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公开(公告)号：US10854651B2
公开(公告)日：2020-12-01
申请号：US16536984
申请日：2019-08-09
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jean-Michel Grebet , Wee Chin Judy Lim
IPC: H01L27/146 , H01L31/0203
Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.
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公开(公告)号：US10749067B2
公开(公告)日：2020-08-18
申请号：US16430928
申请日：2019-06-04
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Loic Pierre Louis Renard , Cheng-Lay Ang
IPC: H01L31/173 , H01L31/0203 , H01L31/0236 , G01S17/08 , G01S7/481 , H01L31/046 , H01L31/047 , H01L31/0475 , H01G9/20 , H01L31/042 , H01L31/12 , H01S5/022 , H01S5/183
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
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公开(公告)号：US10475992B2
公开(公告)日：2019-11-12
申请号：US15783293
申请日：2017-10-13
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Ravi Shankar
Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.
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公开(公告)号：US10429330B2
公开(公告)日：2019-10-01
申请号：US15213230
申请日：2016-07-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Ravi Shankar , Shian Yeu Kam , Tien Choy Loh
Abstract: A miniature gas analyzer capable of detecting VOC gases in ambient air as well as sensing relative humidity and ambient temperature can be used to monitor indoor air quality. The VOC gas sensor is thermally controlled and can be tuned to detect a certain gas by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the VOC gas sensor at a desired temperature. A local temperature sensor may be integrated with each gas sensor to provide feedback control. The heater, local temperature sensor, gas sensor(s), relative humidity sensor, and ambient temperature sensor are in the form of patternable thin films integrated on a single microchip, e.g., an ASIC. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
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公开(公告)号：US10422860B2
公开(公告)日：2019-09-24
申请号：US15818465
申请日：2017-11-20
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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Patent Agency Ranking
公开(公告)号：US20190288155A1
公开(公告)日：2019-09-19
申请号：US16430928
申请日：2019-06-04
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Loic Pierre Louis RENARD , Cheng-Lay ANG
IPC: H01L31/173 , G01S7/481 , G01S17/08 , H01L31/0236 , H01L31/0203 , H01L31/047 , H01L31/042 , H01L31/046 , H01L31/0475 , H01G9/20 , H01S5/183 , H01L31/12 , H01S5/022
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
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公开(公告)号：US20190261899A1
公开(公告)日：2019-08-29
申请号：US16407054
申请日：2019-05-08
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier LE NEEL , Suman CHERIAN , Calvin LEUNG
IPC: A61B5/1473 , A61B5/1468 , G01N27/327 , A61B5/145
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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公开(公告)号：US10355146B2
公开(公告)日：2019-07-16
申请号：US16027647
申请日：2018-07-05
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En Luan , Laurent Herard , Yong Jiang Lei
IPC: H01L31/0203 , G01S7/481 , H01L31/12 , H01L31/153 , H01L31/18 , G01S17/02 , G01S17/46 , H01L31/173 , H01L25/00
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.
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公开(公告)号：US10317357B2
公开(公告)日：2019-06-11
申请号：US16128076
申请日：2018-09-11
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/18 , G01N27/22 , H01L25/00 , H01L25/065 , H01L29/78 , H01L27/02 , G01L19/00 , G01L9/12 , G01K7/20 , G01K7/16 , G01K7/01 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US10299711B2
公开(公告)日：2019-05-28
申请号：US15873557
申请日：2018-01-17
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung
IPC: G01N27/327 , A61B5/1473 , A61B5/145 , A61B5/1468
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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