公开(公告)号：US20180006182A1

公开(公告)日：2018-01-04

申请号：US15199390

申请日：2016-06-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  H01S5/022 ,  H01L31/12 ,  H01L31/042 ,  H01G9/20 ,  H01L31/0475 ,  H01L31/047 ,  H01S5/183 ,  H01L31/046

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20190288155A1

公开(公告)日：2019-09-19

申请号：US16430928

申请日：2019-06-04

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  G01S7/481 ,  G01S17/08 ,  H01L31/0236 ,  H01L31/0203 ,  H01L31/047 ,  H01L31/042 ,  H01L31/046 ,  H01L31/0475 ,  H01G9/20 ,  H01S5/183 ,  H01L31/12 ,  H01S5/022

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20180151772A1

公开(公告)日：2018-05-31

申请号：US15880090

申请日：2018-01-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  H01L31/12 ,  H01G9/20 ,  H01L31/046 ,  H01S5/183 ,  H01S5/022 ,  H01L31/042 ,  H01L31/0475 ,  H01L31/047

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183 ,  Y02E10/50

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.