aperture, and a filler material at least partially surrounding a periphery of the display component. The filler material can contact the display component and a portion of the housing defining the aperture.
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公开(公告)号：US10468956B2
公开(公告)日：2019-11-05
申请号：US15016644
申请日：2016-02-05
Applicant: Apple Inc.
Inventor： Yaocheng Zhang , Kevin M. Froese , Richard H. Dinh , Teodor Dabov
IPC: H02K33/18
Abstract: An electronic device may have an electrical component with a moving portion. The moving portion of the electrical component may include a moving mass and may include coils or other circuitry coupled to the moving mass. The moving mass may be supported within a support structure such as a housing structure. Springs may be coupled between walls in the housing structure and end portions of the moving mass. The coils or other circuitry on the moving mass may be coupled to flexible printed circuit cables. The flexible printed circuit cables may be coupled to the coils at the ends of the moving mass adjacent to the springs. The flexible printed circuit cables may have localized stiffeners that help prevent damage to metal traces in the cables during cable bending. The cables may have U-shapes or other suitable shapes.
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公开(公告)号：US10300658B2
公开(公告)日：2019-05-28
申请号：US13628568
申请日：2012-09-27
Applicant: Apple Inc.
Inventor： Richard H. Dinh , Daniel W. Jarvis
Abstract: Electronic device housing structures and other structures may be formed from molded plastic. Plastic structures such as injection molding housing structures and other structures may be provided with openings. An opening may have sidewall surfaces. Machining operations and other techniques may be used in forming the openings. Openings may be processed to enhance resistance to stress-induced cracking of the plastic structures along the sidewall surfaces. Cracking resistance may be obtained by activating the surface using heat or laser treatment and by electroplating the activated surface to form a metal liner structure. Surface treatments using applied liquid chemicals or heat may form a treated layer on the surface of an opening with enhanced cracking resistance. A plastic sleeve or other insert may form a liner structure in an opening that resists cracking. Liner structures may also be formed by applying heat or light to a coating in an opening.
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19.发明授权Metal electromagnetic interference (EMI) shielding coating along an edge of a ceramic substrate 有权沿陶瓷基片边缘的金属电磁干扰（EMI）屏蔽涂层公开(公告)号：US09583445B2
公开(公告)日：2017-02-28
申请号：US14218384
申请日：2014-03-18
Applicant: Apple Inc.
Inventor： Richard H. Dinh , Ashutosh Y. Shukla , Scott A. Myers
IPC: H01L23/552 , H01L27/146 , H01L23/498 , H05K1/02 , H05K1/18 , H01L23/13 , H01L23/15 , H01L23/00 , H05K3/00 , H05K3/36
CPC classification number: H01L23/552 , H01L23/13 , H01L23/15 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/81 , H01L27/14618 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/81801 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15151 , H01L2924/15159 , H01L2924/15162 , H01L2924/15311 , H01L2924/15787 , H05K1/0218 , H05K1/189 , H05K3/0052 , H05K3/363 , H05K2201/053 , H05K2201/056 , H05K2201/09145 , H05K2201/09354 , H05K2201/09509 , H05K2201/09618 , H05K2201/10378 , H05K2201/2018 , H01L2924/014 , H01L2924/00
Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.
Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。
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公开(公告)号：US09033731B2
公开(公告)日：2015-05-19
申请号：US13632126
申请日：2012-09-30
Applicant: Apple, Inc.
Inventor： Shayan Malek , Jared M. Kole , Richard H. Dinh
CPC classification number: H01R9/0524 , H01R4/023 , H01R9/0515
Abstract: A clamping apparatus includes a base, a vertical support member coupled to the base, and a head member coupled to the vertical support member. The head member is configured to receive and engage a portion of a coaxial cable. Additionally, the base is configured to engage through a through hole or slot arranged through a substrate and provide electrical communication between a portion of the coaxial cable and the substrate.
Abstract translation: 夹紧装置包括底座，联接到基座的垂直支撑构件和联接到垂直支撑构件的头构件。 头部构件被配置为接收和接合同轴电缆的一部分。 另外，基座被构造成通过穿过基板布置的通孔或狭缝接合，并且在同轴电缆的一部分和基板之间提供电连通。
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