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9 条记录 (耗时 0.016 秒)

    Module and method of manufacturing the same
    1.
    发明授权
    Module and method of manufacturing the same 有权

    公开(公告)号：US11889625B2

    公开(公告)日：2024-01-30

    申请号：US17644446

    申请日：2021-12-15

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Akio Katsube

    IPC分类号： H05K1/14 ,  H01L23/12 ,  H05K1/02

    CPC分类号： H05K1/141 ,  H01L23/12 ,  H05K1/0224

    摘要： A module includes: a wiring board as a ceramic board having a first main surface; a first component and a second component that are mounted on the first main surface; at least one conductive member disposed on the first main surface between the first component and the second component; a sealing resin that seals the first component, the second component, and the conductive member; and a shield film that covers an upper surface and a side surface of the sealing resin and a side surface of the wiring board. The shield film is electrically connected to a ground conductor. The conductive member is formed by firing simultaneously with the wiring board, and electrically connected to the ground conductor and electrically connected to the shield film.

    Electronic component and method of manufacturing the same
    2.
    发明授权
    Electronic component and method of manufacturing the same 有权

    公开(公告)号：US11196405B2

    公开(公告)日：2021-12-07

    申请号：US15877746

    申请日：2018-01-23

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Kouji Ishikawa ,  Akio Katsube ,  Takehito Ishihara ,  Takeshi Ono

    IPC分类号： H03H9/10 ,  H03H3/02 ,  H03H9/05 ,  H03H9/17 ,  H03H9/15

    摘要： An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.

    Electronic component package and method for manufacturing the same
    3.
    发明授权
    Electronic component package and method for manufacturing the same 有权

    公开(公告)号：US11302593B2

    公开(公告)日：2022-04-12

    申请号：US16928090

    申请日：2020-07-14

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Yoshitaka Matsukawa ,  Yoichi Takagi ,  Akio Katsube ,  Yoshitaka Echikawa

    IPC分类号： H01L23/28 ,  H01L23/495 ,  H01L23/00 ,  H05K3/28 ,  H05K9/00

    摘要： An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

    Module and method of manufacturing module
    5.
    发明授权
    Module and method of manufacturing module 有权

    公开(公告)号：US11276631B2

    公开(公告)日：2022-03-15

    申请号：US16716647

    申请日：2019-12-17

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Yoshitaka Matsukawa ,  Akio Katsube

    IPC分类号： H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/16

    摘要： A module includes a substrate, a plurality of components on an upper surface of the substrate, a component on a lower surface of the substrate, solder balls on the lower surface, sealing resin layers stacked on the upper surface and the lower surface of the substrate, and a shield film covering a side surface and an upper surface of the module. Part of each solder ball is exposed from a surface of the sealing resin layer, and the exposed parts are shaped to protrude from the sealing resin layer. The module can be connected to a mother substrate by connecting the protruding parts of the solder balls. There are gaps between the solder balls and the sealing resin layer, and the occurrence of cracks in the solder balls can be suppressed by reducing stress arising from a difference in thermal expansion coefficient between the solder and the resin.

    Electronic component module and method for manufacturing electronic component module
    6.
    发明授权
    Electronic component module and method for manufacturing electronic component module 有权

    公开(公告)号：US11510311B2

    公开(公告)日：2022-11-22

    申请号：US17198489

    申请日：2021-03-11

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Issei Yamamoto ,  Akio Katsube

    IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K5/00

    摘要： An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).

    High frequency module
    7.
    发明授权
    High frequency module 有权

    公开(公告)号：US11178778B2

    公开(公告)日：2021-11-16

    申请号：US16728525

    申请日：2019-12-27

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Tadashi Nomura ,  Yuta Morimoto ,  Minoru Komiyama ,  Akio Katsube

    IPC分类号： H05K9/00 ,  H05K3/42

    摘要： A high frequency module 1a includes a wiring board 2, multiple components 3a to 3d mounted on an upper surface 2a of the wiring board 2, a shield component 4 mounted between the component 3b and the component 3c, a sealing resin layer 5 that covers the components 3a to 3d and the shield component 4, and a shield film 6 that covers the surface of the sealing resin layer. A recess 10 is formed in an upper surface 5a of the sealing resin layer 5 so as to expose the shield component 4. The recess 10 is formed within a region surrounded by edges of the sealing resin layer 5 so as not to reach the side surfaces of the sealing resin layer 5. The shield film 6 further covers wall surfaces 10a of the recess 10 and part of the shield component 4 exposed through the recess 10.