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    MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES
    2.
    发明申请
    MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES 审中-公开

    公开(公告)号：US20200091035A1

    公开(公告)日：2020-03-19

    申请号：US16569330

    申请日：2019-09-12

    Applicant: Raytheon Company

    Inventor： Anurag Gupta ,  David A. Brooks ,  Mary K. Herndon

    IPC: H01L23/42 ,  H01L23/367 ,  H01L23/46 ,  H01L21/48

    Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.

    MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) COOLING STRUCTURE
    3.
    发明申请
    MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) COOLING STRUCTURE 审中-公开

    公开(公告)号：US20190295918A1

    公开(公告)日：2019-09-26

    申请号：US15935622

    申请日：2018-03-26

    Applicant: Raytheon Company

    Inventor： Susan C. Trulli ,  Anurag Gupta

    IPC: H01L23/367 ,  H01L23/46 ,  H01L23/66 ,  H01L23/00 ,  H01L23/373

    Abstract: A Monolithic Integrated Circuit (MMIC) cooling structure having a heat spreader thermally comprising a anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the MMIC being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the MMIC; and, a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane.

    Coolant Distribution Structure For Monolithic Microwave Integrated Circuits (MMICs)
    6.
    发明申请
    Coolant Distribution Structure For Monolithic Microwave Integrated Circuits (MMICs) 有权
    单片微波集成电路（MMIC）的冷却液分配结构

    公开(公告)号：US20160365300A1

    公开(公告)日：2016-12-15

    申请号：US14734372

    申请日：2015-06-09

    Applicant: Raytheon Company

    Inventor： Anurag Gupta ,  David H. Altman ,  Jason G. Milne ,  Christopher R. Koontz

    IPC: H01L23/473 ,  H01L23/373 ,  H01L23/367 ,  H01L23/66

    CPC classification number: H01L23/473 ,  H01L23/367 ,  H01L23/3732 ,  H01L23/66 ,  H01L2223/6683

    Abstract: A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the passthrough layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.

    Abstract translation: 用于MMIC的冷却剂分配结构具有：输入/输出层，其具有用于接收用于传输到MMIC中的冷却剂通道的冷却剂的输入端口和用于在这种冷却剂已经冷却了MMIC中的有源器件之后离开冷却剂的输出端口， 冷却剂通过层，以从输入端口接收冷却剂，并且具有阻止这种接收的冷却剂直接通过到输出端口的结构，冷却剂分配层，用于接收从冷却剂通过层通过的冷却剂并将这种接收到的冷却剂分配到 冷却通道以吸收由有源装置产生的热量，然后经由透气层将加热的冷却剂引导至冷却剂分配层并离开移动层。 冷却剂通过层具有被配置为在被加热的吸收的冷却剂被传输到输出端口之前禁止这种加热的冷却剂直接通到输入端口的结构。

    Coolant distribution structure for monolithic microwave integrated circuits (MMICs)
    7.
    发明授权
    Coolant distribution structure for monolithic microwave integrated circuits (MMICs) 有权
    单片微波集成电路（MMIC）的冷却液分配结构

    公开(公告)号：US09502330B1

    公开(公告)日：2016-11-22

    申请号：US14734372

    申请日：2015-06-09

    Applicant: Raytheon Company

    Inventor： Anurag Gupta ,  David H. Altman ,  Jason G. Milne ,  Christopher R. Koontz

    IPC: H01L23/473 ,  H01L23/66 ,  H01L23/373 ,  H01L23/367

    CPC classification number: H01L23/473 ,  H01L23/367 ,  H01L23/3732 ,  H01L23/66 ,  H01L2223/6683

    Abstract: A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the pass-through layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.

    Abstract translation: 用于MMIC的冷却剂分配结构具有：输入/输出层，其具有用于接收用于传输到MMIC中的冷却剂通道的冷却剂的输入端口和用于在这种冷却剂已经冷却了MMIC中的有源器件之后离开冷却剂的输出端口， 冷却剂通过层，以从输入端口接收冷却剂，并且具有阻止这种接收的冷却剂直接通过到输出端口的结构，冷却剂分配层，用于接收从冷却剂通过层通过的冷却剂并将这种接收到的冷却剂分配到 冷却通道以吸收由有源装置产生的热量，然后经由穿通层将加热的冷却剂引导至冷却剂分配层并移出端口层。 冷却剂通过层具有被配置为在被加热的吸收的冷却剂被传输到输出端口之前禁止这种加热的冷却剂直接通到输入端口的结构。

    Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices
    9.
    发明授权
    Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices 有权

    公开(公告)号：US11075141B2

    公开(公告)日：2021-07-27

    申请号：US16569330

    申请日：2019-09-12

    Applicant: Raytheon Company

    Inventor： Anurag Gupta ,  David A. Brooks ,  Mary K. Herndon

    IPC: H01L23/42 ,  H01L21/48 ,  H01L23/46 ,  H01L23/367

    Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.

    FORCED CONVECTION LIQUID COOLING OF FLUID-FILLED HIGH DENSITY PULSED POWER CAPACITOR WITH NATIVE FLUID
    10.
    发明申请
    FORCED CONVECTION LIQUID COOLING OF FLUID-FILLED HIGH DENSITY PULSED POWER CAPACITOR WITH NATIVE FLUID 有权
    流体填充高密度脉冲电力电容器的强制对流液体冷却

    公开(公告)号：US20160055971A1

    公开(公告)日：2016-02-25

    申请号：US14467299

    申请日：2014-08-25

    Applicant: Raytheon Company

    Inventor： Anurag Gupta ,  Robert R. Lopez ,  Stephen B. Kuznetsov

    IPC: H01G2/08 ,  H01G4/38

    CPC classification number: H01G2/08 ,  H01G2/106 ,  H01G4/38

    Abstract: A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings along an outer surface of each of the capacitors to cool the capacitors using forced convection. The heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. The heat exchanger may have a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank.

    Abstract translation: 高密度电容器包括具有空腔的壳体和形成设置在壳体腔中的至少一个电容器组的多个电容器。 天然冷却流体设置在空腔中，并且热交换器联接到壳体。 泵被构造成使空气中的天然冷却流体通过热交换器通过沿着每个电容器的外表面的间隔循环，以使用强制对流来冷却电容器。 热交换器构造成使二次流体通过热交换器并从流过热交换器的天然冷却流体抽取热量。 热交换器可以具有多个开口，该多个开口被配置为从靠近该至少一个电容器组的热交换器分配天然冷却流体。

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