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    CIRCUITS AND TECHNIQUES FOR A VIA-LESS BEAMFORMER
    1.
    发明申请
    CIRCUITS AND TECHNIQUES FOR A VIA-LESS BEAMFORMER 审中-公开

    公开(公告)号：US20180183146A1

    公开(公告)日：2018-06-28

    申请号：US15390764

    申请日：2016-12-27

    Applicant: Raytheon Company

    Inventor： Thomas V. Sikina ,  John P. Haven ,  Philip M. Henault ,  Alkim Akyurtlu

    IPC: H01Q3/34 ,  G01S13/02

    CPC classification number: H01Q3/34 ,  G01S13/02 ,  G01S2013/0254 ,  H01P5/16 ,  H01Q21/0075

    Abstract: A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.

    PRINTABLE MIXTURE, MANUFACTURE, AND USE
    8.
    发明申请
    PRINTABLE MIXTURE, MANUFACTURE, AND USE 有权

    公开(公告)号：US20220220331A1

    公开(公告)日：2022-07-14

    申请号：US17629798

    申请日：2020-07-30

    Applicant: University of Massachusetts ,  Raytheon Company

    Inventor： Oshadha K. Ranasingha ,  Andrew M. Luce ,  Guinevere M. Strack ,  Mahdi Haghzadeh ,  Cameron Hardie ,  Edward Kingsley ,  Craig A. Armiento ,  Alkim Akyurtlu

    IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  B41J11/00

    Abstract: This disclosure describes manufacture of a mixture and use of same to fabricate different types of electronic components. In one configuration, the mixture includes: first particles, the first particles being an insulator material; second particles, the second particles being electrically conductive metal material; and a combination of the first particles and the second particles suspended in a printable liquid medium, the printable liquid/solid medium (slurry) being curable into a dielectric layer of material. According to one configuration, the printable material is disposed and cured on a substrate. The first particles and second particles are randomly distributed in the cured printed material (dielectric material). The second particles in the cured dielectric material are transformable into one or more electrically conductive paths, electronic components, etc., via application of heat above a threshold value. Thus, a dielectric (insulator) material can be transformed into an electrically conductive path via application of heat.

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