专利检索 ap:("FAIRCHILD CAMERA INSTR CO") AND inv:"ROGERS BRYANT C" 第 1 页

1.

发明授权
Diaphragm-connected, leadless package for semiconductor devices 失效
标题翻译：透膜连接，半导体器件的无铅封装

公开(公告)号：US3621338A

公开(公告)日：1971-11-16

申请号：US3621338D

申请日：1970-01-02

申请人： FAIRCHILD CAMERA INSTR CO

发明人： ROGERS BRYANT C , WAKELY WILBUR T

IPC分类号： H01L23/34 , H01L21/60 , H01L23/04 , H01L23/047 , H01L23/12 , H01L23/495 , H01L23/498 , H05K3/40

CPC分类号： H01L23/49551 , H01L23/047 , H01L23/49861 , H01L2924/0002 , H05K3/4092 , H01L2924/00

摘要： A thin patterned conductive foil is embedded between a pair of adjacent dielectric layers, at least one of which has a hole pattern therein. Portions of the foil cover the holes, so that upon insertion of conductive material into the holes to puncture the foil, electrical contact is provided therebetween.