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1.发明授权公开(公告)号：US12023653B2
公开(公告)日：2024-07-02
申请号：US17846433
申请日：2022-06-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hung-Yuan Hsieh
CPC classification number: B01J23/50 , B01J33/00 , B01J35/39 , C23C18/42 , C23C28/023
Abstract: A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.
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公开(公告)号：US20240200194A1
公开(公告)日：2024-06-20
申请号：US18539459
申请日：2023-12-14
Applicant: University of Dayton Research Institute
Inventor： Russell Kirk Pirlo , Ronald A. Zeszut
CPC classification number: C23C18/1834 , C23C18/42 , D01D5/003 , D01F8/04
Abstract: A process for creating a hybrid network of fibers comprises depositing a first polymer mixture (or solution) including a electroless plating initiator onto a collector. Simultaneously, a second polymer mixture (or solution) is deposited onto the collector while the first polymer mixture is being deposited. The second polymer mixture is not doped with a metal. A rate at which the first polymer mixture is deposited and a rate at which the second polymer mixture is deposited are controlled to control a ratio of metal-doped fibers and non-metal-doped fibers in a resulting hybrid network of fibers. The metal-doped fibers are created from the first polymer mixture and the non-metal-doped fibers are created from the second polymer mixture. After the fibers have been created, deposition of both the first polymer mixture and the second polymer mixture is stopped. The metal-doped fibers are metalized with a metal using electroless plating.
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公开(公告)号：US20240167163A1
公开(公告)日：2024-05-23
申请号：US18088204
申请日：2022-12-23
Applicant: UNIMICRON TECHNOLOGY CORP.
Inventor： YI LING CHEN , WEI TSE HO , CHIN-SHENG WANG , PU-JU LIN , CHENG-TA KO
IPC: C23C18/42 , C23C18/16 , C23C18/32 , H01L21/768 , H01L23/48
CPC classification number: C23C18/42 , C23C18/1637 , C23C18/165 , C23C18/1689 , C23C18/32 , H01L21/76898 , H01L23/481
Abstract: An anti-diffusion substrate structure includes a substrate, a substrate circuit layer, and a chip. The substrate has multiple through holes. Within each of the through holes includes a first metal layer and an anti-diffusion layer plated on the first metal layer. The anti-diffusion layer is an Electroless Palladium Immersion Gold (EPIG) layer or an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) layer. The substrate circuit layer is mounted on the substrate and extended on the anti-diffusion layer within each of the through holes. The substrate circuit layer is made of a second metal layer, and a composition of the second metal layer is different from a composition of the first metal layer. The chip is electrically connected to the substrate circuit layer. The anti-diffusion layer is able to better prevent material of the first metal layer from migrating or diffusing to the second metal layer.
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4.发明公开公开(公告)号：US20230264177A1
公开(公告)日：2023-08-24
申请号：US17846433
申请日：2022-06-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hung-Yuan HSIEH
CPC classification number: B01J23/50 , C23C18/42 , C23C28/023 , B01J33/00 , B01J35/004
Abstract: A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.
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5.发明公开公开(公告)号：US20230242770A1
公开(公告)日：2023-08-03
申请号：US17588411
申请日：2022-01-31
Applicant: KUWAIT INSTITUTE FOR SCIENTIFIC RESEARCH
Inventor： NASER ALSAYEGH , HUSAIN BAHZAD , NAWAF F. ALJUWAHEL
Abstract: A tablet-based method for fabricating a suspension including gold (Au) particles and water can include adding to water a solid tablet prepared from a solid alkaline powder, a solid acid powder, and gold particles. Carbon dioxide (CO2) gas can be generated once the tablet is added to the water. The gold (Au) particles can be in microparticle or nanoparticle form. The solid alkaline powder can include sodium bicarbonate (NaHCO3) or sodium carbonate (Na2CO3). The solid acid powder can include monosodium phosphate (NaH2PO4).
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Patent Agency Ranking
公开(公告)号：US20230227988A1
公开(公告)日：2023-07-20
申请号：US17803894
申请日：2023-01-12
Inventor： Viktor Balema , Sonal Padalkar , Ihor Hlova , Tian Lan , Oleksandr Dolotko , Vitalij K. Pecharsky , Duane D. Johnson , Arjun K. Pathak , Prashant Singh
IPC: C25B11/075 , C25D5/02 , C23C18/16 , C25D3/50 , C23C18/42 , C25D13/02 , C25B1/04 , C25B11/091 , C25B11/051 , C25B11/057 , G01N27/48
CPC classification number: C25B11/075 , C25D5/02 , C23C18/1639 , C25D3/50 , C23C18/42 , C25D13/02 , C25B1/04 , C25B11/091 , C25B11/051 , C25B11/057 , G01N27/48
Abstract: A cathode is provided for electrolysis of water wherein the cathode material comprises a multi-principal element, transition metal dichalcogenide material that has four or more chemical elements and that is a single phase, solid solution. The pristine cathode material does not contain platinum as a principal (major) component. However, a cathode comprising a transition metal dichalcogenide having platinum (Pt) nanosized islands or precipitates disposed thereon is also provided.
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公开(公告)号：US11702752B2
公开(公告)日：2023-07-18
申请号：US17007018
申请日：2020-08-31
Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor： Hirofumi Iisaka
CPC classification number: C23C28/023 , C23C18/1653 , C23C18/34 , C23C18/42 , C23C18/44 , C23C18/54
Abstract: A method that forms a metal plating film having a thick film thickness by a solid phase method is provided. The present disclosure is a method that forms the metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal. The method includes: depositing the second metal on a surface of a copper base material to form the plating film of the second metal; and depositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal. The solid electroless plating method in the depositing of the first metal is performed using a laminated complex. The laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material, a third metal, a second substitution-type electroless plating bath, and an insulating polymer. The first substitution-type electroless plating bath contains ions of the first metal. The second metal is plated on the copper base material. The third metal has an ionization tendency larger than the ionization tendency of the first metal. The second substitution-type electroless plating bath contains ions of the first metal.
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8.发明申请公开(公告)号：US20190080930A1
公开(公告)日：2019-03-14
申请号：US16083525
申请日：2017-03-10
Applicant: Atotech Deutschland GmbH
Inventor： Din-Ghee NEOH , Jürgen BARTHELMES
IPC: H01L21/48 , H01L23/31 , H01L23/495
CPC classification number: H01L23/49582 , C23C18/1603 , C23C18/1614 , C23C18/1689 , C23C18/1893 , C23C18/42 , C23C18/54 , C25D3/46 , C25D5/02 , C25D5/34 , C25D5/48 , H01L21/4821 , H01L23/14 , H01L23/3142 , H01L23/49541 , H01L23/49575 , H01L23/564
Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.
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公开(公告)号：US20180138135A1
公开(公告)日：2018-05-17
申请号：US15564301
申请日：2016-04-01
Applicant: MITSUBISHI ELECTRIC CORPORATION
Inventor： Masatoshi SUNAMOTO , Ryuji UENO
CPC classification number: H01L24/05 , C23C18/1637 , C23C18/1651 , C23C18/1844 , C23C18/32 , C23C18/36 , C23C18/42 , C23C18/54 , H01L21/288 , H01L24/03 , H01L2224/03464 , H01L2224/05124 , H01L2224/05582 , H01L2224/05644 , H01L2224/05655
Abstract: In a semiconductor element of the present invention, an electroless nickel-phosphorus plating layer and an electroless gold plating layer are formed on both a front-side electrode and a back-side electrode of a front-back conduction-type substrate. The front-side electrode and the back-side electrode are formed of aluminum or an aluminum alloy. The proportion of the thickness of the electroless nickel-phosphorus plating layer formed on the front-side electrode with respect to the thickness of the electroless nickel-phosphorus plating layer formed on the back-side electrode is in a range of 1.0 to 3.5. The semiconductor element of the present invention allows the occurrence of voids inside solder during mounting by soldering to be prevented.
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10.发明申请公开(公告)号：US20180104385A1
公开(公告)日：2018-04-19
申请号：US15847331
申请日：2017-12-19
Applicant: Bactiguard AB
Inventor： Mattias Ohrlander , Billy Södervall
IPC: A61L31/08 , A61K33/38 , A01N59/16 , A61K9/00 , A01N25/08 , A61L31/02 , A61L31/04 , A61L31/06 , B05D3/02 , A61L26/00 , B32B27/16 , B32B27/14 , B32B15/16 , B32B9/00 , B32B5/30 , A61K33/24 , A61L2/238 , A61L27/30 , A61L27/50 , A61L29/10 , C23C30/00 , C23C26/00 , C23C18/44 , C23C18/42 , C23C18/18 , C23C18/16 , B32B27/00 , B32B5/16 , A61L33/00 , A01N25/10 , A01N25/34
CPC classification number: A61L31/088 , A01N25/08 , A01N59/16 , A61K9/00 , A61K33/24 , A61K33/38 , A61L2/238 , A61L26/0004 , A61L27/30 , A61L27/306 , A61L27/50 , A61L29/10 , A61L29/106 , A61L31/022 , A61L31/024 , A61L31/026 , A61L31/042 , A61L31/048 , A61L31/06 , A61L31/08 , A61L33/0076 , A61L2400/18 , A61L2420/02 , B05D3/0254 , B32B5/16 , B32B5/30 , B32B9/005 , B32B15/16 , B32B27/00 , B32B27/14 , B32B27/16 , B32B2255/10 , B32B2255/205 , B32B2264/105 , B32B2307/7145 , B32B2307/73 , B32B2535/00 , C23C18/1635 , C23C18/1646 , C23C18/1689 , C23C18/18 , C23C18/42 , C23C18/44 , C23C26/00 , C23C30/00 , Y10T428/12569 , Y10T428/12875 , Y10T428/12896 , Y10T428/256 , Y10T428/27 , Y10T428/273 , Y10T428/29 , Y10T428/2991 , Y10T428/31667 , Y10T428/31678 , A01N25/10 , A01N25/34 , A01N2300/00
Abstract: There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm2. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels.
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