Semiconductor devices and methods of manufacturing the same

    公开(公告)号:US11387367B2

    公开(公告)日:2022-07-12

    申请号:US17034421

    申请日:2020-09-28

    Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are stacked in a vertical direction. Each channel extends in a first direction. The gate structure extends in a second direction. The gate structure covers the channels. The source/drain layer is connected to each of opposite sidewalls in the first direction of the channels on the substrate, and includes a doped semiconductor material. The source/drain layer includes first and second epitaxial layers having first and second impurity concentrations, respectively. The first epitaxial layer covers a lower surface and opposite sidewalls in the first direction of the second epitaxial layer. A portion of each of opposite sidewalls in the first direction of the gate structure protrudes in the first direction from opposite sidewalls in the first direction of the channels to partially penetrate through the first epitaxial layer but not to contact the second epitaxial layer.

    Semiconductor Devices
    2.
    发明申请

    公开(公告)号:US20210074701A1

    公开(公告)日:2021-03-11

    申请号:US16855321

    申请日:2020-04-22

    Abstract: A semiconductor device may include a substrate including first regions and a second region between the first regions. Active fins may protrude from the substrate in the first regions. Each of the active fins may extend in a first direction parallel to an upper surface of the substrate. The active fins may be regularly arranged and spaced apart from each other in a second direction. First trenches may be at both edges of the second region. A protrusion may be between the first trenches. An upper surface of the protrusion may be lower than a bottom of the active fins. A first width in the second direction of one of the first trenches may be greater than 0.7 times a first pitch of the active fins that is a sum of a width of one of the active fins and a distance between adjacent ones of the active fins.

    SEMICONDUCTOR DEVICES
    3.
    发明公开

    公开(公告)号:US20240128354A1

    公开(公告)日:2024-04-18

    申请号:US18231549

    申请日:2023-08-08

    CPC classification number: H01L29/66545 H01L23/481 H01L29/66795

    Abstract: In a method of manufacturing a semiconductor device, an alignment key is formed through a portion of a substrate including first and second surfaces opposite to each other, which is adjacent to the second surface of the substrate. A transistor including a gate structure and a source/drain layer is formed on the second surface of the substrate. A portion of the substrate adjacent to the first surface of the substrate is removed to expose the alignment key. A contact plug is formed through a portion of the substrate adjacent to the first surface of the substrate to be electrically connected to the source/drain layer. A power rail is formed on the first surface of the substrate to be electrically connected to the contact plug.

    Semiconductor devices
    4.
    发明授权

    公开(公告)号:US11410997B2

    公开(公告)日:2022-08-09

    申请号:US16855321

    申请日:2020-04-22

    Abstract: A semiconductor device may include a substrate including first regions and a second region between the first regions. Active fins may protrude from the substrate in the first regions. Each of the active fins may extend in a first direction parallel to an upper surface of the substrate. The active fins may be regularly arranged and spaced apart from each other in a second direction. First trenches may be at both edges of the second region. A protrusion may be between the first trenches. An upper surface of the protrusion may be lower than a bottom of the active fins. A first width in the second direction of one of the first trenches may be greater than 0.7 times a first pitch of the active fins that is a sum of a width of one of the active fins and a distance between adjacent ones of the active fins.

    Semiconductor devices and methods of manufacturing the same

    公开(公告)号:US12261220B2

    公开(公告)日:2025-03-25

    申请号:US18597440

    申请日:2024-03-06

    Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are stacked in a vertical direction. Each channel extends in a first direction. The gate structure extends in a second direction. The gate structure covers the channels. The source/drain layer is connected to each of opposite sidewalls in the first direction of the channels on the substrate, and includes a doped semiconductor material. The source/drain layer includes first and second epitaxial layers having first and second impurity concentrations, respectively. The first epitaxial layer covers a lower surface and opposite sidewalls in the first direction of the second epitaxial layer. A portion of each of opposite sidewalls in the first direction of the gate structure protrudes in the first direction from opposite sidewalls in the first direction of the channels to partially penetrate through the first epitaxial layer but not to contact the second epitaxial layer.

    METHOD OF FORMING PATTERNS OF SEMICONDUCTOR DEVICE

    公开(公告)号:US20240194521A1

    公开(公告)日:2024-06-13

    申请号:US18533635

    申请日:2023-12-08

    Abstract: A method of forming a pattern of a semiconductor device, the method comprising forming an insulating film on a substrate having a first region and a second region, sequentially forming a lower mask layer and an upper mask layer on the insulating film, forming a line-shaped hard mask pattern having a plurality of narrow openings having the same width in the first region and the second region, respectively, on the upper mask layer, forming line-shaped spacers on sidewalls of the opening of the line-shaped hard mask pattern, forming a composite mask pattern composed of the spacer and a pattern having a first width among the line-shaped hard mask pattern by removing a pattern having a second width among the line-shaped hard mask patterns, the second width being smaller than the first width.

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