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公开(公告)号：US20230139276A1
公开(公告)日：2023-05-04
申请号：US17515870
申请日：2021-11-01
发明人： Craig A. Armiento , Yuri Piro , Andrew M. Luce , Emily Lamport , Oshadha Ranasingha , Christopher R. Areias , Christopher N. Kuncho , Alkim Akyurtlu , Edward D. Kingsley
IPC分类号： H05K1/18 , H05K3/30 , C09D11/102 , C09D11/101 , C09D11/037
摘要： A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
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公开(公告)号：US12096561B2
公开(公告)日：2024-09-17
申请号：US17515870
申请日：2021-11-01
发明人： Craig A. Armiento , Yuri Piro , Andrew M. Luce , Emily Lamport , Oshadha Ranasingha , Christopher R. Areias , Christopher N. Kuncho , Alkim Akyurtlu , Edward D. Kingsley
IPC分类号： H05K1/18 , C09D11/037 , C09D11/101 , C09D11/102 , H05K3/30
CPC分类号： H05K1/183 , C09D11/037 , C09D11/101 , C09D11/102 , H05K3/30 , H05K2201/0112 , H05K2201/0137 , H05K2201/0209
摘要： A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
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公开(公告)号：US20230332003A1
公开(公告)日：2023-10-19
申请号：US18134785
申请日：2023-04-14
发明人： Yuri Piro , Susan C. Trulli , Craig Alfred Armiento , Christopher R. Areias , Alkim Akyurtlu , James Reuther
IPC分类号： C09D11/101 , C09D11/03 , C09D11/108 , B41M7/00
CPC分类号： C09D11/101 , C09D11/03 , C09D11/108 , B41M7/009
摘要： A printable dielectric ink composition includes an inhibited catalyst-polymer complex and a crosslinker, wherein the printable dielectric ink composition has a viscosity of about 1 to about 10 cP.
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公开(公告)号：US20240002692A1
公开(公告)日：2024-01-04
申请号：US18344143
申请日：2023-06-29
发明人： Susan C. Trulli , Yuri Piro , Alkim Akyurtlu
CPC分类号： C09D163/00 , C09D7/63 , C09D7/61 , C08G59/32 , C08K3/38 , C08K7/20 , H05K1/183 , H05K1/185 , C08K2003/385 , H05K2201/10378 , H05K2201/10636
摘要： A composition for making a filler including a plurality of ceramic particles, an oxirane monomer in liquid form, an ultraviolet initiator that absorbs ultraviolet, and a thermal initiator.
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公开(公告)号：US20230017655A1
公开(公告)日：2023-01-19
申请号：US17372907
申请日：2021-07-12
发明人： Yuri Piro , Christopher R. Areias , Andrew M. Luce , Oshadha Ranasingha , Emily Lamport , Alkim Akyurtlu , Edward D. Kingsley , Craig A. Armiento
IPC分类号： C09D11/38 , C09D11/328 , C09D11/101 , C09D11/102 , C09D11/037 , B41M5/00 , B41J11/00
摘要： A dielectric ink composition includes an epoxy precursor and a photoacid generator. The dielectric ink composition is aerosolable and ultraviolet (UV) curable.
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公开(公告)号：US20230014456A1
公开(公告)日：2023-01-19
申请号：US17373083
申请日：2021-07-12
发明人： Christopher R. Areias , Yuri Piro , Andrew M. Luce , Guinevere M. Strack , Oshadha Ranasingha , Alkim Akyurtlu , Edward D. Kingsley , Craig A. Armiento
IPC分类号： B29C64/112 , B29C64/129 , C09D11/52 , C09D11/101 , B33Y10/00 , B33Y40/10 , B29C64/205 , C09D11/102 , C09D11/03 , B33Y70/00 , C09D11/50
摘要： A method of fabricating a three-dimensional (3D) object includes atomizing a pre-polymer composition into an aerosol jet stream. The pre-polymer composition includes an epoxy precursor and a photoacid generator. The method further includes depositing the aerosol jet stream onto a substrate to form a first layer of dielectric ink and curing the first layer of dielectric ink using ultraviolet (UV) light. The method further includes depositing the aerosol jet stream onto the first layer of dielectric ink to form a second layer of dielectric ink. The first layer of dielectric ink and the second layer of dielectric ink overlap by at least 50%.
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7.发明申请公开(公告)号：US20230113929A1
公开(公告)日：2023-04-13
申请号：US17938688
申请日：2022-10-07
发明人： Craig A. Armiento , Yuri Piro , Oshadha Ranasingha , Andrew M. Luce , Edward D. Kingsley , Alkim Akyurtlu
IPC分类号： C09D11/54 , C09D11/52 , C09D11/107
摘要： An ink stabilizing composition includes a polymeric network including an acrylate polymer and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.
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公开(公告)号：US20180134866A1
公开(公告)日：2018-05-17
申请号：US15813388
申请日：2017-11-15
发明人： Alkim Akyurtlu , Joey L. Mead , Carol M.F. Barry , Mahdi Haghzadeh , Artee Panwar , Mary K. Herndon
摘要： Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.
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公开(公告)号：US10703877B2
公开(公告)日：2020-07-07
申请号：US15813388
申请日：2017-11-15
发明人： Alkim Akyurtlu , Joey L. Mead , Carol M. F. Barry , Mahdi Haghzadeh , Artee Panwar , Mary K. Herndon
摘要： Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.
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公开(公告)号：US20180183146A1
公开(公告)日：2018-06-28
申请号：US15390764
申请日：2016-12-27
申请人： Raytheon Company
CPC分类号： H01Q3/34 , G01S13/02 , G01S2013/0254 , H01P5/16 , H01Q21/0075
摘要： A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.
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