LASER PROCESSING APPARATUS AND METHOD FOR PROCESSING WORKPIECE

    公开(公告)号:US20240375213A1

    公开(公告)日:2024-11-14

    申请号:US18779447

    申请日:2024-07-22

    Abstract: A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system that shapes laser light such that a first laser light irradiated region of a mask blocking part of the laser light has a rectangular shape having short edges and long edges, the beam shaping optical system capable of causing one of a first radiation width of the first irradiated region in the direction parallel to the short edges and a second radiation width of the first irradiated region in the direction parallel to the long edges to be fixed and causing the other to be changed, a projection optical system that projects a pattern on the mask onto the workpiece, and a mover that moves the first irradiated region at least in the direction parallel to the short edges to move a second laser light irradiated region of the workpiece.

    LASER PROCESSING APPARATUS, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD

    公开(公告)号:US20240058894A1

    公开(公告)日:2024-02-22

    申请号:US18487994

    申请日:2023-10-16

    CPC classification number: B23K26/1462 B23K26/126

    Abstract: A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.

    LASER PROCESSING APPARATUS, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD

    公开(公告)号:US20210046584A1

    公开(公告)日:2021-02-18

    申请号:US17088704

    申请日:2020-11-04

    Abstract: A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.

    LASER PROCESSING APPARATUS AND METHOD FOR PROCESSING WORKPIECE

    公开(公告)号:US20210291297A1

    公开(公告)日:2021-09-23

    申请号:US17341554

    申请日:2021-06-08

    Inventor: Masashi SHIMBORI

    Abstract: A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system configured to shape laser light in such a way that a laser light irradiated region of a mask configured to block part of the laser light has a rectangular shape having short edges and long edges, a second radiation width of the irradiated region in the direction parallel to the long edges being changeable independently of a first radiation width of the irradiated region in the direction parallel to the short edges, and the irradiated region being movable in the direction parallel to the long edges, a projection optical system configured to project a pattern of the mask on the workpiece placed on the placement base, and a mover configured to be capable of moving the irradiated region in the direction parallel to the short edges.

    LASER PROCESSING APPARATUS AND METHOD FOR PROCESSING WORKPIECE

    公开(公告)号:US20210252634A1

    公开(公告)日:2021-08-19

    申请号:US17307252

    申请日:2021-05-04

    Abstract: A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system that shapes laser light such that a first laser light irradiated region of a mask blocking part of the laser light has a rectangular shape having short edges and long edges, the beam shaping optical system capable of causing one of a first radiation width of the first irradiated region in the direction parallel to the short edges and a second radiation width of the first irradiated region in the direction parallel to the long edges to be fixed and causing the other to be changed, a projection optical system that projects a pattern on the mask onto the workpiece, and a mover that moves the first irradiated region at least in the direction parallel to the short edges to move a second laser light irradiated region of the workpiece.

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