SUBSTRATE CARRIER TO CONTROL TEMPERATURE OF SUBSTRATE

    公开(公告)号:US20230265554A1

    公开(公告)日:2023-08-24

    申请号:US18104437

    申请日:2023-02-01

    CPC classification number: C23C14/50 B25B5/163 C23C14/34

    Abstract: An apparatus for processing a semiconductor substrate, such as an optical device, is described herein. The apparatus includes a substrate carrier which is configured to enable a processing chamber configured to process larger substrates to process a smaller substrate without retrofitting the processing chamber. The substrate carrier includes a carrier base and a clamp ring. The carrier base includes a plurality of gas channels formed within a substrate pocket. The clamp ring is disposed on the carrier base and over the substrate and holds the substrate in place. The clamp ring is either weighted or configured to be help by a separate chamber clamping mechanism.

    HIGH TEMPERATURE DUAL CHAMBER SHOWERHEAD

    公开(公告)号:US20210130956A1

    公开(公告)日:2021-05-06

    申请号:US17078664

    申请日:2020-10-23

    Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead for use in a process chamber includes a gas distribution plate having an upper surface and a lower surface; a plurality of channels extending through the gas distribution plate substantially perpendicular to the lower surface; a plurality of first gas delivery holes extending from the upper surface to the lower surface between adjacent channels of the plurality of channels to deliver a first process gas through the gas distribution plate; and a plurality of second gas delivery holes extending from the plurality of channels to the lower surface to deliver a second process gas therethrough without mixing with the first process gas.

    METHODS AND APPARATUS FOR DUAL CHANNEL SHOWERHEADS

    公开(公告)号:US20210032753A1

    公开(公告)日:2021-02-04

    申请号:US16934343

    申请日:2020-07-21

    Abstract: Methods and apparatus for gas distribution in a process chamber leverage dual electrodes to provide RF power and an RF ground return in a single showerhead. In some embodiments, the apparatus includes a showerhead composed of a non-metallic material with a first gas channel and a second gas channel, the first gas channel and the second gas channel being independent of each other, and the first gas channel including a plurality of through holes from a top surface of the showerhead to a bottom surface of the showerhead and the second gas channel including a plurality of holes on the bottom surface of the showerhead connected to one or more gas inlets on a side of the showerhead, a first electrode embedded in the showerhead near a top surface of the showerhead, and a second electrode embedded in the showerhead near a bottom surface of the showerhead.

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