公开(公告)号：US09310316B2

公开(公告)日：2016-04-12

申请号：US13610658

申请日：2012-09-11

Applicant: Kenong Wu ,  Chris W. Lee ,  Michael J. Van Riet ,  Yi Liu

Inventor： Kenong Wu ,  Chris W. Lee ,  Michael J. Van Riet ,  Yi Liu

IPC: G06K9/00 ,  G01N21/95

CPC classification number: G01N21/9501

Abstract: Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for a defect detection method are provided. One method includes selecting one or more parameters of a defect detection method using an optimization function and information for a set of classified defects, which includes defects of interest and nuisance defects, such that the one or more parameters satisfy an objective for the defect detection method.

Abstract translation: 提供了计算机实现的方法，计算机可读介质和用于为缺陷检测方法选择一个或多个参数的系统。 一种方法包括使用优化函数选择缺陷检测方法的一个或多个参数，以及一组分类缺陷的信息，所述缺陷检测方法包括感兴趣的缺陷和妨碍缺陷，使得一个或多个参数满足缺陷检测方法的目的 。

公开(公告)号：US09262821B2

公开(公告)日：2016-02-16

申请号：US14707573

申请日：2015-05-08

Applicant: KLA-Tencor Corporation

Inventor： Eugene Shifrin ,  Chetana Bhaskar ,  Ashok V. Kulkarni ,  Chien-Huei (Adam) Chen ,  Kris Bhaskar ,  Brian Duffy

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T2200/28 ,  G06T2207/30148

Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。

公开(公告)号：US09222895B2

公开(公告)日：2015-12-29

申请号：US14184417

申请日：2014-02-19

Applicant: KLA-Tencor Corporation

Inventor： Brian Duffy ,  Kris Bhaskar

IPC: G06F17/50 ,  G01N21/95 ,  G06T7/00 ,  G06T7/60

CPC classification number: G01N21/9501 ,  G06T7/50 ,  G06T7/62 ,  G06T2207/10016 ,  G06T2207/30252

Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.

Abstract translation: 提供广泛的虚拟检查员。 一个系统包括两个或更多个实际系统，其被配置为在样本被布置在实际系统内时对样本执行一个或多个过程。 该系统还包括耦合到实际系统的一个或多个虚拟系统，从而接收由实际系统产生的输出并向实际系统发送信息。 虚拟系统被配置为使用从实际系统接收的至少一些输出来执行一个或多个功能。 虚拟系统不能将样本置于其中。

公开(公告)号：US09222771B2

公开(公告)日：2015-12-29

申请号：US13652232

申请日：2012-10-15

Applicant: KLA-Tencor Corporation

Inventor： Eliezer Rosengaus ,  Ady Levy ,  Kris Bhaskar

IPC: G01C3/00 ,  G01C1/00 ,  G01C15/00

CPC classification number: G01C15/002

Abstract: Systems and methods for acquiring information for a construction site are provided. One system includes a base unit positioned within a construction site by a user. A computer subsystem of the base unit determines a position of the base unit with respect to the construction site. The system also includes a measurement unit moved within the construction site by a user. The measurement unit includes one or more elements configured to interact with light in a known manner. An optical subsystem of the base unit directs light to the element(s) and detects the light after interacting with the element(s). The computer subsystem is configured to determine a position and pose of the measurement unit with respect to the base unit based on the detected light. The measurement unit includes a measurement device used by the measurement unit or the base unit to determine information for the construction site.

Abstract translation: 提供了获取施工现场信息的系统和方法。 一个系统包括由用户定位在施工现场内的基座单元。 基座的计算机子系统确定基座相对于施工现场的位置。 该系统还包括由用户在施工现场内移动的测量单元。 测量单元包括被配置为以已知方式与光相互作用的一个或多个元件。 基本单元的光学子系统将光引导到元件，并在与元件相互作用之后检测光。 计算机子系统被配置为基于检测到的光来确定测量单元相对于基本单元的位置和姿态。 测量单元包括由测量单元或基座单元用于确定施工现场的信息的测量装置。

公开(公告)号：US09189844B2

公开(公告)日：2015-11-17

申请号：US13652377

申请日：2012-10-15

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Meng-Che Wu ,  Lisheng Gao

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95

CPC classification number: G06T7/001 ,  G01N21/9501 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations.

Abstract translation: 提供了使用缺陷特定信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括在晶片上形成的感兴趣图案，以及在感兴趣的图案附近或其中出现的已知DOI。 信息包括晶片上的目标图像。 该方法还包括在晶片或另一晶片上搜索目标候选。 目标候选人包括兴趣模式。 将目标候选位置和目标候选位置提供给缺陷检测。 此外，该方法包括通过识别目标候选图像中的潜在DOI位置并将一个或多个检测参数应用于潜在DOI位置的图像来检测目标候选中的已知DOI。

公开(公告)号：US09092846B2

公开(公告)日：2015-07-28

申请号：US14169161

申请日：2014-01-31

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  H01L21/66

CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

Abstract translation: 提供了使用缺陷特定和多信道信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括形成在晶片上的感兴趣模式（POI）和在POI附近或在POI中出现的已知感兴趣缺陷（DOI）。 该方法还包括通过基于由检查系统的第一通道获取的目标候选者的图像来识别潜在的DOI位置来检测目标候选中的已知DOI，并将一个或多个检测参数应用于由第二个所获取的潜在DOI位置的图像 检查系统通道。 因此，用于定位潜在DOI位置的图像和用于检测缺陷的图像可以不同。

公开(公告)号：US09087367B2

公开(公告)日：2015-07-21

申请号：US13601891

申请日：2012-08-31

Applicant: Ellis Chang ,  Michael J. Van Riet ,  Allen Park ,  Khurram Zafar ,  Santosh Bhattacharyya

Inventor： Ellis Chang ,  Michael J. Van Riet ,  Allen Park ,  Khurram Zafar ,  Santosh Bhattacharyya

IPC: G06K9/62 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T7/74 ,  G06T2207/30148

Abstract: Methods and systems for determining design coordinates for defects detected on a wafer are provided. One method includes aligning a design for a wafer to defect review tool images for defects detected in multiple swaths on the wafer by an inspection tool, determining a position of each of the defects in design coordinates based on results of the aligning, separately determining a defect position offset for each of the multiple swaths based on the swath in which each of the defects was detected (swath correction factor), the design coordinates for each of the defects, and a position for each of the defects determined by the inspection tool, and determining design coordinates for the other defects detected in the multiple swaths by the inspection tool by applying the appropriate swath correction factor to those defects.

Abstract translation: 提供了用于确定在晶片上检测到的缺陷的设计坐标的方法和系统。 一种方法包括对准晶片的设计以通过检查工具对晶片上的多个条带中检测到的缺陷来检查工具图像，基于对准的结果确定每个缺陷在设计坐标中的位置，分别确定缺陷 基于检测到每个缺陷的条带（条纹校正因子），每个缺陷的设计坐标以及由检查工具确定的每个缺陷的位置，针对每个多个条带的位置偏移，以及 通过对这些缺陷应用适当的条纹校正因子来确定检测工具在多个条中检测到的其他缺陷的设计坐标。

公开(公告)号：US09080991B2

公开(公告)日：2015-07-14

申请号：US13073986

申请日：2011-03-28

Applicant: Yung-Ho (Alex) Chuang ,  Vladimir Levinski ,  Xuefeng Liu ,  John Fielden

Inventor： Yung-Ho (Alex) Chuang ,  Vladimir Levinski ,  Xuefeng Liu ,  John Fielden

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/47

CPC classification number: G01N21/9501 ,  G01N2021/479

Abstract: Illumination subsystems of a metrology or inspection system, metrology systems, inspection systems, and methods for illuminating a specimen for metrology measurements or for inspection are provided. One illumination subsystem includes a light source configured to generate coherent pulses of light and a dispersive element positioned in the path of the coherent pulses of light, which is configured to reduce coherence of the pulses of light by mixing spatial and temporal characteristics of light distribution in the pulses of light. The illumination subsystem also includes an electro-optic modulator positioned in the path of the pulses of light exiting the dispersive element and which is configured to reduce the coherence of the pulses of light by temporally modulating the light distribution in the pulses of light. The illumination subsystem is configured to direct the pulses of light from the electro-optic modulator to a specimen.

Abstract translation: 提供了计量或检查系统的照明子系统，计量系统，检查系统和用于计量测量或检查的照明样本的方法。 一个照明子系统包括被配置为产生相干的光脉冲的光源和位于相干脉冲光的路径中的色散元件，该色散元件被配置为通过将光分布的空间和时间特征混合在一起来减小光脉冲的相干性 光的脉冲。 照明子系统还包括位于离开色散元件的光的脉冲的路径中的电光调制器，其被配置为通过暂时调制光脉冲中的光分布来减小光脉冲的相干性。 照明子系统被配置为将来自电光调制器的光脉冲引导到样本。

公开(公告)号：US08934091B2

公开(公告)日：2015-01-13

申请号：US13794030

申请日：2013-03-11

Applicant: KLA-Tencor Corporation

Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

IPC: G01J1/00 ,  H01L21/67 ,  G01J1/42

CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

公开(公告)号：US08832611B2

公开(公告)日：2014-09-09

申请号：US13919577

申请日：2013-06-17

Applicant: KLA-Tencor Corporation

Inventor： Xuefeng Liu ,  Yung-Ho Alex Chuang ,  John Fielden ,  Bin-Ming Benjamin Tsai ,  Jingjing Zhang

IPC: G06F17/50 ,  G06F19/00 ,  G06F17/10

CPC classification number: G06F17/5018 ,  G03F7/70625 ,  G06F17/10 ,  G06F17/5081 ,  G06F19/00 ,  G06F2217/12 ,  G06F2217/14 ,  G06F2217/16 ,  H01L22/12 ,  H01L22/20

Abstract: Systems and methods for process aware metrology are provided. One method includes selecting nominal values and one or more different values of process parameters for one or more process steps used to form the structure on the wafer, simulating one or more characteristics of the structure that would be formed on the wafer using the nominal values, and determining parameterization of the optical model based on how the one or more characteristics of the structure vary between at least two of the nominal values and the one or more different values.

Abstract translation: 提供了流程感知度量的系统和方法。 一种方法包括为用于在晶片上形成结构的一个或多个工艺步骤选择工艺参数的标称值和一个或多个不同值，模拟使用标称值在晶片上形成的结构的一个或多个特性， 以及基于所述结构的一个或多个特性如何在所述标称值和所述一个或多个不同值中的至少两个之间变化来确定所述光学模型的参数化。