公开(公告)号：US11776754B2

公开(公告)日：2023-10-03

申请号：US17510549

申请日：2021-10-26

申请人： Murata Manufacturing Co., Ltd.

发明人： Shigeyuki Kuroda ,  Yusuke Arakawa ,  Chiaki Yamamoto ,  Shinji Otani

IPC分类号： H01G4/232 ,  H01G2/06 ,  H01G4/248 ,  H01G4/30

CPC分类号： H01G4/2325 ,  H01G2/065 ,  H01G4/248 ,  H01G4/30

摘要： An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.