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公开(公告)号：US20110020984A1
公开(公告)日：2011-01-27
申请号：US12894987
申请日：2010-09-30
申请人： Tadashi MUNAKATA , Shingo OOSAKA , Mitsuru KINOSHITA , Yoshihiko YAMAGUCHI , Noriyuki TAKAHASHI
发明人： Tadashi MUNAKATA , Shingo OOSAKA , Mitsuru KINOSHITA , Yoshihiko YAMAGUCHI , Noriyuki TAKAHASHI
IPC分类号： H01L21/02
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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公开(公告)号：US20060141677A1
公开(公告)日：2006-06-29
申请号：US11360512
申请日：2006-02-24
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
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公开(公告)号：US07033857B2
公开(公告)日：2006-04-25
申请号：US10462463
申请日：2003-06-17
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/44
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
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公开(公告)号：US08877613B2
公开(公告)日：2014-11-04
申请号：US12894987
申请日：2010-09-30
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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公开(公告)号：US20090291529A1
公开(公告)日：2009-11-26
申请号：US12534183
申请日：2009-08-03
申请人： TADASHI MUNAKATA , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： TADASHI MUNAKATA , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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公开(公告)号：US07816185B2
公开(公告)日：2010-10-19
申请号：US12534183
申请日：2009-08-03
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L23/485
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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公开(公告)号：US20080286902A1
公开(公告)日：2008-11-20
申请号：US12118752
申请日：2008-05-12
申请人： Tadashi MUNAKATA , Shingo OOSAKA , Mitsuru KINOSHITA , Yoshihiko YAMAGUCHI , Noriyuki TAKAHASHI
发明人： Tadashi MUNAKATA , Shingo OOSAKA , Mitsuru KINOSHITA , Yoshihiko YAMAGUCHI , Noriyuki TAKAHASHI
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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公开(公告)号：US07384820B2
公开(公告)日：2008-06-10
申请号：US11360512
申请日：2006-02-24
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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公开(公告)号：US07579216B2
公开(公告)日：2009-08-25
申请号：US12118752
申请日：2008-05-12
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/58
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译： 一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封 通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个 托盘，并且分别从托盘传送半导体器件。 由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。
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