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公开(公告)号：US20140199791A1
公开(公告)日：2014-07-17
申请号：US14083126
申请日：2013-11-18
Applicant: KLA-Tencor Corporation
Inventor： Allen Park , Ellis Chang , Michael Adel , Kris Bhaskar , Ady Levy , Amir Widmann , Mark Wagner , Songnian Rong
CPC classification number: H01L22/12 , G06F17/5081
Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.
Abstract translation: 通用的基于目标的检测驱动度量包括设计多个通过检测工具测量的通用度量目标并且可以用计量工具测量，使用设计数据识别晶片的至少一个管芯内的多个检查特征，将多个通用目标 在晶片的至少一个模具内，每个通用目标被设置为至少接近所识别的可检查特征之一，用检查工具检查包含一个或多个通用目标的区域，以识别一个或多个异常通用目标 检查区域具有检查工具，并且响应于在被检查区域中识别一个或多个异常通用目标，对所述一个或多个异常通用度量目标与计量工具执行一个或多个计量过程。
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公开(公告)号：US20190108630A1
公开(公告)日：2019-04-11
申请号：US16206691
申请日：2018-11-30
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
IPC: G06T7/00
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
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公开(公告)号：US10181185B2
公开(公告)日：2019-01-15
申请号：US15402197
申请日：2017-01-09
Applicant: KLA-Tencor Corporation
Inventor： Allen Park , Lisheng Gao , Ashok Kulkarni , Saibal Banerjee , Ping Gu , Songnian Rong , Kris Bhaskar
Abstract: Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.
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Patent Agency Ranking
公开(公告)号：US11295438B2
公开(公告)日：2022-04-05
申请号：US16206691
申请日：2018-11-30
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
IPC: G06T7/00
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
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公开(公告)号：US10192303B2
公开(公告)日：2019-01-29
申请号：US14076350
申请日：2013-11-11
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
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公开(公告)号：US20140153814A1
公开(公告)日：2014-06-05
申请号：US14076350
申请日：2013-11-11
Applicant: KLA-Tencor Corporation
Inventor： Jason Z. Lin , Allen Park , Ellis Chang , Richard Wallingford , Songnian Rong , Chetana Bhaskar
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2207/30148
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
Abstract translation: 混合模式包括接收包括晶片的选定区域的一个或多个图像的检查结果，一个或多个图像包括一个或多个晶片管芯，其包括一组重复块，该组重复块是一组重复的单元。 此外，混合模式检查包括调整一个或多个图像的像素尺寸以将每个单元映射到块，并将其死亡到整数个像素。 此外，混合模式检查包括将第一晶片管芯与第二晶片管芯进行比较，以识别第一或第二晶片管芯中的一个或多个缺陷的发生，将第一块与第二块进行比较以识别一个或多个 第一或第二块中的缺陷，并且将第一细胞与第二细胞进行比较以识别第一或第二细胞中的一个或多个缺陷的发生。
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公开(公告)号：US20170200264A1
公开(公告)日：2017-07-13
申请号：US15402197
申请日：2017-01-09
Applicant: KLA-Tencor Corporation
Inventor： Allen Park , Lisheng Gao , Ashok Kulkarni , Saibal Banerjee , Ping Gu , Songnian Rong , Kris Bhaskar
IPC: G06T7/00
CPC classification number: G06T7/0004 , G01N21/9501 , G06T7/001 , G06T2207/10056 , G06T2207/10061 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
Abstract: Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.
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公开(公告)号：US09576861B2
公开(公告)日：2017-02-21
申请号：US14083126
申请日：2013-11-18
Applicant: KLA-Tencor Corporation
Inventor： Allen Park , Ellis Chang , Michael Adel , Kris Bhaskar , Ady Levy , Amir Widmann , Mark Wagner , Songnian Rong
CPC classification number: H01L22/12 , G06F17/5081
Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.
Abstract translation: 通用的基于目标的检测驱动度量包括设计多个通过检测工具测量的通用度量目标并且可以用计量工具测量，使用设计数据识别晶片的至少一个管芯内的多个检查特征，将多个通用目标 在晶片的至少一个模具内，每个通用目标被设置为至少接近所识别的可检查特征之一，用检查工具检查包含一个或多个通用目标的区域，以识别一个或多个异常通用目标 检查区域具有检查工具，并且响应于在被检查区域中识别一个或多个异常通用目标，对所述一个或多个异常通用度量目标与计量工具执行一个或多个计量过程。
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