公开(公告)号：US20060141677A1

公开(公告)日：2006-06-29

申请号：US11360512

申请日：2006-02-24

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/50 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

公开(公告)号：US07033857B2

公开(公告)日：2006-04-25

申请号：US10462463

申请日：2003-06-17

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/44

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

公开(公告)号：US6141862A

公开(公告)日：2000-11-07

申请号：US726932

申请日：1996-10-07

申请人： Hiroshi Matsui ,  Yoshinobu Ishikawa ,  Tadashi Munakata ,  Yoshikata Kobayashi ,  Takeshi Takahara ,  Yoshihiko Nakada ,  Yukio Someya

发明人： Hiroshi Matsui ,  Yoshinobu Ishikawa ,  Tadashi Munakata ,  Yoshikata Kobayashi ,  Takeshi Takahara ,  Yoshihiko Nakada ,  Yukio Someya

IPC分类号： F01D25/28 ,  B23P21/00 ,  B23Q15/00

CPC分类号： F01D25/285 ,  F05D2230/60 ,  F05D2230/70 ,  Y10T29/4932 ,  Y10T29/49346 ,  Y10T29/53061 ,  Y10T29/53943 ,  Y10T29/53983

摘要： An apparatus for disassembling and assembling a gas turbine combustor comprises a hand assembly for holding a combustor component of a gas turbine, an inserting and drawing section which supports the hand assembly and moves the same in parallel to a central axis of the combustor component and a retainer for securing the inserting and drawing section onto a casing which constitutes an outer section of the gas turbine.

摘要翻译： 用于拆卸和组装燃气轮机燃烧器的装置包括用于保持燃气轮机的燃烧器部件的手部组件，支撑手组件并将其平行于燃烧器部件的中心轴线移动的插入和拉出部分，以及 保持器，用于将插入和拉伸部分固定到构成燃气轮机外部的壳体上。

公开(公告)号：US5274908A

公开(公告)日：1994-01-04

申请号：US950682

申请日：1992-09-25

申请人： Hisao Suzuki ,  Kouichi Yumita ,  Kazuhiro Tokitu ,  Tadashi Munakata ,  Yoshinobu Ishikawa ,  Etuo Minamihama ,  Koji Taira ,  Yasuharu Ujiie

发明人： Hisao Suzuki ,  Kouichi Yumita ,  Kazuhiro Tokitu ,  Tadashi Munakata ,  Yoshinobu Ishikawa ,  Etuo Minamihama ,  Koji Taira ,  Yasuharu Ujiie

IPC分类号： H05K13/04 ,  B23P19/00

CPC分类号： H05K13/0408 ,  H05K13/0452 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： A work or component mounting apparatus according to the present invention comprises a rotating drum arranged above a workbench and divided into upper and lower drums, a head unit detachably mounted to the lower drum of the rotating drum, a circular work head (or, in other words, a component head) attached to the head unit, a suction nozzle protruding from the outer peripheral surface of the work head toward the workbench, and a controller housed in the upper drum of the rotating drum for controlling the turning motion of the work head and the supply of suction pressure to the suction nozzle. While the lower drum is rotating, the suction nozzle of the work head repeats cycloid motion along the workbench with its posture kept fixed with respect to the workbench. While repeating the cycloid motion, the nozzle receives a work from a work feeder of the workbench by suction, and mounts the work on a printed board on the workbench.

摘要翻译： 根据本发明的工件或部件安装装置包括：设置在工作台上方并分成上鼓和下鼓的旋转鼓，可拆卸地安装到旋转鼓的下滚筒的头单元，圆形工作头（或另一个） 单词，组件头）附接到头单元，从工作头的外周表面朝向工作台突出的吸嘴，以及容纳在旋转鼓的上鼓中的控制器，用于控制工作头的转动 并向吸嘴提供吸入压力。 当下滚筒旋转时，工作头的吸嘴沿着工作台重复摆线运动，其姿势相对于工作台保持固定。 当重复摆线运动时，喷嘴通过抽吸从工作台的工作进给器接收工件，并将工件安装在工作台上的印刷板上。

公开(公告)号：US07816185B2

公开(公告)日：2010-10-19

申请号：US12534183

申请日：2009-08-03

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L23/485

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

公开(公告)号：US20080286902A1

公开(公告)日：2008-11-20

申请号：US12118752

申请日：2008-05-12

申请人： Tadashi MUNAKATA ,  Shingo OOSAKA ,  Mitsuru KINOSHITA ,  Yoshihiko YAMAGUCHI ,  Noriyuki TAKAHASHI

发明人： Tadashi MUNAKATA ,  Shingo OOSAKA ,  Mitsuru KINOSHITA ,  Yoshihiko YAMAGUCHI ,  Noriyuki TAKAHASHI

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

公开(公告)号：US07384820B2

公开(公告)日：2008-06-10

申请号：US11360512

申请日：2006-02-24

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

公开(公告)号：US06491136B2

公开(公告)日：2002-12-10

申请号：US09816221

申请日：2001-03-26

申请人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

发明人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

IPC分类号： B66B1108

CPC分类号： B66B11/008

摘要： An elevator apparatus is provided with an elevator path having a restricted height. Under a roping ratio of 1:1, a thin driving unit having a traction sheave 1 and a driving mechanism 2 is positioned between an inner wall 3a of the elevator path 3 and a space occupied by an elevator car 4 rising and falling in the elevator path 3. One end of a suspension rope 7 is fixed to the elevator car 4 in a position below a ceiling 4c of the elevator car 4. With the arrangement, the car 4 can move close to the ceiling 4c of the elevator car 4 effectively. Further, it is possible to reduce respective heights of the elevator path 3 and a building equipped with the elevator apparatus.

公开(公告)号：US06488124B1

公开(公告)日：2002-12-03

申请号：US09160596

申请日：1998-09-25

申请人： Kunio Yasuda ,  Yoshiaki Fujita ,  Kosei Kamimura ,  Ikuo Asami ,  Yasuyuki Wagatsuma ,  Kiyoshi Kobayashi ,  Tadashi Munakata ,  Shin Murakami ,  Yoshinobu Ishikawa ,  Takeshi Miyata ,  Mitsuo Hayase

发明人： Kunio Yasuda ,  Yoshiaki Fujita ,  Kosei Kamimura ,  Ikuo Asami ,  Yasuyuki Wagatsuma ,  Kiyoshi Kobayashi ,  Tadashi Munakata ,  Shin Murakami ,  Yoshinobu Ishikawa ,  Takeshi Miyata ,  Mitsuo Hayase

IPC分类号： B66B1108

CPC分类号： B66B11/08 ,  B66B11/0045

摘要： In an elevator, a driving unit is installed at the top of an elevator shaft above a counterweight. Traction sheaves engage with ropes and are rotated by the driving device. These traction sheaves are positioned close to wall surfaces of the elevator shaft, that are adjacent to its wall surface facing the counterweight. The traction sheaves are also positioned outside the horizontally projected plane of a car.

摘要翻译： 在电梯中，驱动单元安装在配重上方的电梯井的顶部。 牵引滑轮与绳索啮合并由驱动装置旋转。 这些牵引滑轮位于电梯井壁的靠近其面向配重的壁表面的墙壁表面附近。 牵引滑轮也位于汽车的水平投影平面外。

公开(公告)号：US06390243B2

公开(公告)日：2002-05-21

申请号：US09816219

申请日：2001-03-26

申请人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

发明人： Kiyoshi Kobayashi ,  Tadashi Munakata ,  Kosei Kamimura ,  Yasuyuki Wagatsuma ,  Hisao Yamamoto ,  Koji Yajima

IPC分类号： B66B1108

CPC分类号： B66B11/008

摘要： An elevator apparatus is provided with an elevator path having a restricted height. Under a roping ratio of 1:1, a thin driving unit having a traction sheave 1 and a driving mechanism 2 is positioned between an inner wall 3a of the elevator path 3 and a space occupied by an elevator car 4 rising and falling in the elevator path 3. One end of a suspension rope 7 is fixed to the elevator car 4 in a position below a ceiling 4c of the elevator car 4. With the arrangement, the car 4 can move close to the ceiling 4c of the elevator car 4 effectively. Further, it is possible to reduce respective heights of the elevator path 3 and a building equipped with the elevator apparatus.

摘要翻译： 电梯装置设有具有有限高度的电梯通道。 在1：1的绳索比下，具有牵引滑轮1和驱动机构2的薄驱动单元位于电梯通道3的内壁3a和升降电梯所占据的电梯轿厢4之间 悬挂绳索7的一端在电梯轿厢4的天花板4c下方的位置固定在电梯轿厢4上。由此，轿厢4能够有效地移动到电梯轿厢4的天花板4c附近 。 此外，可以降低电梯通道3和装备有电梯装置的建筑物的各自的高度。