TARGET MATERIAL REFINEMENT DEVICE AND TARGET SUPPLY APPARATUS
    111.
    发明申请
    TARGET MATERIAL REFINEMENT DEVICE AND TARGET SUPPLY APPARATUS 有权
    目标材料精炼装置和目标供应装置

    公开(公告)号:US20130221587A1

    公开(公告)日:2013-08-29

    申请号:US13770939

    申请日:2013-02-19

    CPC classification number: C22B9/00 H05G2/005 H05G2/006 H05G2/008

    Abstract: A target material refinement device may include a refinement tank to accommodate a target material, a heating section to heat the interior of the refinement tank, and an oxygen-atom removing section to remove oxygen atoms present in the target material.

    Abstract translation: 目标材料细化装置可以包括用于容纳目标材料的精制罐,用于加热精制罐内部的加热部分和氧原子去除部分以除去存在于目标材料中的氧原子。

    LASER APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES

    公开(公告)号:US20240429672A1

    公开(公告)日:2024-12-26

    申请号:US18827268

    申请日:2024-09-06

    Abstract: A laser apparatus includes a first semiconductor laser outputting first continuous-wave laser light; a first amplifier a wavelength conversion system outputting second pulse laser light; an excimer amplifier amplifying the second pulse laser light; a monitor module; and a processor calculating a center wavelength being an average of a measured value of the wavelength of the third pulse laser light output at the first target wavelength and a measured value of the wavelength thereof output at the second target wavelength, calculating a wavelength difference of the measurement values, calculating an average current value of a current flowing through the first semiconductor laser, calculating a current value difference such that a difference between a target wavelength difference and the wavelength difference decreases, and calculating a first current value at the first target wavelength and a second current value at the second target wavelength to control the first semiconductor laser.

    LASER PROCESSING APPARATUS AND METHOD FOR PROCESSING WORKPIECE

    公开(公告)号:US20240375213A1

    公开(公告)日:2024-11-14

    申请号:US18779447

    申请日:2024-07-22

    Abstract: A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system that shapes laser light such that a first laser light irradiated region of a mask blocking part of the laser light has a rectangular shape having short edges and long edges, the beam shaping optical system capable of causing one of a first radiation width of the first irradiated region in the direction parallel to the short edges and a second radiation width of the first irradiated region in the direction parallel to the long edges to be fixed and causing the other to be changed, a projection optical system that projects a pattern on the mask onto the workpiece, and a mover that moves the first irradiated region at least in the direction parallel to the short edges to move a second laser light irradiated region of the workpiece.

    LINE NARROWING GAS LASER DEVICE, WAVELENGTH CONTROL METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

    公开(公告)号:US20230064314A1

    公开(公告)日:2023-03-02

    申请号:US18047596

    申请日:2022-10-18

    Abstract: A line narrowing gas laser device includes an actuator changing a center wavelength of pulse laser light, and a processor controlling the actuator. The processor reads parameters including a number of irradiation pulses of pulse laser light to be radiated to one location of an irradiation receiving object, a shortest wavelength, and a longest wavelength; sets a first pattern with which the center wavelength is changed to approach the longest wavelength from the shortest wavelength and a second pattern with which the center wavelength is changed to approach the shortest wavelength from the longest wavelength such that at least one of the first pattern and the second pattern when the number of irradiation pulses is an even number is different from corresponding one when the number of irradiation pulses is an odd number; and controls the actuator so that the first pattern and the second pattern are alternately performed.

    EXPOSURE METHOD, EXPOSURE SYSTEM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES

    公开(公告)号:US20220390851A1

    公开(公告)日:2022-12-08

    申请号:US17818174

    申请日:2022-08-08

    Abstract: An exposure method includes reading data representing a relationship between a first parameter relating to an energy ratio between energy of first pulsed laser light having a first wavelength and energy of second pulsed laser light having a second wavelength longer than the first wavelength and a second parameter relating to a sidewall angle of a resist film that is the angle of a sidewall produced when the resist film is exposed to the first pulsed laser light and the second pulsed laser light, and determining a target value of the first parameter based on the data and a target value of the second parameter; and exposing the resist film to the first pulsed laser light and the second pulsed laser light by controlling a narrowed-line gas laser apparatus to output the first pulsed laser light and the second pulsed laser light based on the target value of the first parameter.

    MIRROR FOR EXTREME ULTRAVIOLET LIGHT AND EXTREME ULTRAVIOLET LIGHT GENERATING APPARATUS

    公开(公告)号:US20200209759A1

    公开(公告)日:2020-07-02

    申请号:US16814700

    申请日:2020-03-10

    Abstract: A mirror for extreme ultraviolet light includes: a substrate; a multilayer film provided on the substrate and configured to reflect extreme ultraviolet light; and a capping layer provided on the multilayer film, and the capping layer includes a photocatalyst layer containing a photocatalyst, a promotor layer arranged between the photocatalyst layer and the multilayer film and containing a metal for supporting a photocatalytic ability of the photocatalyst contained in the photocatalyst layer, and a barrier layer arranged between the promotor layer and the multilayer film and configured to prevent diffusion of the metal into the multilayer film.

    MIRROR FOR EXTREME ULTRAVIOLET LIGHT AND EXTREME ULTRAVIOLET LIGHT GENERATING APPARATUS

    公开(公告)号:US20200209755A1

    公开(公告)日:2020-07-02

    申请号:US16814584

    申请日:2020-03-10

    Abstract: A mirror for extreme ultraviolet light includes: a substrate (41); a multilayer film (42) provided on the substrate and configured to reflect extreme ultraviolet light; and a capping layer (53) provided on the multilayer film, and the capping layer includes a first layer (61) containing a compound of a metal having lower electronegativity than Ti and a non-metal and having a lower density than TiO2, and a second layer (62) arranged between the first layer and the multilayer film and having a higher density than the first layer.

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