Locally Enhanced Direct Liquid Cooling System for High Power Applications
    116.
    发明申请
    Locally Enhanced Direct Liquid Cooling System for High Power Applications 有权
    用于大功率应用的本地增强型直接液体冷却系统

    公开(公告)号:US20170020027A1

    公开(公告)日:2017-01-19

    申请号:US14799594

    申请日:2015-07-15

    Abstract: The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.

    Abstract translation: 本发明公开了一种流体冷却组件,其有助于组件内的紊流,从而获得更好的散热效果。 冷却组件包括具有用于流体通过的入口和出口的封闭腔室; 加上散热器; 多个微柱和安装在组件内部的多个散热翅片。 当流体流过室时,这些元件组合适于在流体上产生增强的湍流,以便有效地从所述散热器散热通过流体。

    SYSTEMS AND METHODS FOR MITIGATION OF SELF-INTERFERENCE IN SPECTRALLY EFFICIENT FULL DUPLEX COMMINUCATIONS
    118.
    发明申请
    SYSTEMS AND METHODS FOR MITIGATION OF SELF-INTERFERENCE IN SPECTRALLY EFFICIENT FULL DUPLEX COMMINUCATIONS 有权
    用于缓解高效全双工委员会自我干扰的系统和方法

    公开(公告)号:US20160285486A1

    公开(公告)日:2016-09-29

    申请号:US14665819

    申请日:2015-03-23

    Abstract: Systems and methods which provide mitigation of self-interference in spectrally efficient full duplex (e.g., transmit and receive using the same frequency simultaneously) communications are described. Embodiments provide an interference mitigation structure having a multi-tap vector modulator interference cancellation circuit operable to cancel time varying multipath interference in the analog RF domain. A multi-tap vector modulator interference cancellation circuit of embodiments may comprise part of a multi-stage interference cancellation circuit, such as a multi-stage interference cancellation circuit comprising a multi-tap vector modulator interference cancellation circuit and a digital residual interference cancellation circuit. A digital residual interference cancellation circuit of embodiments provides residual interference cancellation. A multi-stage interference cancellation circuit configuration of embodiments is operable to provide cancellation of strong multipath signals as well as cancellation of residual multipath signals, including interference in the received signal associated with circulator leakage, antenna reflection and multipath.

    Abstract translation: 描述了在频谱上有效的全双工(例如,同时使用相同频率进行发送和接收)通信中减轻自干扰的系统和方法。 实施例提供了具有多抽头矢量调制器干扰消除电路的干扰减轻结构,其可用于消除模拟RF域中的时变多径干扰。 实施例的多抽头矢量调制器干扰消除电路可以包括多级干扰消除电路的一部分,例如包括多抽头矢量调制器干扰消除电路和数字残留干扰消除电路的多级干扰消除电路。 实施例的数字残留干扰消除电路提供残余干扰消除。 实施例的多级干扰消除电路配置可操作以提供强多径信号的消除以及残留多径信号的消除,包括与循环器泄漏,天线反射和多路径相关联的接收信号中的干扰。

    Additive for electrodeposition
    120.
    发明授权
    Additive for electrodeposition 有权
    电沉积添加剂

    公开(公告)号:US09273407B2

    公开(公告)日:2016-03-01

    申请号:US14215092

    申请日:2014-03-17

    CPC classification number: C25D3/38 C07C217/28 C07D207/06 C07D211/14 C25D7/00

    Abstract: This invention relates to a new compound represented by formula (I). Particularly, the new compound is used as an additive in copper electroplating. A chemical structure for the leveler, an electroplating bath containing the same, a method of preparing the additive and a method of electroplating a substrate with the electroplating bath containing the additive are disclosed. The additive compound/molecule of the present invention provides a branched structure at each ends, wherein each of the branches comprises a positively charged nitrogen moiety. The additive compound/molecule is formed by linking the branches having the positive charged nitrogen moieties to the backbone of the additive compound/molecule. This leads to a high charge density novel additive compound/molecule.

    Abstract translation: 本发明涉及由式(I)表示的新化合物。 特别地,该新化合物在铜电镀中用作添加剂。 公开了一种用于矫平机的化学结构,含有它的电镀浴,制备该添加剂的方法和一种使用含有该添加剂的电镀浴电镀衬底的方法。 本发明的添加剂化合物/分子在每个末端提供支链结构,其中每个分支包含带正电荷的氮部分。 通过将具有正电荷的氮部分的分支连接到添加剂化合物/分子的主链上而形成添加剂化合物/分子。 这导致高电荷密度的新型添加剂化合物/分子。

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