公开(公告)号：US10651525B2

公开(公告)日：2020-05-12

申请号：US15997644

申请日：2018-06-04

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Mathew Manusharow ,  Krishna Bharath ,  Zhichao Zhang ,  Yidnekachew S. Mekonnen ,  Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Javier Soto

IPC: H01P3/06 ,  H01P3/02 ,  H05K1/02 ,  H01P3/08

Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

公开(公告)号：US10510669B2

公开(公告)日：2019-12-17

申请号：US15876080

申请日：2018-01-19

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US10353146B2

公开(公告)日：2019-07-16

申请号：US15635881

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Michael C. Rifani ,  Sasha N. Oster ,  Adel A. Elsherbini

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42 ,  H05K1/02 ,  H04B10/80

Abstract: Various embodiments disclosed relate to a stretchable packaging system. The system includes a first electronic component. The first electronic component includes a first optical emitter. The system further includes a second electronic component. The second electronic component includes a first receiver. An optical interconnect including a first elastomer having a first refractive index connects the first optical emitter to the first receiver. An encapsulate layer including a second elastomer having a second refractive index at least partially encapsulates the first electronic component, the second electronic component, and the optical interconnect.

公开(公告)号：US20190198447A1

公开(公告)日：2019-06-27

申请号：US16329644

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Kristof Darmawikarta ,  Robert A. May ,  Sri Ranga Sai Boyapati

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L25/18

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

公开(公告)号：US10249925B2

公开(公告)日：2019-04-02

申请号：US15282086

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P3/14 ,  H01P11/00 ,  G06F1/18 ,  H01P3/16

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

公开(公告)号：US20190089036A1

公开(公告)日：2019-03-21

申请号：US16192293

申请日：2018-11-15

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Gilbert W. Dewey ,  Hyung-Jin Lee

IPC: H01P3/16 ,  H01P1/208 ,  H01L23/66

Abstract: Embodiments may relate to a dielectric waveguide that includes a substrate and a waveguide material disposed within the substrate. The dielectric waveguide may further include a waveguide launcher electromagnetically and physically coupled with the waveguide material, wherein the waveguide launcher is exposed at a side of the dielectric substrate. Other embodiments may be described or claimed.

公开(公告)号：US20190081705A1

公开(公告)日：2019-03-14

申请号：US16179215

申请日：2018-11-02

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H04B10/2581 ,  G02B6/43 ,  H04B10/50

Abstract: There is disclosed in one example a communication apparatus, including: a local data interface; a data encoder to encode a transmission into n millimeter to terahertz-band transmission components, wherein n≥2, each transmission component having an independent mode of each other transmission component; and a plurality of n launchers to launch the transmission components onto n closely-bundled waveguides, wherein the closely-bundled waveguides are not shielded from one another.

公开(公告)号：US10206277B2

公开(公告)日：2019-02-12

申请号：US14975162

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Rajendra C. Dias ,  Manish Dubey ,  Tatyana N. Andryushchenko ,  Aleksandar Aleksov ,  David W. Staines

IPC: H05K1/00 ,  H05K1/02 ,  A41D1/00 ,  A43B3/00 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for gradient encapsulant protection of devices in stretchable electronic. For instance, in accordance with one embodiment, there is an apparatus with an electrical device on a stretchable substrate; one or more stretchable electrical interconnects coupled with the electrical device; one or more electrical components electrically coupled with the electrical device via the one or more stretchable electrical interconnects; and a gradient encapsulating material layered over and fully surrounding the electrical device and at least a portion of the one or more stretchable electrical interconnects coupled thereto, in which the gradient encapsulating material has an elastic modulus greater than the stretchable substrate and in which the elastic modulus of the gradient encapsulating material is less than the electrical device. Other related embodiments are disclosed.

公开(公告)号：US10186465B2

公开(公告)日：2019-01-22

申请号：US15748138

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Feras Eid ,  Adel A. Elsherbini ,  Henning Braunisch ,  Yidnekachew S. Mekonnen ,  Krishna Bharath ,  Mathew J. Manusharow ,  Aleksandar Aleksov ,  Nathan Fritz

IPC: H01L23/14 ,  H01L23/12 ,  H01L23/473 ,  H01L21/48 ,  H01L23/538 ,  H01L23/492

Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.

公开(公告)号：US20190006457A1

公开(公告)日：2019-01-03

申请号：US15638044

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Robert Alan May ,  Sandeep Gaan

IPC: H01L49/02 ,  H01L23/522

Abstract: A semiconductor device may include a plurality of layers of a substrate. A die may be coupled to at least one of the plurality of layers of the substrate. A passive electrical component may be integrally formed within the layers of the substrate. The passive electrical component may be a resistor or a capacitor. One or more conductors may be configured to allow electrical communication between the passive electrical component and the die. The one or more conductors may be integrally formed within the plurality of layers of the substrate.