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公开(公告)号：US10749102B2
公开(公告)日：2020-08-18
申请号：US15680457
申请日：2017-08-18
发明人： Koji Nagahara , Muneyuki Daidai , Masahiro Saito , Atsushi Sugimasa , Hiroki Kitayama , Shigehisa Yago
IPC分类号： H01L41/09 , B32B7/12 , H01B1/22 , H01L41/313 , H03H9/10 , H03H3/02 , H03H9/05 , H01L41/08 , H01L41/047 , H01L41/053 , H01L23/00
摘要： A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 μm or less.
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公开(公告)号：US20170345995A1
公开(公告)日：2017-11-30
申请号：US15680457
申请日：2017-08-18
发明人： Koji Nagahara , Muneyuki Daidai , Masahiro Saito , Atsushi Sugimasa , Hiroki Kitayama , Shigehisa Yago
IPC分类号： H01L41/313 , H01L23/00 , H03H9/10 , H01L41/053
摘要： A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 μm or less.
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3.发明授权Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module 有权固体电解电容器，电子部件模块，固体电解电容器的制造方法及电子部件模块的制造方法公开(公告)号：US09472351B2
公开(公告)日：2016-10-18
申请号：US14591068
申请日：2015-01-07
发明人： Akio Katsube , Hiroki Kitayama , Shinji Otani , Koji Murata
CPC分类号： H01G9/15 , H01G9/0032 , H01G9/012 , H01G9/042 , H01G9/14 , H01L2924/181 , H05K1/181 , H05K3/3426 , H05K3/3494 , H05K2201/10015 , Y02P70/613 , Y10T29/417 , Y10T29/49144 , H01L2924/00012
摘要： A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
摘要翻译： 一种固体电解电容器，包括电容器元件; 外部树脂; 阳极引线端子; 和阴极引线端子。 阳极引线端子具有Cu基材和形成在其上的Au镀层，并且包括形成作为表面层的Au镀层的Au区域和不形成Au镀层的Cu区域 。 阴极引线端子包括基材，形成在基材上的作为阴极引线端子的表面层的镀覆层，电容器元件的阳极部分连接到阳极的Cu区域 引线终端。
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公开(公告)号：US09276194B2
公开(公告)日：2016-03-01
申请号：US13921247
申请日：2013-06-19
IPC分类号： H01L41/22 , H01L41/313 , C09J11/06 , C09J9/02 , C09J11/04 , F04B45/047 , H01L41/047 , H01L41/29 , H01G9/00 , C08K3/04 , C08K7/16 , H01L41/09
CPC分类号： H01L41/22 , C08K3/04 , C08K7/16 , C08K2201/011 , C09J9/02 , C09J11/04 , C09J11/06 , F04B45/047 , H01G9/0032 , H01G9/155 , H01L41/0478 , H01L41/0973 , H01L41/29 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126
摘要： A bonding method that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.
摘要翻译： 提供压电体和金属板之间的良好的导电性和接合性的接合方法包括金属板和压电体的电极，其中使用导电粘合剂彼此接合以提供导电性，导电粘合剂包括碳 具有纳米级平均粒径的黑色，并且具有包含在无溶剂或溶剂基树脂中的糊状形式，使得炭黑形成平均粒径为约1μm至约50μm的聚集体。 导电粘合剂被施加在金属板和压电体的电极之间，并且对金属板和压电体进行加热和加压，使得炭黑团聚体变形，从而硬化导电粘合剂。
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5.发明申请SOLID ELECTROLYTIC CAPACITOR, ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE 有权固体电解电容器，电子元件模块，用于制造固体电解电容器的方法和用于生产电子元件模块的方法公开(公告)号：US20150194270A1
公开(公告)日：2015-07-09
申请号：US14591068
申请日：2015-01-07
发明人： Akio Katsube , Hiroki Kitayama , Shinji Otani , Koji Murata
CPC分类号： H01G9/15 , H01G9/0032 , H01G9/012 , H01G9/042 , H01G9/14 , H01L2924/181 , H05K1/181 , H05K3/3426 , H05K3/3494 , H05K2201/10015 , Y02P70/613 , Y10T29/417 , Y10T29/49144 , H01L2924/00012
摘要： A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
摘要翻译： 一种固体电解电容器，包括电容器元件; 外用树脂; 阳极引线端子; 和阴极引线端子。 阳极引线端子具有Cu基材和形成在其上的Au镀层，并且包括形成作为表面层的Au镀层的Au区域和不形成Au镀层的Cu区域 。 阴极引线端子包括基材，形成在基材上的作为阴极引线端子的表面层的镀覆层，电容器元件的阳极部分连接到阳极的Cu区域 引线终端。
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