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公开(公告)号：US11569574B2
公开(公告)日：2023-01-31
申请号：US16418231
申请日：2019-05-21
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , John P. Haven , Peter J. Adams , Thomas V. Sikina
Abstract: A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.
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公开(公告)号：US11497118B2
公开(公告)日：2022-11-08
申请号：US17174904
申请日：2021-02-12
Applicant: RAYTHEON COMPANY
Inventor： Channing Paige Favreau , James E. Benedict , Mikhail Pevzner , Thomas V. Sikina
Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.
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公开(公告)号：US20220254750A1
公开(公告)日：2022-08-11
申请号：US17169098
申请日：2021-02-05
Applicant: Raytheon Company
Inventor： Patrick E. Boyle , James E. Benedict , Erika Klek , Mikhail Pevzner
IPC: H01L23/00
Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.
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公开(公告)号：US11375609B2
公开(公告)日：2022-06-28
申请号：US17091585
申请日：2020-11-06
Applicant: RAYTHEON COMPANY
Inventor： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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5.发明授权公开(公告)号：US11122692B1
公开(公告)日：2021-09-14
申请号：US16898930
申请日：2020-06-11
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , Gregory G. Beninati , Mikhail Pevzner , Thomas V. Sikina , Andrew R. Southworth
Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.
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Patent Agency Ranking
公开(公告)号：US10813210B2
公开(公告)日：2020-10-20
申请号：US16184571
申请日：2018-11-08
Applicant: RAYTHEON COMPANY
Inventor： Semira M. Azadzoi , James E. Benedict , John P. Haven , Thomas V. Sikina , Andrew R. Southworth
Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号：US20190269021A1
公开(公告)日：2019-08-29
申请号：US16287260
申请日：2019-02-27
Applicant: RAYTHEON COMPANY
Inventor： Jonathan E. Nufio-Molina , Thomas V. Sikina , James E. Benedict , Andrew R. Southworth , Semira M. Azadzoi
Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
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8.发明申请公开(公告)号：US20190150271A1
公开(公告)日：2019-05-16
申请号：US16184571
申请日：2018-11-08
Applicant: RAYTHEON COMPANY
Inventor： Semira M. Azadzoi , James E. Benedict , John P. Haven , Thomas V. Sikina , Andrew R. Southworth
CPC classification number: H05K1/0218 , H01P3/08 , H01P11/003 , H05K1/0219 , H05K1/0221 , H05K1/0251 , H05K1/112 , H05K3/0044 , H05K3/107 , H05K3/4007 , H05K3/4038 , H05K3/4611 , H05K2201/0707 , H05K2201/09036 , H05K2201/09545 , H05K2203/0228
Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号：US20190148832A1
公开(公告)日：2019-05-16
申请号：US16180822
申请日：2018-11-05
Applicant: RAYTHEON COMPANY
Inventor： Peter J. Adams , Thomas V. Sikina , John P. Haven , James E. Benedict
Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
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公开(公告)号：US12266629B2
公开(公告)日：2025-04-01
申请号：US17169098
申请日：2021-02-05
Applicant: Raytheon Company
Inventor： Patrick E. Boyle , James E. Benedict , Erika Klek , Mikhail Pevzner
IPC: H01L23/00
Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.
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