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    Optical-mode selection for multi-mode semiconductor inspection
    1.
    发明授权
    Optical-mode selection for multi-mode semiconductor inspection 有权

    公开(公告)号：US11010885B2

    公开(公告)日：2021-05-18

    申请号：US16406374

    申请日：2019-05-08

    Applicant: KLA-Tencor Corporation

    Inventor： Bjorn Brauer ,  Richard Wallingford ,  Kedar Grama ,  Hucheng Lee ,  Sangbong Park

    IPC: G06K9/00 ,  G06T7/00 ,  G06K9/62 ,  G01R31/265

    Abstract: One or more semiconductor wafers or portions thereof are scanned using a primary optical mode, to identify defects. A plurality of the identified defects, including defects of a first class and defects of a second class, are selected and reviewed using an electron microscope. Based on this review, respective defects of the plurality are classified as defects of either the first class or the second class. The plurality of the identified defects is imaged using a plurality of secondary optical modes. One or more of the secondary optical modes are selected for use in conjunction with the primary optical mode, based on results of the scanning using the primary optical mode and the imaging using the plurality of secondary optical modes. Production semiconductor wafers are scanned for defects using the primary optical mode and the one or more selected secondary optical modes.

    Active learning for defect classifier training
    2.
    发明授权
    Active learning for defect classifier training 有权

    公开(公告)号：US10713769B2

    公开(公告)日：2020-07-14

    申请号：US16424431

    申请日：2019-05-28

    Applicant: KLA-Tencor Corporation

    Inventor： Jing Zhang ,  Yujie Dong ,  Brian Duffy ,  Richard Wallingford ,  Michael Daino ,  Kris Bhaskar

    IPC: G06T7/00 ,  G06N3/08 ,  G06K9/62 ,  G06N3/04 ,  G06N7/00 ,  G06N20/00 ,  G06F17/18

    Abstract: Methods and systems for performing active learning for defect classifiers are provided. One system includes one or more computer subsystems configured for performing active learning for training a defect classifier. The active learning includes applying an acquisition function to data points for the specimen. The acquisition function selects one or more of the data points based on uncertainty estimations associated with the data points. The active learning also includes acquiring labels for the selected one or more data points and generating a set of labeled data that includes the selected one or more data points and the acquired labels. The computer subsystem(s) are also configured for training the defect classifier using the set of labeled data. The defect classifier is configured for classifying defects detected on the specimen using the images generated by the imaging subsystem.

    SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER
    3.
    发明申请
    SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER 审中-公开

    公开(公告)号：US20180202943A1

    公开(公告)日：2018-07-19

    申请号：US15865130

    申请日：2018-01-08

    Applicant: KLA-Tencor Corporation

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Systems and methods for detecting defects on a wafer
    5.
    发明授权
    Systems and methods for detecting defects on a wafer 有权

    公开(公告)号：US10605744B2

    公开(公告)日：2020-03-31

    申请号：US15865130

    申请日：2018-01-08

    Applicant: KLA-Tencor Corporation

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Method and System for Mixed Mode Wafer Inspection
    7.
    发明申请
    Method and System for Mixed Mode Wafer Inspection 审中-公开

    公开(公告)号：US20190108630A1

    公开(公告)日：2019-04-11

    申请号：US16206691

    申请日：2018-11-30

    Applicant: KLA-Tencor Corporation

    Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

    IPC: G06T7/00

    Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.

    APPARATUS AND METHODS FOR FINDING A BEST APERTURE AND MODE TO ENHANCE DEFECT DETECTION
    9.
    发明申请
    APPARATUS AND METHODS FOR FINDING A BEST APERTURE AND MODE TO ENHANCE DEFECT DETECTION 有权
    用于发现最佳孔径和加强缺陷检测的方法的装置和方法

    公开(公告)号：US20140354983A1

    公开(公告)日：2014-12-04

    申请号：US14075488

    申请日：2013-11-08

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus b. Huber ,  Robert M. Danen

    IPC: G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/9501

    Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.

    Abstract translation: 公开了用于优化检查工具的模式的方法和装置。 获得检查工具的多个第一孔的每一个的第一图像或信号，并且每个第一图像或信号属于缺陷区域。 对于第一孔径及其第一图像或信号的多个组合中的每一个，获得合成图像或信号。 基于每个合成图像的缺陷检测特性，分析每个复合图像或信号以确定第一孔径的组合中的最佳一个。

    Systems and Methods for Detecting Defects on a Wafer
    10.
    发明申请
    Systems and Methods for Detecting Defects on a Wafer 有权
    用于检测晶片缺陷的系统和方法

    公开(公告)号：US20130250287A1

    公开(公告)日：2013-09-26

    申请号：US13900465

    申请日：2013-05-22

    Applicant: KLA-Tencor Corporation

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

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