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公开(公告)号：US20190108630A1
公开(公告)日：2019-04-11
申请号：US16206691
申请日：2018-11-30
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
IPC: G06T7/00
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
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公开(公告)号：US09262821B2
公开(公告)日：2016-02-16
申请号：US14707573
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Chetana Bhaskar , Ashok V. Kulkarni , Chien-Huei (Adam) Chen , Kris Bhaskar , Brian Duffy
CPC classification number: G06T7/001 , G06T2200/28 , G06T2207/30148
Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.
Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。
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公开(公告)号：US11295438B2
公开(公告)日：2022-04-05
申请号：US16206691
申请日：2018-11-30
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
IPC: G06T7/00
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
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Patent Agency Ranking
公开(公告)号：US10192303B2
公开(公告)日：2019-01-29
申请号：US14076350
申请日：2013-11-11
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
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公开(公告)号：US20140153814A1
公开(公告)日：2014-06-05
申请号：US14076350
申请日：2013-11-11
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2207/30148
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
Abstract translation: 混合模式包括接收包括晶片的选定区域的一个或多个图像的检查结果，一个或多个图像包括一个或多个晶片管芯，其包括一组重复块，该组重复块是一组重复的单元。 此外，混合模式检查包括调整一个或多个图像的像素尺寸以将每个单元映射到块，并将其死亡到整数个像素。 此外，混合模式检查包括将第一晶片管芯与第二晶片管芯进行比较，以识别第一或第二晶片管芯中的一个或多个缺陷的发生，将第一块与第二块进行比较以识别一个或多个 第一或第二块中的缺陷，并且将第一细胞与第二细胞进行比较以识别第一或第二细胞中的一个或多个缺陷的发生。
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公开(公告)号：US10395358B2
公开(公告)日：2019-08-27
申请号：US15804980
申请日：2017-11-06
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Eugene Shifrin , Ashok Mathew , Chetana Bhaskar , Lisheng Gao , Santosh Bhattacharyya , Hucheng Lee , Benjamin Murray
Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.
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公开(公告)号：US20180130199A1
公开(公告)日：2018-05-10
申请号：US15804980
申请日：2017-11-06
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Eugene Shifrin , Ashok Mathew , Chetana Bhaskar , Lisheng Gao , Santosh Bhattacharyya , Hucheng Lee , Benjamin Murray
CPC classification number: G06T7/0006 , G01N21/9501 , G01N2021/95676 , G05B19/41875 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/10152 , G06T2207/20076 , G06T2207/20224 , G06T2207/30148
Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.
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公开(公告)号：US20150324964A1
公开(公告)日：2015-11-12
申请号：US14707573
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Chetana Bhaskar , Ashok V. Kulkarni , Chien-Huei (Adam) Chen , Kris Bhaskar , Brian Duffy
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2200/28 , G06T2207/30148
Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.
Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。
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