-
公开(公告)号：US11776754B2
公开(公告)日：2023-10-03
申请号：US17510549
申请日：2021-10-26
CPC分类号： H01G4/2325 , H01G2/065 , H01G4/248 , H01G4/30
摘要： An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.
-
公开(公告)号：US11676757B2
公开(公告)日：2023-06-13
申请号：US16930093
申请日：2020-07-15
CPC分类号： H01F27/32 , H01F27/24 , H01F27/2823 , H01F27/29 , H01F41/061 , H01F41/12
摘要： An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.
-
公开(公告)号：US10825610B2
公开(公告)日：2020-11-03
申请号：US15916727
申请日：2018-03-09
发明人： Hidehiko Tanaka , Toshikazu Makino , Shinji Otani
摘要： A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.
-
公开(公告)号：US09881741B2
公开(公告)日：2018-01-30
申请号：US14944656
申请日：2015-11-18
发明人： Shinji Otani
IPC分类号： H01G4/30 , H01F27/29 , H01L41/047 , H01L41/293 , H01F17/00 , H01G4/232 , H01G4/012 , H01G4/12 , H01C7/00
CPC分类号： H01G4/30 , H01C7/008 , H01F17/0013 , H01F27/292 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/2325 , H01L41/0472 , H01L41/293
摘要： A multilayer ceramic capacitor includes a ceramic base body and is structured such that fluorine is present between the ceramic base body and a sintered metal layer or between a sintered metal layer and a conductive resin layer.
-
公开(公告)号：US20170365419A1
公开(公告)日：2017-12-21
申请号：US15622342
申请日：2017-06-14
发明人： Hiroyuki Demizu , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Tadahisa Sano , Koji Fujimoto , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a plurality of capacitor elements each including an anode portion, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body; a first external electrode; and a second external electrode. The plurality of capacitor elements are stacked in layers, with mutually adjacent capacitor elements having their respective current collector layers connected to each other. The current collector layer of only the capacitor element adjacent to the leading conductor layer is connected to the leading conductor layer. The first external electrode is connected to the leading conductor layer at the first end surface.
-
公开(公告)号：US09779876B2
公开(公告)日：2017-10-03
申请号：US14922550
申请日：2015-10-26
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
IPC分类号： B32B37/00 , B29C65/00 , C03B29/00 , H01G4/30 , H01G4/252 , H05K3/12 , H01G4/12 , H01G13/00 , H01G4/005 , H01G4/012 , H01G4/248 , H05K3/46
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/252 , H01G13/006 , H05K3/1283 , H05K3/4664
摘要： A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.
-
7.发明授权Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module 有权固体电解电容器，电子部件模块，固体电解电容器的制造方法及电子部件模块的制造方法公开(公告)号：US09472351B2
公开(公告)日：2016-10-18
申请号：US14591068
申请日：2015-01-07
发明人： Akio Katsube , Hiroki Kitayama , Shinji Otani , Koji Murata
CPC分类号： H01G9/15 , H01G9/0032 , H01G9/012 , H01G9/042 , H01G9/14 , H01L2924/181 , H05K1/181 , H05K3/3426 , H05K3/3494 , H05K2201/10015 , Y02P70/613 , Y10T29/417 , Y10T29/49144 , H01L2924/00012
摘要： A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
摘要翻译： 一种固体电解电容器，包括电容器元件; 外部树脂; 阳极引线端子; 和阴极引线端子。 阳极引线端子具有Cu基材和形成在其上的Au镀层，并且包括形成作为表面层的Au镀层的Au区域和不形成Au镀层的Cu区域 。 阴极引线端子包括基材，形成在基材上的作为阴极引线端子的表面层的镀覆层，电容器元件的阳极部分连接到阳极的Cu区域 引线终端。
-
8.发明申请SOLID ELECTROLYTIC CAPACITOR, ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE 有权固体电解电容器，电子元件模块，用于制造固体电解电容器的方法和用于生产电子元件模块的方法公开(公告)号：US20150194270A1
公开(公告)日：2015-07-09
申请号：US14591068
申请日：2015-01-07
发明人： Akio Katsube , Hiroki Kitayama , Shinji Otani , Koji Murata
CPC分类号： H01G9/15 , H01G9/0032 , H01G9/012 , H01G9/042 , H01G9/14 , H01L2924/181 , H05K1/181 , H05K3/3426 , H05K3/3494 , H05K2201/10015 , Y02P70/613 , Y10T29/417 , Y10T29/49144 , H01L2924/00012
摘要： A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
摘要翻译： 一种固体电解电容器，包括电容器元件; 外用树脂; 阳极引线端子; 和阴极引线端子。 阳极引线端子具有Cu基材和形成在其上的Au镀层，并且包括形成作为表面层的Au镀层的Au区域和不形成Au镀层的Cu区域 。 阴极引线端子包括基材，形成在基材上的作为阴极引线端子的表面层的镀覆层，电容器元件的阳极部分连接到阳极的Cu区域 引线终端。
-
公开(公告)号：US11842842B2
公开(公告)日：2023-12-12
申请号：US17174276
申请日：2021-02-11
发明人： Yoshimasa Yoshioka , Hiroki Imaeda , Shinji Otani
IPC分类号： H01F27/28 , H01F27/255 , H01F41/04 , H01F41/02 , H01F27/29
CPC分类号： H01F27/2804 , H01F27/255 , H01F27/29 , H01F41/0206 , H01F41/043 , H01F2027/2809
摘要： An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.
-
公开(公告)号：US11810706B2
公开(公告)日：2023-11-07
申请号：US16830170
申请日：2020-03-25
发明人： Namiko Sasajima , Hiroki Imaeda , Masami Okado , Shinji Otani , Tomohiro Sunaga , Yoshimasa Yoshioka
IPC分类号： H01F27/06 , H01F27/255 , H01F27/29
CPC分类号： H01F27/06 , H01F27/255 , H01F27/29
摘要： An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.
-
-
-
-
-
-
-
-
-
搜索结果
37 条记录 (耗时 0.023 秒)
