GAS LASER APPARATUS, LASER BEAM EMITTING METHOD OF GAS LASER APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD

    公开(公告)号:US20210336403A1

    公开(公告)日:2021-10-28

    申请号:US17371930

    申请日:2021-07-09

    Inventor: Daisuke TEI

    Abstract: A gas laser apparatus includes a chamber; a window provided in the chamber; an optical path tube connected to the chamber; a gas supply port that supplies a purge gas into the optical path tube; an exhaust port that exhausts a gas in the optical path tube; and a control unit, the exhaust port including a main exhaust port provided in the optical path tube, and an auxiliary exhaust port provided in the optical path tube upstream of a flow of the gas in the optical path tube with respect to positions of the window and the main exhaust port, the control unit causing the gas to be exhausted through the main exhaust port before a laser beam is emitted from the chamber and causing the gas to be exhausted through the auxiliary exhaust port in at least a partial period when the laser beam is emitted.

    LASER APPARATUS AND METHOD FOR MANUFACTURING OPTICAL ELEMENT

    公开(公告)号:US20200067257A1

    公开(公告)日:2020-02-27

    申请号:US16674994

    申请日:2019-11-05

    Abstract: A laser apparatus including an optical element made of a CaF2 crystal and configured to transmit an ultraviolet laser beam obliquely incident on one surface of the optical element, the electric field axis of the P-polarized component of the laser beam propagating through the optical element coinciding with one axis contained in of the CaF2 crystal, with the P-polarized component defined with respect to the one surface. A method for manufacturing an optical element, the method including causing a seed CaF2 crystal to undergo crystal growth along one axis contained in to form an ingot, setting a cutting axis to be an axis inclining by an angle within 14.18±5° with respect to the crystal growth direction toward the direction of another axis contained in , which differs from the crystal growth direction, and cutting the ingot along a plane perpendicular to the cutting axis.

Patent Agency Ranking