Abstract:
In a flash EEPROM system that is divided into separately erasable blocks of memory cells with multiple pages of user data being stored in each block, a count of the number of erase cycles that each block has endured is stored in one location within the block, such as in spare cells of only one page or distributed among header regions of multiple pages. The page or pages containing the block cycle count are initially read from each block that is being erased, the cycle count temporarily stored, the block erased and an updated cycle count is then written back into the block location. User data is then programmed into individual pages of the block as necessary. The user data is preferably stored in more than two states per memory cell storage element, in which case the cycle count can be stored in binary in a manner to speed up the erase process and reduce disturbing effects on the erased state that writing the updated cycle count can cause. An error correction code calculated from the cycle count may be stored with it, thereby allowing validation of the stored cycle count.
Abstract:
A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell.
Abstract:
A semiconductor integrated circuit device with a power-on detecting circuit, wherein the power-on detecting circuit includes: first and second power supply terminals between which an external power supply voltage is to be supplied; a first diode circuit having a first resistor and a first diode connected in series between the first and second power supply terminals, an interconnect node between the first resistor and first diode serving as a first voltage detecting node; a second diode circuit having second and third resistors and a second diode connected in series between the first and second power supply terminals, the second diode having a current drivability larger than the first diode, an interconnect node between the second and third resistors serving as a second voltage detecting node; and a first comparator for detecting a voltage of the second voltage detecting node becoming higher than that of the first voltage detecting node to output a power-on signal.
Abstract:
In a flash EEPROM system that is divided into separately erasable blocks of memory cells with multiple pages of user data being stored in each block, a count of the number of erase cycles that each block has endured is stored in one location within the block, such as in spare cells of only one page or distributed among header regions of multiple pages. The page or pages containing the block cycle count are initially read from each block that is being erased, the cycle count temporarily stored, the block erased and an updated cycle count is then written back into the block location. User data is then programmed into individual pages of the block as necessary. The user data is preferably stored in more than two states per memory cell storage element, in which case the cycle count can be stored in binary in a manner to speed up the erase process and reduce disturbing effects on the erased state that writing the updated cycle count can cause. An error correction code calculated from the cycle count may be stored with it, thereby allowing validation of the stored cycle count.
Abstract:
Data having three values or more is stored in a memory cell in a nonvolatile manner. A data circuit has a plurality of storage circuits. One of the plurality of storage circuits is a latch circuit. Another one of the plurality of storage circuits is a capacitor. The latch circuit and the capacitor function to temporarily store program/read data having two bits or more. Data held by the capacitor is refreshed using the latch circuit if data variation due to leakage causes a program. As a result, the data circuit does not become large in size even if multi-level data is used.
Abstract:
A semiconductor integrated circuit device with a power-on detecting circuit, wherein the power-on detecting circuit includes: first and second power supply terminals between which an external power supply voltage is to be supplied; a first diode circuit having a first resistor and a first diode connected in series between the first and second power supply terminals, an interconnect node between the first resistor and first diode serving as a first voltage detecting node; a second diode circuit having second and third resistors and a second diode connected in series between the first and second power supply terminals, the second diode having a current drivability larger than the first diode, an interconnect node between the second and third resistors serving as a second voltage detecting node; and a first comparator for detecting a voltage of the second voltage detecting node becoming higher than that of the first voltage detecting node to output a power-on signal.
Abstract:
A semiconductor memory device includes: a plurality of cell array blocks in each of which a plurality of memory cells are arranged; address decode circuits for selecting memory cells in the cell array blocks; sense amplifier circuits for reading cell data of the cell array blocks; and a busy signal generation circuit for generating a busy signal to the chip external, wherein in a first read cycle selecting a first area in a first cell array block, cell data read operations for the first area of the first cell array block and a second area of a second cell array block are simultaneously executed, while the busy signal generation circuit generates a true busy signal, and then a read data output operation is executed for outputting the read out data of the first area held in the sense amplifier circuits to the chip external, and in a second read cycle selecting the second area in the second cell array block, after the busy signal generation circuit has output a dummy busy signal shorter in time length than the true busy signal without executing cell data read operation, a read data output operation is executed for outputting the read out data of the second area held in the sense amplifier circuits to the chip external.
Abstract:
Disclosed is a non-volatile semiconductor memory device comprising a plurality of non-volatile semiconductor memory cells, an interface making data exchange with an external device to write/read data with respect to the non-volatile semiconductor memory cells, and a control circuit for controlling the non-volatile semiconductor memory cells, wherein the interface and the control circuit include a first read mode initialized via a first bootstrap to read data from the non-volatile semiconductor memory cells for continuously outputting (N+M)-byte (N is the n-th power of 2, n is positive integers) data via the interface, and a second read mode initialized via a second bootstrap to read data from the non-volatile semiconductor memory cells for continuously outputting K-byte (K is the k-th power of 2, k is positive integers) data via the interface.
Abstract:
A semiconductor memory device includes: a plurality of cell array blocks in each of which a plurality of memory cells are arranged; address decode circuits for selecting memory cells in the cell array blocks; sense amplifier circuits for reading cell data of the cell array blocks; and a busy signal generation circuit for generating a busy signal to the chip external, wherein in a first read cycle selecting a first area in a first cell array block, cell data read operations for the first area of the first cell array block and a second area of a second cell array block are simultaneously executed, while the busy signal generation circuit generates a true busy signal, and then a read data output operation is executed for outputting the read out data of the first area held in the sense amplifier circuits to the chip external, and in a second read cycle selecting the second area in the second cell array block, after the busy signal generation circuit has output a dummy busy signal shorter in time length than the true busy signal without executing cell data read operation, a read data output operation is executed for outputting the read out data of the second area held in the sense amplifier circuits to the chip external.
Abstract:
In the operation of writing the second page, the control circuit precharges the bit line in verifying data “2” in the memory cell when the DDC has data “1” in it after the data cache is set and does not precharge the bit line when the DDC has data “0” in it. As a result, when data “2” has been written into the memory cell, the bit line is at the intermediate potential, which raises the threshold voltage of the memory cell a little.