公开(公告)号：US20180117891A1

公开(公告)日：2018-05-03

申请号：US15532999

申请日：2015-11-30

申请人： ZEON CORPORATION

发明人： Makoto FUJIMURA ,  Takashi IGA

IPC分类号： B32B27/38 ,  B32B7/02 ,  H05K1/03 ,  C08K5/3472 ,  C08K5/17 ,  C08L63/00 ,  C08L71/12

CPC分类号： B32B27/38 ,  B32B7/02 ,  C08G59/40 ,  C08G59/5026 ,  C08G59/508 ,  C08G59/686 ,  C08K5/17 ,  C08K5/3472 ,  C08L63/00 ,  C08L71/12 ,  C09J163/00 ,  H05K1/03 ,  H05K1/0326 ,  H05K1/0346 ,  C08K5/10

摘要： The purpose of the present invention is to provide a curable resin composition capable of forming a cured object having excellent adhesiveness to conductor layers. The curable resin composition according to the present invention composes an epoxy compound (A), a triazole compound (B), and a tertiary amine compound (C) represented by the following formula (I). In formula (I), R1 and R 2 each independently represent —(R3O)nH (wherein, R3 represents a C2-3 alkylene group and n is an integer of 1-3).

公开(公告)号：US20180079902A1

公开(公告)日：2018-03-22

申请号：US15554214

申请日：2016-03-25

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Minoru SAKATA

IPC分类号： C08L71/12 ,  C08L25/06

CPC分类号： C08L71/123 ,  C08K5/092 ,  C08K9/06 ,  C08L25/06 ,  C08L53/02 ,  C08L71/12 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2205/03

摘要： Disclosed is a resin composition including: a resin mixture (a) containing a polyphenylene ether resin and atactic homopolystyrene in an amount of above 50 mass % and below 94 mass %; a hydrogenated block copolymer (b) obtained by hydrogenating at least part of a block copolymer containing polymer blocks A and B in an amount of 1 to 20 mass %; a functional group-containing compound (c) having a specific functional group in an amount of 0.01 to 0.5 mass %; and a surface-treated inorganic filler (d) in an amount of 5 mass % or more and less than 30 mass %, in which the resin composition does not substantially contain a polymer having a hydrogenation ratio of less than 98% in a conjugated diene compound portion, the component (a-1) has a weight average molecular weight of less than 70,000, and the component (b) has a number average molecular weight of 150,000 to 300,000.

公开(公告)号：US09920218B2

公开(公告)日：2018-03-20

申请号：US15148050

申请日：2016-05-06

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Jung-Jen Chuang ,  Hao-Sheng Chen ,  Yi-Cheng Li ,  Zhang-Jian Huang

IPC分类号： C09D171/12 ,  C08G65/46 ,  C08L71/12 ,  C08G65/48

CPC分类号： C09D171/12 ,  C08G65/46 ,  C08G65/485 ,  C08L71/12

摘要： A process for preparing PPE microspore dispersion includes steps of: dissolving a high-molecular polyphenylene ether in a first solvent at 45-110° C. to form a dissolution liquid; adding processing aids and well mixing the dissolution liquid into a dispersed phase; cooling the dissolution liquid to 42-80° C., and adding a second solvent to generate PPE microspores via PPE to wrap around the processing aids; cooling the dissolution liquid to 0-40° C. to obtain PPE microspore dispersions for use in application for impregnation processes performed below 40° C., thereby high-temperature impregnation equipment are no longer needed, and copper clad laminates made of using the PPE microspore dispersion enjoy excellent physical properties including high Tg, low Dk, low Df and high copper foil's peel strength.

公开(公告)号：US20180077796A1

公开(公告)日：2018-03-15

申请号：US15813353

申请日：2017-11-15

申请人： International Business Machines Corporation

发明人： Dylan J. Boday ,  Joseph Kuczynski

IPC分类号： H05K1/03 ,  C08L71/12 ,  C08L71/00 ,  C08G65/48

CPC分类号： H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

摘要： An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

公开(公告)号：US20180037705A1

公开(公告)日：2018-02-08

申请号：US15555826

申请日：2015-09-18

申请人： Shengyi Technology Co., Ltd.

发明人： Xianping ZENG ,  Guangbing CHEN ,  Chiji GUAN ,  Wenhua YANG

IPC分类号： C08J5/24 ,  H05K1/03 ,  B32B37/10 ,  C08L71/12 ,  B32B15/20 ,  B32B15/085

摘要： Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

公开(公告)号：US09822252B2

公开(公告)日：2017-11-21

申请号：US14774945

申请日：2015-02-27

申请人： LG CHEM, LTD.

发明人： Sung Hwan Lim ,  Jong Kuk Choi ,  Sang Ho Lee ,  Nam Jib Park ,  Soo Min Lee ,  Sung Ho Lee

IPC分类号： C08K5/34 ,  C08K5/3492 ,  B05D5/12 ,  H01B3/30 ,  H01B3/44 ,  H01B7/295 ,  C08L71/12 ,  C08L23/04 ,  C08K5/49 ,  C08K5/5353 ,  C08L25/04 ,  C08L53/02

CPC分类号： C08L71/12 ,  C08K5/0066 ,  C08K5/49 ,  C08K5/5353 ,  C08L23/04 ,  C08L25/04 ,  C08L53/025 ,  C08L2201/02 ,  C08L2203/202 ,  C08L2205/03 ,  C08L2207/04 ,  H01B7/295

摘要： Disclosed are a fire retardant thermoplastic resin composition suitable for preparing an electric wire, etc. by enhancing extrudability of a resin composition without hindering fire retardancy of the resin composition, and an electric wire comprising the same. The fire retardant thermoplastic resin composition comprises a matrix resin that comprises 20 to 35% by weight of a poly arylene ether resin, 20 to 35% by weight of a vinyl aromatic resin and 5 to 20% by weight of an olefin-based resin comprising a rubber ingredient, 1 to 10% by weight of a room-temperature liquid-type fire retardant, and 8 to 20% by weight of an ancillary fire retardant, based on 100% by weight of a mixture of a poly arylene ether resin, a vinyl aromatic resin, an olefin-based resin, a room-temperature liquid-type fire retardant and an ancillary fire retardant.

公开(公告)号：US09822247B2

公开(公告)日：2017-11-21

申请号：US15105955

申请日：2014-12-19

申请人： COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN ,  Michelin Recherche et Technique S.A.

发明人： Vincent Abad

IPC分类号： C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  B60C1/00 ,  C08L9/08

CPC分类号： C08L9/06 ,  B60C1/0016 ,  C08L9/08 ,  C08L25/10 ,  C08L71/12 ,  C08L71/123 ,  C08L71/126 ,  C08L2205/06

摘要： A rubber composition is based on at least one predominant vinylaromatic diene elastomer, a reinforcing filler, a crosslinking system and a thermoplastic resin comprising optionally substituted polyphenylene ether units, said resin having a compatibility with said vinylaromatic diene elastomer such that a mixture of said vinylaromatic diene elastomer and said resin creates a composition having less than 10% of its volume in the form of particles greater than 2 micrometres in size. The rubber composition may be used in semi-finished tire articles and tires.

公开(公告)号：US09743515B2

公开(公告)日：2017-08-22

申请号：US12385194

申请日：2009-04-01

申请人： Kenichi Mori ,  Shoichi Ito

发明人： Kenichi Mori ,  Shoichi Ito

IPC分类号： H05K1/03 ,  C08G65/48 ,  C08L71/12 ,  C08L67/00 ,  C08L65/00 ,  C08L63/00 ,  C08K7/20 ,  C08K3/36 ,  C08L69/00

CPC分类号： H05K1/0373 ,  C08G65/485 ,  C08K3/36 ,  C08K7/20 ,  C08L63/00 ,  C08L65/00 ,  C08L67/00 ,  C08L69/00 ,  C08L71/126 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31678 ,  Y10T442/30 ,  C08L2666/14

摘要： A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The resin composition is for use in a printed wiring board for high multilayer and high frequency, and is excellent in moldability, electric characteristics, peel strength, flame resistance and heat resistance after moisture absorption. Further, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

公开(公告)号：US20170166729A1

公开(公告)日：2017-06-15

申请号：US15225839

申请日：2016-08-02

申请人： Elite Electronic Material(Zhongshan) Co., Ltd.

发明人： ZHI-LONG HU ,  Chen-Yu Hsieh

IPC分类号： C08K5/5313 ,  C08J5/24 ,  H05K1/03 ,  C09D5/18 ,  H05K1/09 ,  C08L71/12 ,  C09D171/12

CPC分类号： C08K5/5313 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/36 ,  C08K5/14 ,  C08L71/126 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/03 ,  C08L2205/035 ,  C09D5/18 ,  C09D7/61 ,  C09D171/12 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  C08L71/12

摘要： The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.

公开(公告)号：US09540474B2

公开(公告)日：2017-01-10

申请号：US14769388

申请日：2014-02-24

申请人： ISP INVESTMENTS INC.

发明人： Krishnamurthy Nacharaju ,  Osama M. Musa ,  Michael A. Tallon

IPC分类号： C08F8/00 ,  C08L81/00 ,  C08L71/12 ,  C08K5/07 ,  C08F220/66 ,  C08F265/02 ,  A61K9/00 ,  A61K47/32 ,  A61Q17/04 ,  A61Q19/00 ,  A61K8/81 ,  C08F255/08 ,  C08F255/10 ,  C08F257/02 ,  C08F261/06

CPC分类号： C08F265/02 ,  A61K8/8164 ,  A61K9/0014 ,  A61K47/32 ,  A61K2800/10 ,  A61Q5/06 ,  A61Q17/04 ,  A61Q19/00 ,  C08F255/08 ,  C08F255/10 ,  C08F257/02 ,  C08F261/06

摘要： UV-absorbing polymers are provided that have at least one anhydride repeating unit that is covalently attached to at least one UV-absorbing moiety selected from the group consisting of functionalized dibenzoylmethanes, benzophenone sulfonamides, triphenyl triazines, and combinations thereof. Also provided are formulations comprising the UV-absorbing polymers.

摘要翻译： 提供具有至少一个酸酐重复单元的紫外线吸收聚合物，该酸酐重复单元共价连接至至少一个选自官能化的二苯甲酰甲烷，二苯甲酮磺酰胺，三苯基三嗪及其组合的UV吸收部分。 还提供了包含UV吸收聚合物的制剂。