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公开(公告)号：US20240003000A1
公开(公告)日：2024-01-04
申请号：US18201055
申请日：2023-05-23
Applicant: Applied Materials, Inc.
Inventor： Mingwei ZHU , Zihao YANG , Nag B. PATIBANDLA , Ludovic GODET , Yong CAO , Daniel Lee DIEHL , Zhebo CHEN
CPC classification number: C23C14/564 , C23C14/0641 , C23C14/34 , H01J2237/24514 , H01J37/3441 , H01J37/3405 , H01J37/3464
Abstract: A structure including a metal nitride layer is formed on a workpiece by pre-conditioning a chamber that includes a metal target by flowing nitrogen gas and an inert gas at a first flow rate ratio into the chamber and igniting a plasma in the chamber before placing the workpiece in the chamber, evacuating the chamber after the preconditioning, placing the workpiece on a workpiece support in the chamber after the preconditioning, and performing physical vapor deposition of a metal nitride layer on the workpiece in the chamber by flowing nitrogen gas and the inert gas at a second flow rate ratio into the chamber and igniting a plasma in the chamber. The second flow rate ratio is less than the first flow rate ratio.
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公开(公告)号：US20230408913A1
公开(公告)日：2023-12-21
申请号：US18241705
申请日：2023-09-01
Applicant: Applied Materials, Inc.
Inventor： Yongan XU , Jinxin FU , Jhenghan YANG , Ludovic GODET
CPC classification number: G03F7/0007 , G02B6/136 , G02B6/122
Abstract: The present disclosure generally relates to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A first process of forming the nanostructures comprises depositing a first layer of a first material on a glass substrate, forming one or more trenches in the first layer, and depositing a second layer of a second material in the one or more holes to trenches a first alternating layer of alternating first portions of the first material and second portions of the second material. The first process is repeated one or more times to form additional alternating layers over the first alternating layer. Each first portion of each alternating layer is disposed in contact with and offset a distance from an adjacent first portion in adjacent alternating layers. A second process comprises removing either the first or the second portions from each alternating layer to form the plurality of nanostructures.
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公开(公告)号：US20230384596A1
公开(公告)日：2023-11-30
申请号：US18143747
申请日：2023-05-05
Applicant: Applied Materials, Inc.
Inventor： Jinxin FU , Ludovic GODET
CPC classification number: G02B27/0172 , G02B6/0016 , G02B6/0038 , G02B2027/0112
Abstract: Embodiments of the present disclosure generally relate to methods of modifying and engineering the effective thickness of an optical device substrate. The methods provide for depositing a material that is index-matched to the substrate to alter a thickness distribution of the optical device. By adjusting the thickness distribution, the optical path of light is modulated to direct the light to the output coupling grating.
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公开(公告)号：US20230360890A1
公开(公告)日：2023-11-09
申请号：US18131997
申请日：2023-04-07
Applicant: Applied Materials, Inc.
Inventor： Yue CHEN , Jinyu LU , Yongmei CHEN , Jinxin FU , Zihao YANG , Mingwei ZHU , Takashi KURATOMI , Rami HOURANI , Ludovic GODET , Qun JING , Jingyi YANG , David Masayuki ISHIKAWA
CPC classification number: H01J37/32449 , H01J37/32458 , H01J37/32724 , H01J7/02 , H01J2237/332 , H01J2237/334
Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.
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公开(公告)号：US20230273355A1
公开(公告)日：2023-08-31
申请号：US18173365
申请日：2023-02-23
Applicant: Applied Materials, Inc.
Inventor： Yingdong LUO , Kangkang WANG , Wei-Sheng LEI , Xiaopei DENG , Erica CHEN , Kang LUO , Daihua ZHANG , Rami HOURANI , Ludovic GODET
IPC: G02B5/18 , G02B1/14 , B23K26/402 , B23K26/60
CPC classification number: G02B5/1847 , G02B1/14 , B23K26/402 , B23K26/60
Abstract: Methods of dicing optical devices from an optical device substrate are disclosed. The methods include disposing a protective coating only over the optical devices. The optical device substrate includes the optical devices disposed on the surface of the optical device substrate with areas therebetween. The areas of the optical device substrate are exposed by the protective coating. The protective coating includes a polymer, a solvent, and an additive. The methods further include curing the protective coating via a cure process so that the protective coating is water-soluble after the solvent is removed by the cure process, dicing the optical devices from the optical device substrate by projecting a laser beam to the areas between the optical devices, and exposing the protective coating to water to remove the protective coating from the optical devices that are diced.
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Patent Agency Ranking
106.发明公开公开(公告)号：US20230251161A1
公开(公告)日：2023-08-10
申请号：US18163766
申请日：2023-02-02
Applicant: Applied Materials, Inc.
Inventor： Baochen WU , Yangyang SUN , Ravi KOMANDURI , Jinxin FU , Ludovic GODET
IPC: G01M11/02
CPC classification number: G01M11/0207
Abstract: Embodiments described herein relate to an optical device metrology system including a light source to emit a light and a non-polarizing beam splitter to split the light into a first photodetector light path and an optical light path. A first photodetector is disposed in the first photodetector light path and measures a total power of the light. The optical device substrate is disposed in the optical light path and splits the light into a second and a third photodetector light path. A second photodetector is disposed in the second photodetector light path from the optical device substrate. The second photodetector measures a reflected power of the light. A third photodetector is disposed in the third photodetector light path. The third photodetector measures a transmitted power of the light. The controller receives measurements from the first, second, and third photodetectors to calculate a percentage light loss within the optical device substrate.
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公开(公告)号：US20230221484A1
公开(公告)日：2023-07-13
申请号：US17647535
申请日：2022-01-10
Applicant: Applied Materials, Inc.
Inventor： Rutger MEYER TIMMERMAN THIJSSEN , Ludovic GODET
IPC: F21V8/00
CPC classification number: G02B6/0065 , G02B6/0016 , G02B6/0036
Abstract: Embodiments described herein provide for methods of forming angled optical device structures. The methods described herein utilize etching a mandrel material with an etch chemistry that is selective to the hardmask, i.e., the mandrel material is etched at a higher rate than the hardmask. Therefore, mandrel trenches are formed in the mandrel material. Device material of the angled optical device structures to be formed is deposited on the plurality of angled mandrels. An angled etch process is performed on portions of the device material such that the angled optical device structures are formed.
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公开(公告)号：US20220308460A1
公开(公告)日：2022-09-29
申请号：US17701394
申请日：2022-03-22
Applicant: Applied Materials, Inc.
Inventor： Yongan XU , Naamah ARGAMAN , David SELL , Ludovic GODET
Abstract: Methods of fabricating large-scale optical devices having sub-micron dimensions are provided. A method is provided that includes projecting a beam to a mask, the mask corresponding to a section of an optical device pattern, the optical device pattern divided into four or more equal portions, each portion corresponding to a section of a substrate. The method further includes scanning the mask over a first section of the substrate to pattern a first portion of the optical device pattern, the substrate is positioned at a first rotation angle relative to the mask. The method further includes rotating the substrate to a second rotation angle, the second rotation angle corresponding to 360° divided by a total number of portions of the optical device pattern, scanning the mask over a second section of the substrate from the initial position to the final position to pattern a second portion of the optical device pattern.
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公开(公告)号：US20220221723A1
公开(公告)日：2022-07-14
申请号：US17647361
申请日：2022-01-07
Applicant: Applied Materials, Inc.
Inventor： Yige GAO , Rami HOURANI , Xiaopei DENG , Amita JOSHI , Ludovic GODET , Kangkang WANG
Abstract: Embodiments described herein include a waveguide combiner having an edge coated with an optically absorbent composition and a method of coating the edge of the waveguide combiner with the optically absorbent composition. The optically absorbent composition includes one or more types of nanoparticles or microparticles, at least one of one or more dyes or one or more pigments, and a polymer matrix of one or more binders. The method includes producing an optically absorbent formulation. The optically absorbent formulation includes one or more types of particles, at least one of one or more dyes or one or more pigments, one or more binders, and one or more solvents. The optically absorbent formulation is applied on an edge of a waveguide combiner using an edge blackening tool. The formulation is cured with radiation to form the optically absorbent composition.
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公开(公告)号：US20220212223A1
公开(公告)日：2022-07-07
申请号：US17456410
申请日：2021-11-24
Applicant: Applied Materials, Inc.
Inventor： Kangkang WANG , Yaseer Arafath AHAMED , Yige GAO , Benjamin B. RIORDON , Rami HOURANI , James D. STRASSNER , Ludovic GODET , Thinh NGUYEN
Abstract: An optical device coating assembly is provided. The optical device coating assembly includes a substrate support operable to retain an optical device substrate. The coating assembly further includes a first actuator connected to the substrate support. The first actuator is configured to rotate the substrate support. The coating assembly includes a holder configured to hold a coating applicator against an edge of the optical device substrate when the optical device substrate is rotated on the substrate support and a second actuator operable to apply a force on the holder in a direction towards the substrate support. The second actuator is a constant force actuator.
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