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公开(公告)号：US20240165725A1
公开(公告)日：2024-05-23
申请号：US17992322
申请日：2022-11-22
Applicant: Raytheon Company , Brazonics, Inc.
Inventor： Craig H. Mccordic , Mary K. Herndon , Ralph P. Mason , Edward I. Holmes , Lee P. Barber , Jordan Joel Castillo , Scott J. Champagne , Brian K. Bacon
Abstract: A method of decreasing a cycle time of a brazing process is provided. The method includes arranging each of first and second pairs of braze parts together, each of the first and second pairs of the braze parts having braze material interposed between the braze parts, stacking the first and second pairs of the braze parts to form a stack, interposing pyrolytic graphite (PG) between the first pair of the braze parts and the second pair of the braze parts in the stack and heating the first and second pairs of the braze parts to a brazing temperature to braze the braze parts of each of the first and second pairs of the braze parts together.
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公开(公告)号：US20220250334A1
公开(公告)日：2022-08-11
申请号：US17172523
申请日：2021-02-10
Applicant: Raytheon Company
Inventor： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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公开(公告)号：US11075141B2
公开(公告)日：2021-07-27
申请号：US16569330
申请日：2019-09-12
Applicant: Raytheon Company
Inventor： Anurag Gupta , David A. Brooks , Mary K. Herndon
IPC: H01L23/42 , H01L21/48 , H01L23/46 , H01L23/367
Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.
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公开(公告)号：US20210151855A1
公开(公告)日：2021-05-20
申请号：US16683593
申请日：2019-11-14
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , John P. Haven , Kevin Wilder , James E. Benedict , Andrew R. Southworth , Mary K. Herndon
Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.
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公开(公告)号：US11089673B2
公开(公告)日：2021-08-10
申请号：US16517043
申请日：2019-07-19
Applicant: RAYTHEON COMPANY
Inventor： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
IPC: H05K1/02 , H05K1/09 , H05K1/11 , H05K1/14 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/22 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/46 , H01L21/00 , H01L21/205 , H01L23/48 , H01L23/60 , H01L23/522 , H01L23/528 , H05K9/00 , H01Q1/38 , H01Q1/52 , H05K3/30
Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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Patent Agency Ranking
公开(公告)号：US20210022238A1
公开(公告)日：2021-01-21
申请号：US16517043
申请日：2019-07-19
Applicant: RAYTHEON COMPANY
Inventor： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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7.发明授权公开(公告)号：US09974160B1
公开(公告)日：2018-05-15
申请号：US15392142
申请日：2016-12-28
Applicant: Raytheon Company
Inventor： Thomas V. Sikina , Mary K. Herndon , John P. Haven , Alkim Akyurtlu
CPC classification number: H05K1/0237 , H01P3/08 , H01P3/085 , H01P5/028 , H05K1/11 , H05K3/40 , H05K3/403 , H05K3/46 , H05K2201/0919
Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.
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8.发明申请TUNABLE ELECTROMAGNETIC DEVICE WITH MULTIPLE METAMATERIAL LAYERS, AND METHOD 审中-公开具有多个金属层的电容式电磁元件及方法公开(公告)号：US20140097996A1
公开(公告)日：2014-04-10
申请号：US13648464
申请日：2012-10-10
Applicant: RAYTHEON COMPANY
Inventor： Jacquelyn A. Vitaz , Christopher P. Mccarroll , Mary K. Herndon
CPC classification number: H01Q1/42 , H01Q1/34 , H01Q15/002 , H01Q15/0086
Abstract: A tunable electromagnetic device includes at least two overlapping metamaterial layers, wherein the metamaterial layers are selectively tunable by patterned conductive structures that are parts of the metamaterial layers. By selectively altering the properties of the metamaterial layers with the patterned conductive structures, the frequency response of the electromagnetic device can be controlled, to selectively let electromagnetic energy of certain frequencies pass through, or alternatively to prevent pass-through of substantially all frequencies of electromagnetic energy. In addition the frequencies for which electromagnetic energy passes through may be altered by controlling one or more of the tunable metamaterial layers. The tunable electromagnetic device may be used to selectively shield radar or other types of sensors, for example being used as all or part of the skin of a vehicle or other object.
Abstract translation: 可调谐电磁装置包括至少两个重叠的超材料层，其中超材料层可以通过作为超材料层的部分的图案化导电结构选择性地调节。 通过选择性地改变具有图案化导电结构的超材料层的性质，可以控制电磁装置的频率响应，以选择性地使某些频率的电磁能量通过，或者替代地防止基本上所有电磁频率的通过 能源。 此外，电磁能量通过的频率可以通过控制一个或多个可调谐超材料层来改变。 可调谐电磁装置可用于选择性地屏蔽雷达或其它类型的传感器，例如用作车辆或其他物体的全部或部分皮肤。
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公开(公告)号：US11899277B2
公开(公告)日：2024-02-13
申请号：US18184952
申请日：2023-03-16
Applicant: Raytheon Company
Inventor： Sunder S. Rajan , Nicholas J. LoVullo , Keith Carrigan , Mary K. Herndon
Abstract: A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° Celsius (° C.).
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10.发明公开公开(公告)号：US20230280564A1
公开(公告)日：2023-09-07
申请号：US18184952
申请日：2023-03-16
Applicant: Raytheon Company
Inventor： Sunder S. Rajan , Nicholas J. LoVullo , Keith Carrigan , Mary K. Herndon
Abstract: A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt.% zirconium, and about 18 to about 19 weight% (wt.%) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° C. (°C).
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