- 专利标题: Electronic component and method of manufacturing electronic component
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申请号: US16930093申请日: 2020-07-15
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公开(公告)号: US11676757B2公开(公告)日: 2023-06-13
- 发明人: Shinji Otani , Yuuta Hoshino , Toshihiko Kobayashi , Tomotaka Gotohda
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto-fu
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto-fu
- 代理机构: Studebaker & Brackett PC
- 优先权: JP 2019147659 2019.08.09
- 主分类号: H01F17/04
- IPC分类号: H01F17/04 ; H01F27/32 ; H01F27/28 ; H01F41/061 ; H01F27/29 ; H01F41/12 ; H01F27/24
摘要:
An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.
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