公开(公告)号：US06382360B2

公开(公告)日：2002-05-07

申请号：US09816218

申请日：2001-03-26

申请人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

发明人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

IPC分类号： B66B706

CPC分类号： B66B11/008

摘要： An elevator apparatus is provided with an elevator path having a restricted height. Under a roping ratio of 1:1, a thin driving unit having a traction sheave 1 and a driving mechanism 2 is positioned between an inner wall 3a of the elevator path 3 and a space occupied by an elevator car 4 rising and falling in the elevator path 3. One end of a suspension rope 7 is fixed to the elevator car 4 in a position below a ceiling 4c of the elevator car 4. With the arrangement, the car 4 can move close to the ceiling 4c of the elevator car 4 effectively. Further, it is possible to reduce respective heights of the elevator path 3 and a building equipped with the elevator apparatus.

公开(公告)号：US06247557B1

公开(公告)日：2001-06-19

申请号：US09300072

申请日：1999-04-27

申请人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

发明人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

IPC分类号： B66B1108

CPC分类号： B66B11/008

摘要： An elevator apparatus including an elevator path having a restricted height. Under a roping ratio of 1:1, a thin driving unit having a traction sheave and a driving mechanism is positioned between an inner wall of the elevator path and a space occupied by an elevator car rising and falling in the elevator path. One end of a suspension rope is fixed to the elevator car in a position below a ceiling of the elevator car. With the arrangement, the car can move close to the ceiling of the elevator car effectively. Further, it is possible to reduce respective heights of the elevator path and a building equipped with the elevator apparatus.

摘要翻译： 一种电梯装置，包括具有有限高度的电梯路径。 在1：1的绳索比下，具有牵引滑轮和驱动机构的薄驱动单元位于电梯路径的内壁和由电梯路径上升和下降的电梯轿厢占据的空间之间。 悬吊绳的一端在电梯轿厢的天花板下方的位置固定在电梯轿厢上。 通过这种安排，汽车可以有效地靠近电梯轿厢的天花板。 此外，可以减小电梯路径的各个高度和装备有电梯装置的建筑物。

公开(公告)号：US5417542A

公开(公告)日：1995-05-23

申请号：US950715

申请日：1992-09-25

申请人： Hisao Suzuki ,  Kazuhiro Tokitsu ,  Makoto Kasahara ,  Kiyoe Imai ,  Kouichi Yumita ,  Tadashi Munakata ,  Yoshinobu Ishikawa ,  Etuo Minamihama ,  Takatomo Izume ,  Yasuharu Ujiie ,  Masamichi Kato

发明人： Hisao Suzuki ,  Kazuhiro Tokitsu ,  Makoto Kasahara ,  Kiyoe Imai ,  Kouichi Yumita ,  Tadashi Munakata ,  Yoshinobu Ishikawa ,  Etuo Minamihama ,  Takatomo Izume ,  Yasuharu Ujiie ,  Masamichi Kato

IPC分类号： H05K13/00 ,  H05K13/04 ,  B65G25/00

CPC分类号： H05K13/0061 ,  H05K13/0408

摘要： A method and an apparatus for carrying a workpiece for improving efficiency in a workpiece carrying operation. In the apparatus, a moving member having a workpiece holding member is driven with a linear motion in a horizontal plane along a carrier passage, and the workpiece holding member is driven with a revolutional motion in a vertical plane around a revolution axis displaced from a center of the workpiece holding member, while the workpiece holding member maintains an orientation in which a holder holding the workpiece points downwards. The holder of the workplece holding member is controlled to sequentially carry out holding of the workpiece and releasing of the workpiece at lowest positions of the workpiece holding member in the revolutional motion, so as to realize a continuous workpiece carrying operation.

摘要翻译： 一种用于承载工件以提高工件承载操作效率的方法和装置。 在该装置中，具有工件保持构件的移动构件沿着承载通道在水平面中以线性运动被驱动，并且工件保持构件以围绕从中心移动的旋转轴线的垂直平面中的旋转运动驱动 同时工件保持构件保持保持工件的保持器向下的方向。 控制工件保持构件的保持件，以便在工件保持构件的旋转运动的最下位置依次执行工件的保持和工件的释放，以实现连续的工件搬运操作。

公开(公告)号：US5331731A

公开(公告)日：1994-07-26

申请号：US950883

申请日：1992-09-25

申请人： Hisao Suzuki ,  Kazuhiro Tokitu ,  Tadashi Munakata ,  Yoshinobu Ishikawa ,  Takatomo Izume ,  Masamichi Kato ,  Etuo Minamihama

发明人： Hisao Suzuki ,  Kazuhiro Tokitu ,  Tadashi Munakata ,  Yoshinobu Ishikawa ,  Takatomo Izume ,  Masamichi Kato ,  Etuo Minamihama

IPC分类号： H05K13/04 ,  H05K13/08 ,  B23P19/04 ,  B65H5/18

CPC分类号： H05K13/0452 ,  H05K13/08 ,  Y10S29/044 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

摘要： A work mounting apparatus according to the present invention comprises a rotating drum divided into upper and lower drums, a head unit arranged on the outer periphery of the rotating drum or the lower drum, a circular work head attached to the head unit, and a suction nozzle protruding from the outer peripheral surface of the work head toward a workbench. While the lower drum is rotating, the suction nozzle of the work head repeats cycloid motion along the workbench with its posture or orientation kept fixed with respect to the workbench. While repeating the cycloid motion, the nozzle receives a work from a work feeder of the workbench by suction, and mounts the work on a printed board on the workbench. The work mounting apparatus further includes a balance weight for the work head, and a friction brake for applying a frictional force to the turning shaft of the work head, to thereby stabilize the turning motion of the work head.

摘要翻译： 根据本发明的工件安装装置包括分为上鼓轮和下鼓轮的旋转滚筒，设置在旋转滚筒或下滚筒的外周上的头单元，附接到头单元的圆形工作头和吸头 喷嘴从工作头的外周面朝向工作台突出。 当下滚筒旋转时，工作头的吸嘴重复沿着工作台的摆线运动，其姿态或取向相对于工作台保持固定。 当重复摆线运动时，喷嘴通过抽吸从工作台的工作进给器接收工件，并将工件安装在工作台上的印刷板上。 工件安装装置还包括用于工作头的平衡重和用于向工作头的转动轴施加摩擦力的摩擦制动器，从而稳定工作头的转动运动。

公开(公告)号：US4272781A

公开(公告)日：1981-06-09

申请号：US72592

申请日：1979-09-05

申请人： Nobuo Taguchi ,  Tadashi Munakata ,  Yoshikata Kobayashi

发明人： Nobuo Taguchi ,  Tadashi Munakata ,  Yoshikata Kobayashi

IPC分类号： G01M3/00 ,  G01M11/08 ,  G01N27/90 ,  H04N7/18

CPC分类号： G01M11/081 ,  G01M3/005 ,  G01N27/9093

摘要： The disclosed apparatus comprises a movable carriage on which an industrial television camera and nondestructive examining unit or probe are swingably supported. A control means for controlling the carriage, industrial television camera and the probe are also provided as is a monitor television for displaying the result of an examination made by the probe and a video tape recorder.

摘要翻译： 所公开的装置包括可移动的托架，工业电视摄像机和非破坏性检查单元或探针在其上可摆动地支撑。 还提供了用于控制托架，工业电视摄像机和探头的控制装置，用于显示由探头和录像机进行的检查结果的监视器电视机。

公开(公告)号：US08083048B2

公开(公告)日：2011-12-27

申请号：US11607119

申请日：2006-12-01

申请人： Yoshinobu Ishikawa ,  Tadashi Munakata ,  Yoshio Ogimura ,  Nobuhiko Teshima ,  Shigeo Nakagaki ,  Hitoshi Kawamoto ,  Kenichi Fujii ,  Yoshifumi Ikeda ,  Kazuhisa Hara ,  Takayuki Kikuchi

发明人： Yoshinobu Ishikawa ,  Tadashi Munakata ,  Yoshio Ogimura ,  Nobuhiko Teshima ,  Shigeo Nakagaki ,  Hitoshi Kawamoto ,  Kenichi Fujii ,  Yoshifumi Ikeda ,  Kazuhisa Hara ,  Takayuki Kikuchi

IPC分类号： B66B21/00 ,  B66B21/02

CPC分类号： B66B23/022 ,  B65G21/22

摘要： A footstep guide rail (3) (rail body 3a) is arranged so that a level H of a horizontal surface is set at the position obtained by adding a designated offset δ to a tangential line L of a drive sprocket (9) and the footstep guide rail (3) is provided, at its one end on an introductory side of the drive sprocket (9), with a curved part (13). At a reference position closest to the drive sprocket (9), the horizontal surface of the footstep guide rail (3) is changed to the curved part (13). Consequently, it is possible to absorb velocity unevenness of one footstep roller approaching the drive sprocket (9).

摘要翻译： 脚踏导轨（3）（导轨体3a）被布置成使得水平表面的水平H被设置在通过将指定的偏移δ加到驱动链轮（9）的切线L和脚步 导轨（3）的一端设置在驱动链轮（9）的前导侧，具有弯曲部（13）。 在最靠近驱动链轮（9）的基准位置处，脚踏导轨（3）的水平面变成弯曲部（13）。 因此，可以吸收接近驱动链轮（9）的一个脚踏辊的速度不均匀性。

公开(公告)号：US07579216B2

公开(公告)日：2009-08-25

申请号：US12118752

申请日：2008-05-12

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/58

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

公开(公告)号：US20060108196A1

公开(公告)日：2006-05-25

申请号：US11223797

申请日：2005-09-12

申请人： Yoshinobu Ishikawa ,  Tadashi Munakata ,  Yoshio Ogimura ,  Nobuhiko Teshima ,  Shigeo Nakagaki ,  Hitoshi Kawamoto ,  Kenichi Fujii ,  Tomohiko Matsuura ,  Yoshifumi Ikeda ,  Kazuhisa Hara ,  Takayuki Kikuchi

发明人： Yoshinobu Ishikawa ,  Tadashi Munakata ,  Yoshio Ogimura ,  Nobuhiko Teshima ,  Shigeo Nakagaki ,  Hitoshi Kawamoto ,  Kenichi Fujii ,  Tomohiko Matsuura ,  Yoshifumi Ikeda ,  Kazuhisa Hara ,  Takayuki Kikuchi

IPC分类号： B66B21/00

CPC分类号： B66B23/022

摘要： A mountainous or valley-shaped curved part 13 is provided in a part of a footstep guide rail 3 for guiding a movement of footstep rollers 5 linked by a footstep chain 7, the part being positioned in the vicinity of a drive sprocket 9. Consequently, owing to meshing of the footstep rollers 5 with the drive sprocket 9, an unevenness in velocity of the footstep rollers 5 is absorbed by the curved part 13, so that a moving velocity of the footstep rollers 5 moving on the downstream of the curved part 13 is maintained constantly, suppressing vibrating of the footsteps 4.

摘要翻译： 在脚踏导轨3的一部分设置有山形或谷状的弯曲部13，用于引导由脚步链7连接的脚踏辊5的移动，该脚部滚子5位于驱动链轮9的附近。因此， 由于脚踏辊5与驱动链轮9的啮合，脚踏辊5的速度不均匀被弯曲部13吸收，使脚踏辊5的移动速度在弯曲部13的下游移动 保持不间断，抑制脚步4的振动。

公开(公告)号：US08877613B2

公开(公告)日：2014-11-04

申请号：US12894987

申请日：2010-09-30

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/02 ,  H01L23/00 ,  H01L21/56 ,  H01L21/67 ,  H01L23/31

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

公开(公告)号：US20090291529A1

公开(公告)日：2009-11-26

申请号：US12534183

申请日：2009-08-03

申请人： TADASHI MUNAKATA ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： TADASHI MUNAKATA ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/78 ,  H01L21/50

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。