公开(公告)号：US20140218606A1

公开(公告)日：2014-08-07

申请号：US14248150

申请日：2014-04-08

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Benjamin J. Pope ,  Daniel W. Jarvis ,  Tang Yew Tan ,  Richard H. Dinh ,  Robert J. Steinfeld ,  Ramachandran Chundru

IPC: H05K9/00 ,  H04N5/225 ,  H05K1/02

CPC classification number: H05K9/0064 ,  H04M1/0274 ,  H04M1/0277 ,  H04N5/2254 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/0707

Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.

Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。

公开(公告)号：US08993899B2

公开(公告)日：2015-03-31

申请号：US14248150

申请日：2014-04-08

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Benjamin J. Pope ,  Daniel W. Jarvis ,  Tang Yew Tan ,  Richard H. Dinh ,  Robert J. Steinfeld ,  Ramachandran Chundru

IPC: H05K9/00 ,  H04M1/02 ,  H04N5/225 ,  H05K1/02

CPC classification number: H05K9/0064 ,  H04M1/0274 ,  H04M1/0277 ,  H04N5/2254 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/0707

Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.

Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。