Dynamic memory protection
    122.
    发明授权

    公开(公告)号:US10740017B2

    公开(公告)日:2020-08-11

    申请号:US15963668

    申请日:2018-04-26

    Abstract: Aspects of the present disclosure relate to protecting the contents of memory in an electronic device, and in particular to systems and methods for transferring data between memories of an electronic device in the presence of strong magnetic fields. In one embodiment, a method of protecting data in a memory in an electronic device includes storing data in a first memory in the electronic device; determining, via a magnetic sensor, a strength of an ambient magnetic field; comparing the strength of the ambient magnetic field to a threshold; transferring the data in the first memory to a second memory in the electronic device upon determining that the strength of the ambient magnetic field exceeds the threshold; and transferring the data from the second memory to the first memory upon determining that the strength of the ambient magnetic field no longer exceeds the threshold.

    Differential spin orbit torque magnetic random access memory (SOT-MRAM) cell structure and array

    公开(公告)号:US10483457B1

    公开(公告)日:2019-11-19

    申请号:US16102941

    申请日:2018-08-14

    Abstract: Aspects of the disclosure provide magnetoresistive random access memory (MRAM) and methods. The MRAM generally includes a first magnetic tunnel junction (MTJ) storage element comprising a first fixed layer, a first insulating layer, and a first free layer, and a second MTJ storage element comprising a second fixed layer, a second insulating layer, and a second free layer. The MRAM further includes a conductive layer connected to a source line, first bit line, and a second bit line, wherein the first MTJ storage element is disposed above and connected to the conductive layer and the first bit line at a first end and connected to the first bit line at a second end, and wherein the second MTJ storage element is disposed above and connected to the conductive layer and the second bit line at a first end and connected to the second bit line at a second end.

    Magneto-resistive random access memory (MRAM) employing an integrated physically unclonable function (PUF) memory

    公开(公告)号:US10460780B2

    公开(公告)日:2019-10-29

    申请号:US15939923

    申请日:2018-03-29

    Abstract: Magneto-resistive random access memory (MRAM) employing an integrated physically unclonable function (PUF) memory. The MRAM includes an MRAM array comprising an MRAM data array of data MRAM bit cells and an MRAM PUF array comprising PUF MRAM bit cells to form an integrated MRAM PUF array in the MRAM array. A resistance sensed from the PUF MRAM bit cells is compared to a reference resistance between the reference MRAM bit cells in the accessed MRAM bit cell row circuit in response to a read operation to cancel or mitigate the effect of process variations on MRAM bit cell resistance. The difference in sensed resistance and reference resistance is used to generate a random PUF output. By integrating the MRAM PUF array into an MRAM array containing an MRAM data array, access circuitry can be shared to control access to the MRAM data array and MRAM PUF, thus saving memory area.

    Ferroelectric-modulated Schottky non-volatile memory

    公开(公告)号:US10102898B2

    公开(公告)日:2018-10-16

    申请号:US15829004

    申请日:2017-12-01

    Abstract: Ferroelectric-modulated Schottky non-volatile memory is disclosed. A resistive memory element is provided that is based on a semiconductive material. Metal elements are formed on a semiconductive material at two places such that two semiconductor-metal junctions are formed. The semiconductive material with the two semiconductor-metal junctions establishes a composite resistive element having a resistance and functions as a relatively fast switch with a relatively low forward voltage drop. Each metal element may couple a terminal to the resistive element. To provide a resistive element capable of being a resistive memory element to store distinctive memory states, a ferroelectric material is provided and disposed adjacent to the semiconductive material to create an electric field from a ferroelectric dipole. The orientation of the ferroelectric dipole changes the resistance of the resistive element to allow it to function as a resistive memory element.

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