公开(公告)号：US4150393A

公开(公告)日：1979-04-17

申请号：US766168

申请日：1979-12-20

申请人： Richard W. Wilson ,  Marcy B. Goldstein

发明人： Richard W. Wilson ,  Marcy B. Goldstein

IPC分类号： H01L23/047 ,  H01L23/057 ,  H01L23/66 ,  H01L23/02 ,  H01L23/12 ,  H01L39/02

CPC分类号： H01L23/057 ,  H01L23/047 ,  H01L23/66 ,  H01L2224/32188 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

摘要： A low parasitic microwave transistor package is provided including a metal header formed from a base member and having a cylindrical center portion; a metallized ceramic insulator formed in an annular ring which is attached to the metal header and surrounding the center portion thereof. A shallow channel is provided in the surface of the pedestal or center portion of the metal header in which a metallized beryllia insulator is attached. Metal leads are attached to the ceramic insulator. The metallized beryllia insulator is suitable for a semiconductor die chip to be attached to the outward surface thereof such that any one of the preferred electrodes of the semiconductor chip can be attached to the header, by stitch bonding, through a very low inductance, low resistance connection. The other electrodes of a semiconductor chip may be selectively attached, via stitch bonds, directly to the metal leads or connected in series thereto through MOS capacitor chips which can be attached to the remaining surface area of the pedestal.

摘要翻译： 提供了一种低寄生微波晶体管封装，包括由基底构件形成并具有圆柱形中心部分的金属集管; 形成在环形环中的金属化陶瓷绝缘体，其连接到金属集管并且围绕其中心部分。 在金属集管的基座或中心部分的表面中设置有一个浅的通道，其中金属化的铍绝缘体附接在其中。 金属引线连接到陶瓷绝缘体。 金属化铍绝缘体适用于半导体晶片芯片的外表面，使得半导体芯片的优选电极中的任何一个可以通过非常低的电感，低电阻的缝合连接到集管 连接。 半导体芯片的其他电极可以通过缝合键被选择性地附接到金属引线上或通过可连接到基座的剩余表面区域的MOS电容器芯片串联连接。

公开(公告)号：US4139859A

公开(公告)日：1979-02-13

申请号：US741747

申请日：1976-11-15

申请人： Terrence E. Lewis ,  Kenneth N. Abel

发明人： Terrence E. Lewis ,  Kenneth N. Abel

IPC分类号： H01L21/50 ,  H01L23/047 ,  H01L23/10 ,  H01L23/14 ,  H01L23/36 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L23/047 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152

摘要： A semiconductor device package and a method of making it. A woven fiber mat impregnated with an epoxy adhesive serves as a first housing member. It includes an opening therein for receiving a semiconductor device. The housing member is placed on a supporting heat sink and a lead frame placed on top of the housing member. This subassembly is heated to bond the elements together by curing the epoxy adhesive in the first housing member. A similar second housing member is then placed over the lead frame. The second housing member includes an opening therein which is slightly larger than the opening in the first housing member. A lid is placed on top of the second housing member to cover the opening after the semiconductor device has been bonded to the substrate within the openings in the housing members. The assembly is then again heated to bond the remaining elements together with the epoxy adhesive in the second housing member to form a completed package.

公开(公告)号：US3984166A

公开(公告)日：1976-10-05

申请号：US575180

申请日：1975-05-07

申请人： Robert V. Hutchison

发明人： Robert V. Hutchison

IPC分类号： H01L23/047 ,  H01L23/057 ,  H01L23/367 ,  H01L23/40 ,  H05K3/32 ,  H05K7/10 ,  H05K7/20 ,  H05K1/12 ,  H05K5/06

CPC分类号： H05K7/1061 ,  H01L23/047 ,  H01L23/057 ,  H01L23/3677 ,  H01L23/4093 ,  H05K3/32 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K2201/10598 ,  H05K2203/176 ,  H05K3/325

摘要： A semiconductor device package which can be readily mounted on a printed circuit board without requiring soldering or intermediate connectors. A supporting substrate has a unique lead frame configuration thereon in which the leads extend around side portions of the substrate and form integral spring contacts projecting from the lower surface of the substrate. The package preferably includes a metallic stud having a head portion mounted in the substrate for receiving a semiconductor device and a rod portion extending from the lower surface of the substrate. The rod portion of the stud can be removably secured in an aperture in a printed circuit board to engage the spring contacts with corresponding conductors on the circuit board.

摘要翻译： 一种可以容易地安装在印刷电路板上而不需要焊接或中间连接器的半导体器件封装。 支撑衬底在其上具有独特的引线框架结构，其中引线围绕衬底的侧部延伸并且形成从衬底的下表面突出的一体的弹簧触点。 封装优选地包括金属螺柱，其具有安装在基板中的头部，用于接收半导体器件和从基板的下表面延伸的杆部分。 螺柱的杆部分可以可拆卸地固定在印刷电路板的孔中，以使弹簧触头与电路板上的相应导体接合。

公开(公告)号：US3767839A

公开(公告)日：1973-10-23

申请号：US3767839D

申请日：1971-06-04

申请人： WELLS PLASTICS OF CALIFORNIA I

发明人： BEAL J

IPC分类号： H01L21/56 ,  H01L23/047 ,  H01L23/433 ,  H01L23/495 ,  H05H9/02

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/047 ,  H01L23/49541 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48

摘要： A rugged stable component housing is provided, for mounting a microelectronic device and hermetically sealing the area enclosing the device. A lead frame is mounted onto a base, and a dielectric body moulded onto the lead frame, bonding the lead frame to the base and providing a nest area. The nest area has the internal tips and the pad, if any, of the lead frame uncovered by the dielectric material. After mounting the microelectronic device, the nest area is hermetically sealed with a lid bonded to the dielectric body.

摘要翻译： 提供坚固的稳定部件壳体，用于安装微电子器件并密封封装器件的区域。 引线框架安装在基座上，并且模制在引线框架上的电介质体，将引线框架结合到基座并提供嵌套区域。 嵌套区域具有由电介质材料覆盖的引线框架的内部尖端和衬垫（如果有的话）。 在安装微电子器件之后，将嵌套区域与结合到电介质体的盖密封。

公开(公告)号：US3648357A

公开(公告)日：1972-03-14

申请号：US3648357D

申请日：1969-07-31

申请人： GEN DYNAMICS CORP

发明人： GREEN HARRY J JR

IPC分类号： B23K35/00 ,  H01L21/50 ,  H01L23/047 ,  B23K31/02

CPC分类号： H01L21/50 ,  B23K35/001 ,  H01L23/047 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/49146 ,  H01L2924/00

摘要： A method of hermetically sealing flat pack containers having Kovar cans and covers which are gold plated on their sealing surfaces is described. The containers are first vacuum pretinned with an eutectic gold-tin solder so as to dissolve a constant amount of gold from the gold plated sealing surfaces. The containers and covers thus prepared are then juxtaposed at their sealing surfaces and fused together to hermetically seal the containers. Microelectronic devices are assembled within the container before the pretinned layers are fused together.

摘要翻译： 描述了一种密封扁平包装容器的方法，该容器具有在其密封表面上镀金的科瓦罐和盖。 容器首先用共晶金 - 锡焊料进行真空预处理，以便从镀金密封表面溶解恒定量的金。 然后如此制备的容器和盖子在其密封表面处并置并且熔合在一起以气密地密封容器。 将微电子器件组装在容器内，然后将预浸层融合在一起。

公开(公告)号：US3621338A

公开(公告)日：1971-11-16

申请号：US3621338D

申请日：1970-01-02

申请人： FAIRCHILD CAMERA INSTR CO

发明人： ROGERS BRYANT C ,  WAKELY WILBUR T

IPC分类号： H01L23/34 ,  H01L21/60 ,  H01L23/04 ,  H01L23/047 ,  H01L23/12 ,  H01L23/495 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L23/49551 ,  H01L23/047 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K3/4092 ,  H01L2924/00

摘要： A thin patterned conductive foil is embedded between a pair of adjacent dielectric layers, at least one of which has a hole pattern therein. Portions of the foil cover the holes, so that upon insertion of conductive material into the holes to puncture the foil, electrical contact is provided therebetween.

公开(公告)号：US3484533A

公开(公告)日：1969-12-16

申请号：US3484533D

申请日：1966-09-29

申请人： TEXAS INSTRUMENTS INC

发明人： KAUFFMAN JOHN E

IPC分类号： H01L23/047 ,  H01L23/495 ,  H05K5/06

CPC分类号： H01L23/047 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/3011 ,  Y10T29/49121 ,  Y10T428/12528 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：US3404213A

公开(公告)日：1968-10-01

申请号：US21256362

申请日：1962-07-26

申请人： OWENS ILLINOIS INC

发明人： BROOKOVER GEORGE B ,  HUDECEK CARL J ,  OLIVER JOHN H

IPC分类号： H01J5/28 ,  H01J5/44 ,  H01L21/50 ,  H01L23/047 ,  H01L23/057

CPC分类号： H01L23/057 ,  H01J5/28 ,  H01J5/44 ,  H01J2893/0036 ,  H01J2893/0044 ,  H01L21/50 ,  H01L23/047 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T29/49211 ,  H01L2924/00014

公开(公告)号：US3377523A

公开(公告)日：1968-04-09

申请号：US48608065

申请日：1965-09-09

申请人： ASEA AB

发明人： ERIC ANDERSSON NILS ,  GORAN LILJA

IPC分类号： H01L23/047 ,  H01L23/36 ,  H01L23/40 ,  H01L29/00

CPC分类号： H01L23/40 ,  H01L23/047 ,  H01L23/36 ,  H01L29/00 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

公开(公告)号：US2999963A

公开(公告)日：1961-09-12

申请号：US4225560

申请日：1960-07-12

申请人： SIEMENS AG

发明人： HEINZ SCHNEIDER

IPC分类号： H01L23/047 ,  H01L25/07 ,  H05K7/02

CPC分类号： H01L25/074 ,  H01L23/047 ,  H01L2924/0002 ,  H05K7/02 ,  H01L2924/00