发明申请
US20150194270A1 SOLID ELECTROLYTIC CAPACITOR, ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE
有权
固体电解电容器，电子元件模块，用于制造固体电解电容器的方法和用于生产电子元件模块的方法
- 专利标题： SOLID ELECTROLYTIC CAPACITOR, ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE
- 专利标题（中）： 固体电解电容器，电子元件模块，用于制造固体电解电容器的方法和用于生产电子元件模块的方法
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申请号： US14591068申请日： 2015-01-07
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公开(公告)号： US20150194270A1公开(公告)日： 2015-07-09
- 发明人: Akio Katsube , Hiroki Kitayama , Shinji Otani , Koji Murata
- 申请人： Murata Manufacturing Co., Ltd.
- 优先权： JP2014-002420 20140109
- 主分类号： H01G9/15
- IPC分类号： H01G9/15 ; H05K3/34 ; H05K1/18 ; H01G9/00 ; H01G9/012 ; H01G9/042
摘要：
A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
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